Abstract: A light emitting unit is provided. The light emitting unit comprises a substrate, a light emitting element placed on a first surface of the substrate, a front panel covering the first surface, and a back panel placed on a second surface of the substrate, which is opposite to the first surface. An opening for extracting light emitted by the light emitting element is formed in the front panel, and the opening is formed to overlap a part of a light emitting surface of the light emitting element. The back panel has a thermal conductivity higher than that of the front panel, and includes a projecting portion that projects toward the first surface. The projecting portion is in contact with at least one of the first surface, the light emitting element, or the front panel.

Abstract: A light emitting unit is provided. The light emitting unit comprises a substrate, a light emitting element placed on a first surface of the substrate, a front panel covering the first surface, and a back panel placed on a second surface of the substrate, which is opposite to the first surface. An opening for extracting light emitted by the light emitting element is formed in the front panel, and the opening is formed to overlap a part of a light emitting surface of the light emitting element. The back panel has a thermal conductivity higher than that of the front panel, and includes a projecting portion that projects toward the first surface. The projecting portion is in contact with at least one of the first surface, the light emitting element, or the front panel.

Abstract: An illumination apparatus, comprising a light source unit, a rod-shaped light guide configured to guide light from the light source unit and emit the light from a light emitting surface, a covering member configured to contain the light guide, and a housing configured to contain the light source unit, the light guide, and the covering member, the light guide including a protruded portion configured to suppress a shift in a longitudinal direction, the covering member including an opening, and the housing including a receiving portion configured to receive the protruded portion of the light guide, wherein the protruded portion of the light guide is engaged with the receiving portion of the housing via the opening of the covering member.

Abstract: There is provided with an illumination apparatus. The illumination apparatus includes a light source. A rod-shaped light guide includes, as a first surface, a light emitting surface that emits light taken from the light source. A light guide cover is configured to cover a second surface different from the first surface among surfaces of the light guide. The second surface is a surface extending in a longitudinal direction of the light guide. The light guide cover is extended in the longitudinal direction. The light guide cover includes at least one finger holding the light guide.

Abstract: An illumination apparatus, comprising a light source unit, a rod-shaped light guide configured to guide light from the light source unit and emit the light from a light emitting surface, a covering member configured to contain the light guide, and a housing configured to contain the light source unit, the light guide, and the covering member, the light guide including a protruded portion configured to suppress a shift in a longitudinal direction, the covering member including an opening, and the housing including a receiving portion configured to receive the protruded portion of the light guide, wherein the protruded portion of the light guide is engaged with the receiving portion of the housing via the opening of the covering member.

Abstract: An image sensor unit includes: a plurality of light sources each including an LED chip; a plurality of light guides that are arranged in parallel to face incident surfaces on one side in a longitudinal direction for each of the plurality of light sources and that guide light from the plurality of light sources to a bill; an image sensor that converts light from the bill to an electric signal; a sensor substrate for mounting the image sensor; and a circuit board that is provided with the plurality of light sources on a same mounting surface and that is arranged on the sensor substrate on one side in the longitudinal direction of the plurality of light guides, wherein the sensor substrate includes a connection hole on one side in the longitudinal direction of the sensor substrate, and the circuit board is connected to the sensor substrate by connecting a connecting portion including a plurality of external connection pads to the connection hole.

Abstract: An image sensor unit includes: a plurality of light sources each including an LED chip; a plurality of light guides that are arranged in parallel to face incident surfaces on one side in a longitudinal direction for each of the plurality of light sources and that guide light from the plurality of light sources to a bill; an image sensor that converts light from the bill to an electric signal; a sensor substrate for mounting the image sensor; and a circuit board that is provided with the plurality of light sources on a same mounting surface and that is arranged on the sensor substrate on one side in the longitudinal direction of the plurality of light guides, wherein the sensor substrate includes a connection hole on one side in the longitudinal direction of the sensor substrate, and the circuit board is connected to the sensor substrate by connecting a connecting portion including a plurality of external connection pads to the connection hole.

Abstract: A semiconductor integrated-circuit device using the copper wiring having increased electromigration resistance, low resistivity, and a line width of 70 nm or less, is provided. The present invention is characterized by the annealing treatment wherein a copper wiring having a line width of 70 nm or less is heated with a heating rate of 1K to 10K per second, and then the temperature is constantly maintained for a prescribed time duration.

Abstract: A semiconductor integrated-circuit device using the copper wiring having increased electromigration resistance, low resistivity, and a line width of 70 nm or less, is provided. The present invention is characterized by the annealing treatment wherein a copper wiring having a line width of 70 nm or less is heated with a heating rate of 1 K to 10 K per second, and then the temperature is constantly maintained for a prescribed time duration.