Patents by Inventor Suguru Watanabe
Suguru Watanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11645838Abstract: An object detection system capable of tracking a moving object over a wide range, at a high processing speed, and with a high accuracy of recognition without increasing the number of image capturing apparatuses installed in one place is provided. A movement information acquisition unit acquires movement information, which is information regarding a moving object included in a first image captured by a first image capturing apparatus among a plurality of image capturing apparatuses arranged in positions different from one another. A search range determination unit determines a limited search range in a second image captured by a second image capturing apparatus among the plurality of image capturing apparatuses in accordance with the movement information. An object recognition unit performs recognition of the moving object for the search range in the second image.Type: GrantFiled: August 24, 2021Date of Patent: May 9, 2023Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Suguru Watanabe, Hiroya Matsubayashi, Daisaku Honda
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Publication number: 20230034867Abstract: A wiring substrate capable of providing a through electrode having an insulating layer with a small dielectric loss is provided. A wiring substrate (50) includes a silicon substrate (40) formed of silicon whose electrical resistivity is 1000 ?·cm or larger and a through electrode (100) formed in the silicon substrate (40). The through electrode (100) is formed of a central conductor (110) that penetrates through the silicon substrate (40) and an external conductor (120, 130, 140) formed around the central conductor (110). The central conductor (110) and the external conductor (120, 130, 140) are electrically insulated from each other by the silicon substrate (40).Type: ApplicationFiled: January 10, 2020Publication date: February 2, 2023Applicant: NEC CorporationInventors: Suguru WATANABE, Takanori Nishi
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Publication number: 20230008193Abstract: A quantum device capable of preventing contacts from being displaced is provided. A quantum device includes a quantum element in which a quantum circuit is provided, a socket including contacts and a housing, the contacts being in contact with a terminal of the quantum element, and the housing supporting the contacts, and a board including a board substrate. At least one of the housing and the board substrate includes a hole, another one of the housing and the board substrate includes a fixing part disposed inside the hole and a body part other than the fixing part, and the fixing part and the body part are integrally formed.Type: ApplicationFiled: June 27, 2022Publication date: January 12, 2023Applicant: NEC CorporationInventors: Suguru WATANABE, Kunihiko Ishihara, Katsumi Kikuchi
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Publication number: 20220406186Abstract: An information processing device includes: an data acquisition unit that acquires sensor data of an infrastructure sensor; an object information generation unit that generates object information based on the sensor data; a detection range estimation unit that estimates an object detection range based on at least partial information constituting the object information; an intersection determination unit that determines whether the objects intersect with each other within a predetermined time based on at least partial information constituting the object information; and a signal output unit that outputs an intersection avoidance signal when a position of a second object is outside the object detection range of a first object or when the position of the first object is outside the object detection range of the second object.Type: ApplicationFiled: April 28, 2022Publication date: December 22, 2022Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Suguru Watanabe, Manabu Nagai, Daisaku Honda
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Publication number: 20220367780Abstract: A superconducting device according to an example embodiment includes: a superconducting chip; an interposer on which the superconducting chip is mounted; a socket that is arranged to face the interposer and includes a movable pin and a housing supporting the movable pin; and a board that is arranged to face the socket and includes a connector serving as an input/output with respect to the outside. In the board, one end of a terminal of a via hole is electrically connected to one end of a terminal of the movable pin, and a hole diameter of the via hole is smaller than a diameter of a tip portion of the movable pin connected to the via hole.Type: ApplicationFiled: May 11, 2022Publication date: November 17, 2022Applicant: NEC CorporationInventors: Kunihiko ISHIHARA, Suguru Watanabe, Katsumi Kikuchi
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Publication number: 20220292958Abstract: An intersection control system includes: a storage storing multiple pieces of intersection control information that are different from each other, each piece of the intersection control information including multiple pieces of permitted trajectory information each of which indicates a permitted travel trajectory that a vehicle is permitted to follow, and a plurality of the travel trajectories not interfering with each other; and one or more processors configured to acquire multiple pieces of travel trajectory information each of which indicates a travel trajectory that each of a plurality of the vehicles located near the intersection follows when passing through the intersection, select a piece of the intersection control information that matches the pieces of the travel trajectory information from among the pieces of the intersection control information, and send the selected piece of the intersection control information to the vehicles located near the intersection.Type: ApplicationFiled: January 13, 2022Publication date: September 15, 2022Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Manabu NAGAI, Daisaku HONDA, Suguru WATANABE
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Patent number: 11340316Abstract: A magnetic sensor is provided with first and second magnetoresistive effect elements that can detect an external magnetic field. The first and second magnetoresistive effect elements are a plurality of layers of multilayer body including free layers where their magnetization directions vary due to the external magnetic field. Shapes of the first and second magnetoresistive effect elements viewed from the upper side in the lamination direction are different from each other. The first magnetoresistive effect element has a shape that can increase a slope of an output of the first magnetoresistive effect element relative to the change of the external magnetic field. The second magnetoresistive effect element has a shape that can decrease a slope of an output of the second magnetoresistive effect element relative to the change of the external magnetic field compared to the slope of the output of the first magnetoresistive effect element.Type: GrantFiled: June 30, 2020Date of Patent: May 24, 2022Assignee: TDK CorporationInventors: Kunihiro Ueda, Yoshiyuki Mizoguchi, Hiroshi Yamazaki, Suguru Watanabe
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Publication number: 20220067367Abstract: An object detection system capable of tracking a moving object over a wide range, at a high processing speed, and with a high accuracy of recognition without increasing the number of image capturing apparatuses installed in one place is provided. A movement information acquisition unit acquires movement information, which is information regarding a moving object included in a first image captured by a first image capturing apparatus among a plurality of image capturing apparatuses arranged in positions different from one another. A search range determination unit determines a limited search range in a second image captured by a second image capturing apparatus among the plurality of image capturing apparatuses in accordance with the movement information. An object recognition unit performs recognition of the moving object for the search range in the second image.Type: ApplicationFiled: August 24, 2021Publication date: March 3, 2022Applicant: Toyota Jidosha Kabushiki KaishaInventors: Suguru Watanabe, Hiroya Matsubayashi, Daisaku Honda
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Publication number: 20210408358Abstract: A quantum device (100) includes: an interposer (112); a quantum chip (111); a first connection part (130) that is provided between the interposer (112) and the quantum chip (111) and electrically connects a wiring layer of the interposer (112) to a wiring layer of the quantum chip (111); a predetermined signal line (w1) arranged in the wiring layer of the quantum chip (111); first shield wires (ws1) arranged in the wiring layer of the quantum chip (111) along the predetermined signal line (w1); a second shield wire (ws2) arranged in the wiring layer of the interposer (112); and a second connection part (150) that is provided between the interposer (112) and the quantum chip (111) so as to contact the first shield wires (ws1) and the second shield wire (ws2).Type: ApplicationFiled: June 23, 2021Publication date: December 30, 2021Applicant: NEC CorporationInventors: Kenji Nanba, Ayami Yamaguchi, Akira Miyata, Katsumi Kikuchi, Suguru Watanabe, Takanori Nishi, Hideyuki Satou
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Publication number: 20210407928Abstract: A quantum device (100) includes an interposer (112), a quantum chip (111) mounted on the interposer (112), and a shield part (150) provided so as to surround a quantum circuit region of the interposer (112) and the quantum chip (111). Accordingly, the quantum device (100) is able to prevent interference in the quantum circuit region due to exogenous noise.Type: ApplicationFiled: June 24, 2021Publication date: December 30, 2021Applicant: NEC CorporationInventors: Kenji NANBA, Ayami YAMAGUCHI, Akira MIYATA, Katsumi KIKUCHI, Suguru WATANABE, Takanori NISHI, Hideyuki SATOU
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Publication number: 20210408354Abstract: To provide a quantum device capable of preventing a connection member connecting a quantum chip with an interposer from being broken. The quantum device 1 includes at least one quantum chip 10, at least one interposer 20 on which the at least one quantum chip 10 is mounted, and a plurality of connection members 30 formed of a conductor. The plurality of connection members 30 are disposed between the quantum chip 10 and the interposer 20, and connect the quantum chip 10 with the interposer 20. The size of the connection member 30 on the surface along the mounting surface 20s of the interposer 20 is changed according to the position thereof relative to the quantum chip 10.Type: ApplicationFiled: June 24, 2021Publication date: December 30, 2021Applicant: NEC CorporationInventors: Katsumi KIKUCHI, Akira MIYATA, Suguru WATANABE, Takanori NISHI, Hideyuki SATOU, Kenji NANBA, Ayami YAMAGUCHI
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Patent number: 11209504Abstract: A magneto-resistive effect element includes a magnetization free layer, an intermediate layer, and a magnetization pinned layer. The magnetization free layer extends along a first plane. The intermediate layer extends along the first plane, and is stacked on the magnetization free layer. The magnetization pinned layer extends along the first plane, and is provided on side opposite to the magnetization free layer with the intermediate layer being interposed therebetween. Here, the magnetization free layer includes an end surface that has a maximum inclination angle of 42° or less relative to the first plane.Type: GrantFiled: June 9, 2020Date of Patent: December 28, 2021Assignee: TDK CORPORATIONInventors: Kenzo Makino, Suguru Watanabe, Yasushi Nishioka, Hirokazu Takahashi
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Publication number: 20210399193Abstract: A quantum device (100) includes: an interposer (112); a quantum chip (111); a first connection part (130) that is provided between the interposer (112) and the quantum chip (111) and electrically connects a wiring layer of the interposer (112) to a wiring layer of the quantum chip (111); and a second connection part (140) that is provided on a main surface of the interposer (112) where the first connection part (130) is arranged and is connected to a cooling plate (115).Type: ApplicationFiled: June 16, 2021Publication date: December 23, 2021Applicant: NEC CorporationInventors: Kenji NANBA, Ayami YAMAGUCHI, Akira MIYATA, Katsumi KIKUCHI, Suguru WATANABE, Takanori NISHI, Hideyuki SATOU
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Publication number: 20210399196Abstract: A quantum device capable of securing terminals for external connection is provided. A quantum device according to an example embodiment includes a quantum chip 10, an interposer 20 on which the quantum chip 10 is mounted, and a socket 40 disposed so as to be opposed to the interposer 20, the socket 40 comprising a movable pin 47 and a housing 45 supporting the movable pin 47, in which at least one end of the movable pin 47, which includes the one end and the other end opposite to the one end, is movable relative to the housing 45, the one end being in electrical contact with a terminal of the interposer 20, and the other end is in an electrical contact with a terminal of a board 50 on which a connector 51 is formed, the connector 51 being configured to serve as an external input/output.Type: ApplicationFiled: June 15, 2021Publication date: December 23, 2021Applicant: NEC CorporationInventors: Katsumi KIKUCHI, Akira MIYATA, Suguru WATANABE, Takanori NISHI, Hideyuki SATOU, Kenji NANBA, Ayami YAMAGUCHI
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Publication number: 20210399194Abstract: A quantum device (100) includes: an interposer (112); a quantum chip (111); and a connection part (130) that is provided between the interposer (112) and the quantum chip (111) and electrically connects a wiring layer of the interposer (112) to a wiring layer of the quantum chip (111), in which the connection part (130) includes: a plurality of pillars (131) arranged on a main surface of the interposer (112); and a metal film (132) provided on a surface of the plurality of pillars (131) in such a way that it contacts the wiring layer of the quantum chip (111) and the thickness of the metal film at outer peripheral parts of the tip of each of the plurality of pillars (131) becomes larger than the thickness of the metal film at a center part of the tip of each of the plurality of pillars (131).Type: ApplicationFiled: June 16, 2021Publication date: December 23, 2021Applicant: NEC CorporationInventors: Kenji NANBA, Ayami YAMAGUCHI, Akira MIYATA, Katsumi KIKUCHI, Suguru WATANABE, Takanori NISHI, Hideyuki SATOU
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Publication number: 20210399197Abstract: A quantum device according to an example embodiment includes a quantum chip 10, and an interposer 20 on which the quantum chip 10 is mounted, in which the interposer 20 includes a conductive wiring line CL1 electrically connected to the quantum chip 10, a mounting surface 21 of the interposer 20 on which the quantum chip 10 is mounted or an opposite surface 22 opposite to the mounting surface 21 includes a first area AR11 and a second area AR12 different from the first area AR11 as viewed in a direction perpendicular to the mounting surface 21 or the opposite surface 22, the conductive wiring line CL1 is disposed in the first area AR11 on the mounting surface 21 or the opposite surface 22, and a movable member 60 is in contact with the second area AR12 of the interposer 20.Type: ApplicationFiled: June 15, 2021Publication date: December 23, 2021Applicant: NEC CorporationInventors: Katsumi KIKUCHI, Akira MIYATA, Suguru WATANABE, Takanori NISHI, Hideyuki SATOU, Kenji NANBA, Ayami YAMAGUCHI
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Publication number: 20210399195Abstract: A quantum device capable of effectively cooling a quantum chip and an area (e.g., a space) therearound is provided. A quantum device 1 includes a quantum chip 10 and an interposer 20 on which the quantum chip 10 is located. The interposer 20 includes an interposer substrate 22 and an interposer wiring layer 30. The interposer wiring layer 30 is disposed on a surface 22a of the interposer substrate 22 on a side on which the quantum chip 10 is located. The interposer wiring layer 30 includes, in at least a part thereof, a superconducting material layer 32 formed of a superconducting material and a non-superconducting material layer 34 formed of a non-superconducting material.Type: ApplicationFiled: June 9, 2021Publication date: December 23, 2021Applicant: NEC CorporationInventors: Katsumi KIKUCHI, Akira MIYATA, Suguru WATANABE, Takanori NISHI, Hideyuki SATOU, Kenji NANBA, Ayami YAMAGUCHI
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Publication number: 20210398893Abstract: A quantum device capable of improving a cooling effect while securing the number of terminals is provided. A quantum device according to an example embodiment includes a quantum chip 10, and an interposer 20 on which the quantum chip 10 is mounted, in which the interposer 20 includes a conductive wiring line CL1 electrically connected to the quantum chip 10, and a metal film 70 disposed in a part of the interposer 20 that is in contact with a sample stage 30 having a cooling function, and a mounting surface 21 of the interposer 20 on which the quantum chip 10 is mounted or an opposite surface 22 opposite to the mounting surface 21 includes a first area AR11 and a second area AR12 different from the first area AR11 as viewed in a direction perpendicular to the mounting surface 21 or the opposite surface 22.Type: ApplicationFiled: June 11, 2021Publication date: December 23, 2021Applicant: NEC CorporationInventors: Katsumi KIKUCHI, Akira MIYATA, Suguru WATANABE, Takanori NISHI, Hideyuki SATOU, Kenji NANBA, Ayami YAMAGUCHI
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Patent number: 11181557Abstract: A current sensor includes a magnetic sensor device. The magnetic sensor device includes a magnetic sensor, a first magnetic layer, and a second magnetic layer in non-contact with the first magnetic layer. The magnetic sensor, the first magnetic layer, and the second magnetic layer are disposed across a virtual straight line and arranged in this order in a direction parallel to the virtual straight line. Different portions of magnetic flux generated by a current to be detected pass through the magnetic sensor, the first magnetic layer, and the second magnetic layer.Type: GrantFiled: August 13, 2018Date of Patent: November 23, 2021Assignee: TDK CORPORATIONInventors: Kenichi Takano, Yuta Saito, Suguru Watanabe
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Publication number: 20210333336Abstract: A magnetic field detection device includes a base, a first yoke, and a magneto-resistive effect element. The first yoke is provided on the base, and includes first and second principal surfaces each extending along a first plane, and a first end surface coupling the first and second principal surfaces. The magneto-resistive effect element is provided on the base, and includes a magnetization free layer disposed at a position overlapped with the first yoke in a first direction along the first plane. The first end surface includes an inverted tapered surface inclined relative to the first plane and extending closer to a center point of the magnetization free layer as being away from the base in a second direction orthogonal to the first plane. A distance from the center point to a first edge is shorter than a distance from the center point to a second edge.Type: ApplicationFiled: July 2, 2021Publication date: October 28, 2021Applicant: TDK CORPORATIONInventors: Yoshiaki TANAKA, Tetsuya HIRAKI, Kazuya WATANABE, Suguru WATANABE