Patents by Inventor Suixin Zhang

Suixin Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low cost electroless plating process for single chips and wafer parts and products obtained thereof
    Patent number: 6548327
    Abstract: The present invention is related to a method for electroless plating Nickel/Gold on aluminium bonding pads of single chips or wafer parts. This method result in uniformly plated singulated chips, single dice or wafer parts in a much more simple and cost-effective way. The proposed method comprises the steps of attaching to die or wafer part to a non-conductive adhesive or substrate.
    Type: Grant
    Filed: April 24, 2001
    Date of Patent: April 15, 2003
    Assignees: Interuniversitair Microelektronica Centrum, vzw, Universiteit Gent
    Inventors: Herbert De Pauw, Jan Vanfleteren, Suixin Zhang
  • Low cost electroless plating process for single chips and wafer parts and products obtained thereof
    Publication number: 20020001670
    Abstract: The present invention is related to a method for electroless plating Nickel/Gold on aluminium bonding pads of single chips or wafer parts. This method result in uniformly plated singulated chips, single dice or wafer parts in a much more simple and cost-effective way. The proposed method comprises the steps of attaching to die or wafer part to a non-conductive adhesive or substrate.
    Type: Application
    Filed: April 24, 2001
    Publication date: January 3, 2002
    Inventors: Herbert De Pauw, Jan Vanfleteren, Suixin Zhang
  • Process to create metallic stand-offs on an electronic circuit
    Patent number: 6036836
    Abstract: A process to create metallic stand-offs or studs on a printed circuit board (PCB). The process allows to obtain studs constituted by three successive layers of metal (Cu1, Cu2 and Cu3 or Ni) of which at least the two first layers are made of copper. The height of the so-created stand-off is sufficient to use it in the flip chip technology to assemble chips to a printed circuit board. The present process is implemented according either to the electro-plating (galvano-plating) or to the electrochemical-plating technique.
    Type: Grant
    Filed: December 19, 1997
    Date of Patent: March 14, 2000
    Inventors: Joris Antonia Franciscus Peeters, Louis Joseph Vandam, Koenraad Juliaan Georges Allaert, Ann Marie Ackaert, Andre Michel Van Calster, Maria Eugenie Andre Vereeken, Suixin Zhang, Johan De Baets, Bart Leo Alfons Maurice Vandevelde