Patents by Inventor Suk Chin Lee
Suk Chin Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11958750Abstract: Provided are a negative electrode active material which includes negative electrode active material particles which includes a silicon oxide (SiOx, 0<x?2); and at least one lithium silicate selected from Li2SiO3, Li2Si2O5, and Li4SiO4 in at least a part of the silicon oxide. The negative electrode active material particles have a maximum peak position by a Raman spectrum of more than 460 cm?1 and less than 500 cm?1. Also provided are a method of preparing the same, and a negative electrode and a lithium secondary battery including the negative electrode active material.Type: GrantFiled: May 20, 2021Date of Patent: April 16, 2024Assignee: SK On Co., Ltd.Inventors: Eunjun Park, Joon-Sup Kim, Gwi Ok Park, Jeongbae Yoon, Suk Chin Lee, Hansu Kim, Donghan Youn, Dong Jae Chung
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Patent number: 11655338Abstract: Provided are a polyimide-based film, a window cover film, and a display panel including the same. More particularly, a polyimide-based film having different surface properties of both surfaces is provided.Type: GrantFiled: June 16, 2021Date of Patent: May 23, 2023Assignees: SK Innovation Co., Ltd., SK ie technology Co., Ltd.Inventors: Jin Su Park, Min Sang Park, Hyun Joo Song, Suk Chin Lee
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Publication number: 20220037644Abstract: Provided are a negative electrode active material which includes negative electrode active material particles which includes a silicon oxide (SiOx, 0<x?2); and at least one lithium silicate selected from Li2SiO3, Li2Si2O5, and Li4SiO4 in at least a part of the silicon oxide. A signal generated in a region of 200 to 600 cm?1 according to a Raman spectrum is subjected to deconvolution into three peaks, which are set to peak A, peak B, and peak C from lowest to highest of an absolute value of a wavenumber. Also disclosed are a method of preparing the same, and a negative electrode and a lithium secondary battery including the negative electrode active material.Type: ApplicationFiled: July 23, 2021Publication date: February 3, 2022Inventors: Eunjun Park, Joon-Sup Kim, Gwi Ok Park, Jeongbae Yoon, Suk Chin Lee, Hansu Kim, Donghan Youn, Dong Jae Chung
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Publication number: 20210395460Abstract: Provided are a polyimide-based film, a window cover film, and a display panel including the same. More particularly, a polyimide-based film having different surface properties of both surfaces is provided.Type: ApplicationFiled: June 16, 2021Publication date: December 23, 2021Inventors: Jin Su Park, Min Sang Park, Hyun Joo Song, Suk Chin Lee
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Publication number: 20210363020Abstract: Provided are a negative electrode active material which includes negative electrode active material particles which includes a silicon oxide (SiOx, 0<x?2); and at least one lithium silicate selected from Li2SiO3, Li2Si2O5, and Li4SiO4 in at least a part of the silicon oxide. The negative electrode active material particles have a maximum peak position by a Raman spectrum of more than 460 cm?1 and less than 500 cm?1. Also provided are a method of preparing the same, and a negative electrode and a lithium secondary battery including the negative electrode active material.Type: ApplicationFiled: May 20, 2021Publication date: November 25, 2021Inventors: Eunjun Park, Joon-Sup Kim, Gwi Ok Park, Jeongbae Yoon, Suk Chin Lee, Hansu Kim, Donghan Youn, Dong Jae Chung
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Patent number: 11142669Abstract: An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.Type: GrantFiled: March 4, 2020Date of Patent: October 12, 2021Assignee: LG Chem, Ltd.Inventors: Hyun Jee Yoo, Yoon Gyung Cho, Suk Ky Chang, Jung Sup Shim, Suk Chin Lee, Kwang Jin Jeong
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Patent number: 10775240Abstract: Provided is a method for evaluating a secondary battery active material, comprising: preparing an active material including a core and a shell located on the surface of the core; forming an active material layer including the active material on at least one surface of a current collector; acquiring a Raman spectrum for the active material and calculating a Raman R value (ID/IG) therefrom; obtaining a frequency distribution chart for the Raman R value; obtaining a probability density function by normalizing the frequency distribution chart; and evaluating the shell of the active material by extracting a Raman R value (ID/IG) and/or a predetermined width indicating a maximum value from the graph of the probability density function.Type: GrantFiled: March 27, 2017Date of Patent: September 15, 2020Assignee: SK Innovation Co., Ltd.Inventors: Suk-Chin Lee, Hyo-Sang Kim, Jung-Hyun Yun
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Publication number: 20200220091Abstract: An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.Type: ApplicationFiled: March 4, 2020Publication date: July 9, 2020Inventors: Hyun Jee YOO, Yoon Gyung CHO, Suk Ky CHANG, Jung Sup SHIM, Suk Chin LEE, Kwang Jin JEONG
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Patent number: 10622573Abstract: An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.Type: GrantFiled: July 23, 2018Date of Patent: April 14, 2020Assignee: LG Chem, Ltd.Inventors: Hyun Jee Yoo, Yoon Gyung Cho, Suk Ky Chang, Jung Sup Shim, Suk Chin Lee, Kwang Jin Jeong
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Publication number: 20190186996Abstract: Provided is a method for evaluating a secondary battery active material, comprising: preparing an active material including a core and a shell located on the surface of the core; forming an active material layer including the active material on at least one surface of a current collector; acquiring a Raman spectrum for the active material and calculating a Raman R value (ID/IG) therefrom; obtaining a frequency distribution chart for the Raman R value; obtaining a probability density function by normalizing the frequency distribution chart; and evaluating the shell of the active material by extracting a Raman R value (ID/IG) and/or a predetermined width indicating a maximum value from the graph of the probability density function.Type: ApplicationFiled: March 27, 2017Publication date: June 20, 2019Inventors: Suk-Chin Lee, Hyo-Sang Kim, Jung-Hyun Yun
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Publication number: 20180342687Abstract: An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.Type: ApplicationFiled: July 23, 2018Publication date: November 29, 2018Inventors: Hyun Jee YOO, Yoon Gyung CHO, Suk Ky CHANG, Jung Sup SHIM, Suk Chin LEE, Kwang Jin JEONG
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Patent number: 10062855Abstract: An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.Type: GrantFiled: June 15, 2015Date of Patent: August 28, 2018Assignee: LG Chem, Ltd.Inventors: Hyun Jee Yoo, Yoon Gyung Cho, Suk Ky Chang, Jung Sup Shim, Suk Chin Lee, Kwang Jin Jeong
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Patent number: 9997813Abstract: Provided is a lithium air battery in which a catalyst layer of a cathode contacting an electrolyte and using oxygen in the air as an active material is coupled to a membrane through which lithium ions pass, such that even though charge and discharge of the battery is repeated, the catalyst layer may not be detached, and a microporous polyolefin-based film is applied to the battery, such that a water-based electrolyte solvent may be prevented from being evaporated, thereby preventing performance deterioration due to repetition of the charge and discharge of the lithium air battery, and extending life span.Type: GrantFiled: February 18, 2014Date of Patent: June 12, 2018Assignee: SK INNOVATION CO., LTD.Inventors: Myoung Gu Park, Kyong Sik Kim, Seong Ho Chun, Hee Young Sun, Suk Chin Lee, Jung Moon Sung
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Publication number: 20150287940Abstract: An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.Type: ApplicationFiled: June 15, 2015Publication date: October 8, 2015Inventors: Hyun Jee YOO, Yoon Gyung CHO, Suk Ky CHANG, Jung Sup SHIM, Suk Chin LEE, Kwang Jin JEONG
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Publication number: 20150236388Abstract: Provided is a lithium air battery in which a catalyst layer of a cathode contacting an electrolyte and using oxygen in the air as an active material is coupled to a membrane through which lithium ions pass, such that even though charge and discharge of the battery is repeated, the catalyst layer may not be detached, and a microporous polyolefin-based film is applied to the battery, such that a water-based electrolyte solvent may be prevented from being evaporated, thereby preventing performance deterioration due to repetition of the charge and discharge of the lithium air battery, and extending life span.Type: ApplicationFiled: February 18, 2014Publication date: August 20, 2015Applicant: SK Innovation Co., Ltd.Inventors: Myoung Gu PARK, Kyong Sik KIM, Seong Ho CHUN, Hee Young SUN, Suk Chin LEE, Jung Moon SUNG
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Patent number: 9105648Abstract: An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.Type: GrantFiled: May 28, 2014Date of Patent: August 11, 2015Assignee: LG Chem, Ltd.Inventors: Hyun Jee Yoo, Yoon Gyung Cho, Jung Sup Shim, Suk Chin Lee, Kwang Jin Jeong, Suk Ky Chang
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Publication number: 20140264302Abstract: An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.Type: ApplicationFiled: May 28, 2014Publication date: September 18, 2014Applicant: LG Chem, Ltd.Inventors: Hyun Jee YOO, Yoon Gyung CHO, Jung Sup SHIM, Suk Chin LEE, Kwang Jin JEONG, Suk Ky CHANG
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Patent number: 8742411Abstract: An adhesive film, and a product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable hot-melt adhesive layer including a curable resin and a moisture absorbent, and the curable hot-melt adhesive layer includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive layer.Type: GrantFiled: May 2, 2013Date of Patent: June 3, 2014Assignee: LG Chem, Ltd.Inventors: Hyun Jee Yoo, Yoon Gyung Cho, Jung Sup Shim, Suk Chin Lee, Kwang Jin Jeong, Suk Ky Chang
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Publication number: 20130240862Abstract: An adhesive film, and a product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable hot-melt adhesive layer including a curable resin and a moisture absorbent, and the curable hot-melt adhesive layer includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive layer.Type: ApplicationFiled: May 2, 2013Publication date: September 19, 2013Applicant: LG CHEM, LTD.Inventors: Hyun Jee Yoo, Yoon Gyung Cho, Jung Sup Shim, Suk Chin Lee, Kwang Jin Jeong, Suk Ky Chang