Patents by Inventor Sukju Kang

Sukju Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240181766
    Abstract: An alignment device includes: a first stage; a plurality of base plates disposed on the first stage and on which a material is placed; and a plurality of second stages disposed under the first stage, and connected to the plurality of base plates, respectively, and capable of aligning each of the plurality of base plates in X, Y, and ? directions.
    Type: Application
    Filed: July 26, 2023
    Publication date: June 6, 2024
    Inventors: TAEYOUNG PARK, SUKJU KANG, TETSUYA OKAMOTO, BYUNG MOO KIM, SANG CHEOL KIM, MYUNG-HUN OH, DONGGUL LEE, JUN-HEE LEE
  • Patent number: 11203175
    Abstract: A bonding device includes an upper chamber a pad with which a display substrate is pressable to a substrate; a stage between a lower chamber and the pad and including an opening through which air is introduced; a molding member between an upper chamber and the pad and surrounding the pad and the opening; and a support member connected to the stage The display substrate disposed on the molding member disposes first and second portions of the display substrate overlapping the planar and bending portions of the substrate, respectively, the molding member presses the first portion to the planar portion, and air introduced through the opening, expands the molding member to press the second portion to the bending portion.
    Type: Grant
    Filed: July 3, 2019
    Date of Patent: December 21, 2021
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Sukju Kang, Byung-moo Kim, Geunyoung Yu
  • Patent number: 10773505
    Abstract: A method of stably and precisely attaching substrates and an apparatus for stably and precisely attaching substrates, the method including: placing a substrate, attached with a release film, on a shuttle stage; peeling the release film from the substrate; a transferring unit lifting the substrate from the shuttle stage; a gas supplier spraying gas toward the substrate so that the substrate is convexly curved in a direction away from the gas supplier; the substrate transferred into a chamber by the transferring unit; placing the substrate on a main stage in the chamber; and attaching the substrate to an adherend.
    Type: Grant
    Filed: January 20, 2019
    Date of Patent: September 15, 2020
    Assignee: Samsung Display Co., Ltd.
    Inventors: Taejin Kim, Sukju Kang, Sangcheol Kim
  • Publication number: 20200009803
    Abstract: A bonding device includes an upper chamber a pad with which a display substrate is pressable to a substrate; a stage between a lower chamber and the pad and including an opening through which air is introduced; a molding member between an upper chamber and the pad and surrounding the pad and the opening; and a support member connected to the stage The display substrate disposed on the molding member disposes first and second portions of the display substrate overlapping the planar and bending portions of the substrate, respectively, the molding member presses the first portion to the planar portion, and air introduced through the opening, expands the molding member to press the second portion to the bending portion.
    Type: Application
    Filed: July 3, 2019
    Publication date: January 9, 2020
    Inventors: Sukju KANG, Byung-moo KIM, Geunyoung YU
  • Publication number: 20190322092
    Abstract: A method of stably and precisely attaching substrates and an apparatus for stably and precisely attaching substrates, the method including: placing a substrate, attached with a release film, on a shuttle stage; peeling the release film from the substrate; a transferring unit lifting the substrate from the shuttle stage; a gas supplier spraying gas toward the substrate so that the substrate is convexly curved in a direction away from the gas supplier; the substrate transferred into a chamber by the transferring unit; placing the substrate on a main stage in the chamber; and attaching the substrate to an adherend.
    Type: Application
    Filed: January 20, 2019
    Publication date: October 24, 2019
    Inventors: Taejin KIM, Sukju Kang, Sangcheol Kim