Abstract: Disclosed herein is a light emitting device package and a light emitting device package module.

Abstract: Disclosed herein are a semiconductor light emitting element and a backlight assembly including the same. The semiconductor light emitting element includes: a light emitting element chip including a first pad and a second pad and having an upper surface and a side surface; a wavelength conversion layer famed on the upper surface and the side surface of the light emitting element chip; a sidewall reflection part famed to be spaced apart from the side surface of the light emitting element chip; and a bottom surface reflection part famed to protrude at a lower portion of the sidewall reflection part. The sidewall reflection part and the bottom surface reflection part of the light emitting element are configured to reflect light in a direction in which the light penetrates through an upper surface of the wavelength conversion layer, the light being generated from the light emitting element chip.

Abstract: Disclosed herein is a light emitting device package and a light emitting device package module.

Abstract: Disclosed herein is a backlight unit including a flat substrate, a light emitting device mounted on the flat substrate, a light guide plate disposed on the flat substrate, and a reflector being inserted to be disposed in a through-hole and having a contacted reflection portion contacted to the light emitting device and a spaced reflection portion spaced from the light emitting device. The light guide plate may include an inner wall surface defining the through-hole which accommodates the light emitting device. The contacted reflection portion and the spaced reflection portion are configured to reflect light generated in the light emitting device to penetrate into the light guide plate through the inner wall surface.

Abstract: Disclosed herein is a light emitting device package and a light emitting device package module.

Abstract: Disclosed herein is a light emitting device package and a light emitting device package module.

Abstract: Disclosed herein is a light emitting device package strip capable of being used for a display application or an illumination application. The light emitting device package strip may include: a light emitting device package; and an upper adhesive sheet attached onto an upper surface of the light emitting device package so as to support the light emitting device package, wherein the light emitting device package includes: a flip-chip light emitting device having a first electrode pad and a second electrode pad; and a molding member formed to enclose side surfaces and an upper surface of the light emitting device such that the first electrode pad and the second electrode pad are exposed.

Abstract: Disclosed herein are a semiconductor light emitting element and a backlight assembly including the same. The semiconductor light emitting element includes: a light emitting element chip including a first pad and a second pad and having an upper surface and a side surface; a wavelength conversion layer famed on the upper surface and the side surface of the light emitting element chip; a sidewall reflection part famed to be spaced apart from the side surface of the light emitting element chip; and a bottom surface reflection part famed to protrude at a lower portion of the sidewall reflection part. The sidewall reflection part and the bottom surface reflection part of the light emitting element are configured to reflect light in a direction in which the light penetrates through an upper surface of the wavelength conversion layer, the light being generated from the light emitting element chip.

Abstract: Disclosed herein is a light emitting device package and a light emitting device package module.

Abstract: Disclosed herein is a backlight unit including a flat substrate, a light emitting device mounted on the flat substrate, a light guide plate disposed on the flat substrate, and a reflector being inserted to be disposed in a through-hole and having a contacted reflection portion contacted to the light emitting device and a spaced reflection portion spaced from the light emitting device. The light guide plate may include an inner wall surface defining the through-hole which accommodates the light emitting device. The contacted reflection portion and the spaced reflection portion are configured to reflect light generated in the light emitting device to penetrate into the light guide plate through the inner wall surface.

Abstract: Disclosed herein is a light emitting device package strip capable of being used for a display application or an illumination application. The light emitting device package strip may include: a light emitting device package; and an upper adhesive sheet attached onto an upper surface of the light emitting device package so as to support the light emitting device package, wherein the light emitting device package includes: a flip-chip light emitting device having a first electrode pad and a second electrode pad; and a molding member formed to enclose side surfaces and an upper surface of the light emitting device such that the first electrode pad and the second electrode pad are exposed.