Abstract: A capture system may capture client events for an application session. Some client events may contain display information associated with screen gestures. The screen gestures may be associated with any user input that changes how images are displayed during the application session. For example, the screen gestures may comprise one or more of a scroll gesture, a touch start gesture, a touch move gesture, a touch end gesture, and/or a pinch gesture. In another example the screen gesture may comprise a reorientation of a device operating in the application session. A replay system may replay the application session based on the captured client events to recreate images displayed during the application session in response to the screen gestures.

Abstract: A method for measuring recession in a wafer undergoing an asymmetrical ion mill process. The method includes the formation of first and second reference features and possibly a dummy feature. The reference features are constructed such that the location of the midpoint between them is unaffected by the asymmetrical ion mill. By measuring the distance between a portion of the dummy feature and the midpoint between the reference features, the amount of recession of the dummy feature can be measured. The measurement can be used to calculate the relative location of the flare to the read sensor rear edge through overlay information. By keeping the angles of the sides of the features steep (ie. nearly parallel with the direction in which the ion mill is asymmetrical) the amount of material consumed on each of the reference features is substantially equal and the midpoint between the reference features is substantially stationary.

Abstract: A method of making and using thin film calibration features is described. To fabricate a calibration standard according to the invention raised features are first formed from an electrically conductive material with a selected atomic number. A conformal thin film layer is deposited over the exposed sidewalls of the raised features. The sidewall material is selected to have a different atomic number and is preferably an nonconductive such as silicon dioxide or alumina. After the nonconductive material deposition, a controlled directional RIE process is used to remove the insulator layer deposited on the top and bottom surface of the lines and trenches. The remaining voids between the sidewalls of the raised features are filled with a conductive material. The wafer is then planarized with chemical mechanical planarization (CMP) to expose the nonconductive sidewall material on the surface. The nonconductive sidewall material will be fine lines embedded in conductive material.

Abstract: A method for forming metrology structures for a CMP process is described. A trench edge is formed in a base material or stack of materials which are preferably deposited as part of the process of fabricating the production structures on the wafer. A covering film of a second material with preferably with contrasting SEM properties is deposited over the trench edge in the base material. During CMP the covering film is preferentially worn away at the edge revealing the base material. The width of the base material which has been revealed is a measure of the progress of the CMP. Since the base material and the covering material are preferably selected to have contrasting images in an SEM, a CD-SEM can be used to precisely measure the CMP progress.

Abstract: A method and system of providing players with positive return in a gambling game. Tokens are won or lost in a manner that assures net positive return. Token value is determined based on the total number of outstanding tokens, or on the total number that have been issued in a predetermined time period, so that the total prize payout is predetermined and constant. In one embodiment, tokens act as lottery tickets, and prizes are awarded to winners of the lottery, so that a player's chance of winning the lottery is based on the percentage of outstanding tokens he or she possesses.

Abstract: Burn-in module 120 contains a lower socketless board 230 and an upper socketless board 240. Device sitting positions 210, or a high temperature resistant sheet 610 perform the socket functions of holding the device 400 laterally in place and routing test signals to the device 400. The lower socketless board 230 has electrical leads which carry test signals from the oven circuitry 140 to the plurality of device positions 210. The lower socketless board 230 is fastened to the upper socketless board 240 by a connector 220. If the upper socketless board 240 is modified to contain electrical leads then connector 220 may also act as an electrical connector and carry electrical signals from the lower socketless board 230 to the upper socketless board 240.