Patents by Inventor Sumanth Banda
Sumanth Banda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11817089Abstract: A collection of digital video files may contain a large amount of unstructured information in the form of spoken words encoded within audio tracks. The audio tracks are transcribed into digital text. Attributes are extracted from the digital text and mapped to a particular subject matter aspect. Attribute to aspect mappings provide a useful organization for the unstructured information. Furthermore, sentiment scores and trends for one or more aspects may be determined and displayed.Type: GrantFiled: April 5, 2021Date of Patent: November 14, 2023Assignee: Pyxis.AIInventors: Eric Owhadi, Bharat Naga Sumanth Banda, Narendra Goyal, Hong Ding
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Publication number: 20230264238Abstract: Methods of semiconductor processing may include performing a process on a semiconductor substrate. The semiconductor substrate may be seated on a substrate support positioned within a processing region of a semiconductor processing chamber. The methods may include flowing a first backside gas through the substrate support at a first flow rate. The methods may include removing the semiconductor substrate from the processing region of the semiconductor processing chamber. The methods may include performing a plasma cleaning operation within the processing region of the semiconductor processing chamber. The methods may include flowing a second backside gas through the substrate support at a second flow rate. At least a portion of the second backside gas may flow into the processing region through accesses in the substrate support.Type: ApplicationFiled: April 24, 2023Publication date: August 24, 2023Applicant: Applied Materials, Inc.Inventors: Stephen D. Prouty, Martin Perez-Guzman, Sumanth Banda, Rajinder Dhindsa, Alvaro Garcia de Gorordo
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Patent number: 11666952Abstract: Methods of semiconductor processing may include performing a process on a semiconductor substrate. The semiconductor substrate may be seated on a substrate support positioned within a processing region of a semiconductor processing chamber. The methods may include flowing a first backside gas through the substrate support at a first flow rate. The methods may include removing the semiconductor substrate from the processing region of the semiconductor processing chamber. The methods may include performing a plasma cleaning operation within the processing region of the semiconductor processing chamber. The methods may include flowing a second backside gas through the substrate support at a second flow rate. At least a portion of the second backside gas may flow into the processing region through accesses in the substrate support.Type: GrantFiled: March 6, 2020Date of Patent: June 6, 2023Assignee: Applied Materials, Inc.Inventors: Stephen D. Prouty, Martin Perez-Guzman, Sumanth Banda, Rajinder Dhindsa, Alvaro Garcia de Gorordo
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Patent number: 11651987Abstract: A substrate support pedestal comprises an electrostatic chuck, a cooling base, a gas flow passage, a porous plug, and a sealing member. The electrostatic chuck comprises body having a cavity. The cooling base is coupled to the electrostatic chuck via a bond layer. The gas flow passage is formed between a top surface of the electrostatic chuck and a bottom surface of the cooling base. The gas flow passage further comprises the cavity. The porous plug is positioned within the cavity to control the flow of gas through the gas flow passage. The sealing member is positioned in a groove formed in the cooling base and configured to form a seal between the cooling base and one or both of the porous plug and the body of the electrostatic chuck.Type: GrantFiled: February 15, 2022Date of Patent: May 16, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Stephen Donald Prouty, Andreas Schmid, Jonathan Simmons, Sumanth Banda
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Publication number: 20230077578Abstract: Methods of semiconductor processing may include forming a plasma of a carbon-containing material within a processing region of a semiconductor processing chamber. The methods may include depositing a carbon-containing material on a backside of a substrate housed within the processing region of the semiconductor processing chamber. A front side of the substrate may be maintained substantially free of carbon-containing material. The methods may include performing an etch process on the front-side of the substrate. The methods may include removing the carbon-containing material from the backside of the substrate.Type: ApplicationFiled: September 13, 2021Publication date: March 16, 2023Applicant: Applied Materials, Inc.Inventors: Leonard M. Tedeschi, Kartik Ramaswamy, Benjamin CE Schwarz, Changgong Wang, Vahid Firouzdor, Sumanth Banda, Teng-Fang Kou
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Publication number: 20220319504Abstract: A collection of digital video files may contain a large amount of unstructured information in the form of spoken words encoded within audio tracks. The audio tracks are transcribed into digital text. Attributes are extracted from the digital text and mapped to a particular subject matter aspect. Attribute to aspect mappings provide a useful organization for the unstructured information. Furthermore, sentiment scores and trends for one or more aspects may be determined and displayed.Type: ApplicationFiled: April 5, 2021Publication date: October 6, 2022Inventors: Eric Owhadi, Bharat Naga Sumanth Banda, Narendra Goyal, Hong Ding
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Publication number: 20220301913Abstract: Semiconductor substrate support assemblies may include an electrostatic chuck body having a substrate support surface. The electrostatic chuck body may define a plurality of protrusions extending from the substrate support surface. The assemblies may include an electrode embedded within the electrostatic chuck body. The electrode may define apertures through the electrode in line with the plurality of protrusions extending from the substrate support surface.Type: ApplicationFiled: March 18, 2021Publication date: September 22, 2022Applicant: Applied Materials, Inc.Inventors: Sumanth Banda, Vladimir Knyazik, Stephen D. Prouty
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Patent number: 11380572Abstract: A substrate support pedestal comprises an electrostatic chuck, a cooling base, a gas flow passage, a porous plug, and a sealing member. The electrostatic chuck comprises body having a cavity. The cooling base is coupled to the electrostatic chuck via a bond layer. The gas flow passage is formed between a top surface of the electrostatic chuck and a bottom surface of the cooling base. The gas flow passage further comprises the cavity. The porous plug is positioned within the cavity to control the flow of gas through the gas flow passage. The sealing member is positioned adjacent to the porous plug and is configured to form one or more of a radial seal between the porous plug and the cavity and an axial seal between the porous plug and the cooling base.Type: GrantFiled: April 23, 2020Date of Patent: July 5, 2022Assignee: Applied Materials, Inc.Inventors: Stephen Donald Prouty, Andreas Schmid, Jonathan Simmons, Sumanth Banda
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Publication number: 20220172975Abstract: A substrate support pedestal comprises an electrostatic chuck, a cooling base, a gas flow passage, a porous plug, and a sealing member. The electrostatic chuck comprises body having a cavity. The cooling base is coupled to the electrostatic chuck via a bond layer. The gas flow passage is formed between a top surface of the electrostatic chuck and a bottom surface of the cooling base. The gas flow passage further comprises the cavity. The porous plug is positioned within the cavity to control the flow of gas through the gas flow passage. The sealing member is positioned in a groove formed in the cooling base and configured to form a seal between the cooling base and one or both of the porous plug and the body of the electrostatic chuck.Type: ApplicationFiled: February 15, 2022Publication date: June 2, 2022Inventors: Stephen Donald PROUTY, Andreas SCHMID, Jonathan SIMMONS, Sumanth BANDA
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Patent number: 11130142Abstract: Embodiments of showerheads having a detachable gas distribution plate are provided herein. In some embodiments, a showerhead for use in a substrate processing chamber includes a body having a first side and an opposing second side; a gas distribution plate disposed proximate the second side of the body; and a clamp disposed about a peripheral edge of the gas distribution plate to removably couple the gas distribution plate to the body, wherein the body is electrically coupled to the gas distribution plate through the clamp.Type: GrantFiled: April 10, 2020Date of Patent: September 28, 2021Assignee: APPLIED MATERIALS, INC.Inventors: Dmitry Lubomirsky, Vladimir Knyazik, Hamid Noorbakhsh, Jason Della Rosa, Zheng John Ye, Jennifer Y. Sun, Sumanth Banda
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Publication number: 20210276056Abstract: Methods of semiconductor processing may include performing a process on a semiconductor substrate. The semiconductor substrate may be seated on a substrate support positioned within a processing region of a semiconductor processing chamber. The methods may include flowing a first backside gas through the substrate support at a first flow rate. The methods may include removing the semiconductor substrate from the processing region of the semiconductor processing chamber. The methods may include performing a plasma cleaning operation within the processing region of the semiconductor processing chamber. The methods may include flowing a second backside gas through the substrate support at a second flow rate. At least a portion of the second backside gas may flow into the processing region through accesses in the substrate support.Type: ApplicationFiled: March 6, 2020Publication date: September 9, 2021Applicant: Applied Materials, Inc.Inventors: Stephen D. Prouty, Martin Perez-Guzman, Sumanth Banda, Rajinder Dhindsa, Alvaro Garcia de Gorordo
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Patent number: 10975469Abstract: Described herein are articles, systems and methods where a plasma resistant coating is deposited onto a surface of a porous chamber component and onto pore walls within the porous chamber component using an atomic layer deposition (ALD) process. The porous chamber component may include a porous body comprising a plurality of pores within the porous body, the plurality of pores each comprising pore walls. The porous body is permeable to a gas. The plasma resistant coating may have a thickness of about 5 nm to about 3 ?m, and may protect the pore walls from erosion. The porous body with the plasma resistant coating remains permeable to the gas.Type: GrantFiled: March 17, 2017Date of Patent: April 13, 2021Assignee: APPLIED MATERIALS, INC.Inventors: Vahid Firouzdor, Sumanth Banda, Rajinder Dhindsa, Daniel Byun, Dana Marie Lovell
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Patent number: 10899892Abstract: A method for preparing a bonding component comprises mixing a first solution comprising an organofluorine monomer unit with a second solution comprising an organosilicon monomer unit to form, in-situ, a copolymer solution comprising a copolymer of an organofluorine polymer and an organosilicon polymer based on the organofluorine monomer unit and the organosilicon monomer unit. The method further comprises depositing the copolymer solution onto a body to form a film of the copolymer, and curing the film of the copolymer.Type: GrantFiled: December 20, 2019Date of Patent: January 26, 2021Assignee: Applied Materials, Inc.Inventors: Jennifer Y. Sun, Sumanth Banda
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Publication number: 20200373184Abstract: A substrate support pedestal comprises an electrostatic chuck, a cooling base, a gas flow passage, a porous plug, and a sealing member. The electrostatic chuck comprises body having a cavity. The cooling base is coupled to the electrostatic chuck via a bond layer. The gas flow passage is formed between a top surface of the electrostatic chuck and a bottom surface of the cooling base. The gas flow passage further comprises the cavity. The porous plug is positioned within the cavity to control the flow of gas through the gas flow passage. The sealing member is positioned adjacent to the porous plug and is configured to form one or more of a radial seal between the porous plug and the cavity and an axial seal between the porous plug and the cooling base.Type: ApplicationFiled: April 23, 2020Publication date: November 26, 2020Inventors: Stephen Donald PROUTY, Andreas SCHMID, Jonathan SIMMONS, Sumanth BANDA
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Patent number: 10847402Abstract: A method and structure for a bonding layer are disclosed. The bonding structure includes a first portion surrounding an opening in a body defining a dam thereabout. A second portion surrounds the first portion. The first portion is formed from a material resistant to degradation from exposure to a process gas. The second portion is formed from a different material than the material of the first portion. The first portion further includes one or more additives to change properties thereof.Type: GrantFiled: April 2, 2018Date of Patent: November 24, 2020Assignee: Applied Materials, Inc.Inventors: Wendell Glenn Boyd, Jr., Sumanth Banda
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Patent number: 10774436Abstract: A chamber component for a processing chamber comprises an article having impurities, an aluminum coating on a surface of the article, wherein the aluminum coating is substantially free from impurities, and an anodization layer over the aluminum coating. The anodization layer comprises aluminum oxide. The anodization layer further comprises a dense barrier layer portion and a porous columnar layer portion.Type: GrantFiled: November 13, 2017Date of Patent: September 15, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Jennifer Y. Sun, Sumanth Banda
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Patent number: 10745805Abstract: Described herein are articles, systems and methods where a plasma resistant coating is deposited onto a surface of a porous chamber component and onto pore walls within the porous chamber component using an atomic layer deposition (ALD) process. The porous chamber component may include a porous body comprising a plurality of pores within the porous body, the plurality of pores each comprising pore walls. The porous body is permeable to a gas. The plasma resistant coating may comprise a solid solution of Y2O3—ZrO2 and may have a thickness of about 5 nm to about 3 ?m, and may protect the pore walls from erosion. The porous body with the plasma resistant coating remains permeable to the gas.Type: GrantFiled: December 20, 2017Date of Patent: August 18, 2020Assignee: Applied Materials, Inc.Inventors: Vahid Firouzdor, Sumanth Banda, Rajinder Dhindsa, Daniel Byun, Dana Marie Lovell
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Publication number: 20200238303Abstract: Embodiments of showerheads having a detachable gas distribution plate are provided herein. In some embodiments, a showerhead for use in a substrate processing chamber includes a body having a first side and an opposing second side; a gas distribution plate disposed proximate the second side of the body; and a clamp disposed about a peripheral edge of the gas distribution plate to removably couple the gas distribution plate to the body, wherein the body is electrically coupled to the gas distribution plate through the clamp.Type: ApplicationFiled: April 10, 2020Publication date: July 30, 2020Inventors: Dmitry LUBOMIRSKY, Vladimir KNYAZIK, Hamid NOORBAKHSH, Jason DELLA ROSA, Zheng John YE, Jennifer Y. SUN, Sumanth BANDA
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Publication number: 20200140620Abstract: A method for preparing a bonding component comprises mixing a first solution comprising an organofluorine monomer unit with a second solution comprising an organosilicon monomer unit to form, in-situ, a copolymer solution comprising a copolymer of an organofluorine polymer and an organosilicon polymer based on the organofluorine monomer unit and the organosilicon monomer unit. The method further comprises depositing the copolymer solution onto a body to form a film of the copolymer, and curing the film of the copolymer.Type: ApplicationFiled: December 20, 2019Publication date: May 7, 2020Inventors: Jennifer Y. Sun, Sumanth Banda
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Patent number: 10625277Abstract: Embodiments of showerheads having a detachable gas distribution plate are provided herein. In some embodiments, a showerhead for use in a substrate processing chamber includes a body having a first side and an opposing second side; a gas distribution plate disposed proximate the second side of the body; and a clamp disposed about a peripheral edge of the gas distribution plate to removably couple the gas distribution plate to the body, wherein the body is electrically coupled to the gas distribution plate through the clamp.Type: GrantFiled: March 3, 2017Date of Patent: April 21, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Dmitry Lubomirsky, Vladimir Knyazik, Hamid Noorbakhsh, Jason Della Rosa, Zheng John Ye, Jennifer Y. Sun, Sumanth Banda