Patents by Inventor Sumit Guha

Sumit Guha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11979781
    Abstract: A method for selecting cell using a fifth generation (5G) user equipment (UE) is provided. The method includes detecting an event, when the 5G UE is camped on a serving cell; detecting availability of one or more voice over new radio (VoNR) cells and one or more non-VoNR cells in vicinity of the serving cell in response to detecting the event; based on the event, performing one of (i) selecting a VoNR cell when only one VoNR cell is available, (ii) identifying and selecting a VoNR cell based on a plurality of cell parameters, when a plurality of VoNR cells are available, and (iii) identifying and selecting a non-VoNR cell from the one or more non-VoNR cells, based on the plurality of cell parameters, when one of the one or more non-VoNR cells is available.
    Type: Grant
    Filed: March 16, 2022
    Date of Patent: May 7, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Shanthossh Nagarajan, Rishav Agarwal, Shouvik Guha, Sumit Verma
  • Publication number: 20230231884
    Abstract: Systems and methods for browser fingerprinting and control for private application protection include monitoring access to one or more private applications; performing one or more compliance checks on any of the user and the browser used to access the one or more private applications; and performing one or more actions based on a result of the one or more compliance checks. These steps are performed in order to prevent users from accessing private applications via compromised or vulnerable browsers.
    Type: Application
    Filed: March 24, 2023
    Publication date: July 20, 2023
    Inventors: Pooja Deshmukh, Kanti Varanasi, Apoorva Pasrija, Nikhil Bhatia, Sumit Guha
  • Patent number: 8441942
    Abstract: A method and system of loop detection for improving network performance and data integrity over a communications network are disclosed. A process is capable of transmitting a diagnostic packet stream from a source object to a destination object. The diagnostic packet stream, in one embodiment, is an IEEE 802.1ag continuity check message and is transported to a destination object periodically across a communications network. Upon receipt of a returning packet stream from the destination object, the process broadcasts loop detection at a port level in response to the comparison between the returning packet stream and the diagnostic packet stream.
    Type: Grant
    Filed: December 3, 2008
    Date of Patent: May 14, 2013
    Assignee: Tellabs Operations Inc.
    Inventors: Sumit Guha, Tejeswar Pichuka, Sanjoy Bardhan, Pawan K. Singal
  • Publication number: 20020023719
    Abstract: An improvement to chemical-mechanical polishing. The improvement includes using a buffing pad having a geometrically optimized shape along with optimizing the buff head diameter, offset O and overlay L. In one embodiment, the buffing pad is smaller than the buff head and is mounted eccentrically. In another embodiment, the buffing pad has a generally square outer shape. In another embodiment, the buff pad is circular and is the same size as the circular buff head. In another embodiment, the buffing pad has at least three radially extending arms. The optimal configuration is determined iteratively for a selected process by changing the buffing pad shape, buff head diameter, the offset and the overlay. For example, increasing the offset generally tends to increase the removal rate toward the edge of the wafer. Increasing the overlap generally tends to increase the removal rate toward the center of the wafer.
    Type: Application
    Filed: August 30, 2001
    Publication date: February 28, 2002
    Applicant: SpeedFam-IPEC Corporation
    Inventors: Yakov Epshteyn, Sumit Guha, Yehiel Gotkis, William J. Bellamak
  • Publication number: 20010000497
    Abstract: An improvement to chemical-mechanical polishing. The improvement includes using a buffing pad having a geometrically optimized shape along with optimizing the buff head diameter, offset O and overlay L. In one embodiment, the buffing pad is smaller than the buff head and is mounted eccentrically. In another embodiment, the buffing pad has a generally square outer shape. In another embodiment, the buff pad is circular and is the same size as the circular buff head. In another embodiment, the buffing pad has at least three radially extending arms. The optimal configuration is determined iteratively for a selected process by changing the buffing pad shape, buff head diameter, the offset and the overlay. For example, increasing the offset generally tends to increase the removal rate toward the edge of the wafer. Increasing the overlap generally tends to increase the removal rate toward the center of the wafer.
    Type: Application
    Filed: December 13, 2000
    Publication date: April 26, 2001
    Inventors: Yakov Epshteyn, Sumit Guha, Yehiel Gotkis, William J. Bellamak