Patents by Inventor Sun-Jun Kwon

Sun-Jun Kwon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11999841
    Abstract: The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. The thermoplastic resin composition includes a first propylene-ethylene copolymer, a second propylene-ethylene copolymer, a thermoplastic elastomer, an inorganic filler, and a sodium-phosphate-based nucleating agent as appropriate, and thus a molded article produced therefrom can exhibit improved mechanical rigidity, impact resistance, and dimensional stability. Even when formed to a low thickness for weight reduction, the molded article can be imparted with excellent processability, high tensile strength, a high flexural modulus, and high impact strength.
    Type: Grant
    Filed: July 6, 2022
    Date of Patent: June 4, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, GS CALTEX CORPORATION
    Inventors: Jin Young Yoon, Hee Joon Lee, Dong Eun Cha, Sun Jun Kwon, Chun Ho Park, Seung Ryong Jeong, Seok Jin Yong, Hyung Tak Lee
  • Patent number: 11993702
    Abstract: The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. Specifically, the thermoplastic resin composition includes a base resin including at least two polypropylene-based resins having different melt indexes, an elastomer having a melt index (190° C., 2.16 kg) of 20 g/10 min to 35 g/10 min as measured by ASTM D1238, and inorganic particles, and has a flexural modulus (FM) of 2,500 MPa or more and a coefficient of linear thermal expansion (CLTE) of 60 ?m/m° C. or less.
    Type: Grant
    Filed: July 6, 2022
    Date of Patent: May 28, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, LOTTE CHEMICAL CORPORATION
    Inventors: Jin Young Yoon, Hee Joon Lee, Dong Eun Cha, Sun Jun Kwon, Chun Ho Park, Seung Ryong Jeong, Kyung Hwan Lim, Eun Hwa Jang
  • Publication number: 20240147315
    Abstract: A method of a terminal may comprise: receiving, from a CU of a base station, configuration information of one or more candidate cells and configuration information for measurement; performing L1 measurement on the candidate cells based on the configuration information for measurement; acquiring uplink synchronization for the candidate cells by performing an uplink synchronization management procedure for the candidate cells based on the configuration information of the candidate cells; reporting a result of the L1 measurement to a DU of the base station; receiving, from the DU of the base station, information on a target cell, being the target cell to switch among the candidate cells, based on the result of the L1 measurement; and applying the uplink synchronization acquired through the uplink synchronization management procedure to the target cell.
    Type: Application
    Filed: November 2, 2023
    Publication date: May 2, 2024
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Hyun Seo PARK, Yong Jin KWON, Yun Joo KIM, Han Jun PARK, Jung Bo SON, An Seok LEE, Yu Ro LEE, Sun Cheol CHANG, Heesoo LEE
  • Patent number: 11905402
    Abstract: The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. Specifically, the thermoplastic resin composition includes a polypropylene-based resin having an isotactic pentad fraction of 96% or more as measured by 13C-NMR, a thermoplastic elastomer, an inorganic filler having an average particle diameter of 0.1 ?m to 5 ?m, and a compatibilizer, and has a flexural modulus of 2,500 MPa or more and a coefficient of linear thermal expansion of 60 ?m/m·° C. or less.
    Type: Grant
    Filed: July 6, 2022
    Date of Patent: February 20, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, HANWHA TOTAL ENERGIES PETROCHEMICAL CO., LTD.
    Inventors: Jin Young Yoon, Hee Joon Lee, Dong Eun Cha, Sun Jun Kwon, Chun Ho Park, Seung Ryong Jeong, Jeong Gil Ko, Yoon Hwan Lee
  • Patent number: 11884802
    Abstract: The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. Specifically, the thermoplastic resin composition includes a polypropylene composite resin including high-crystalline polypropylene and the like, an elastomer, and an inorganic filler.
    Type: Grant
    Filed: July 6, 2022
    Date of Patent: January 30, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, HDC HYUNDAI ENGINEERING PLASTICS CO., LTD.
    Inventors: Jin Young Yoon, Hee Joon Lee, Dong Eun Cha, Sun Jun Kwon, Chun Ho Park, Seung Ryong Jeong, Jin Bo Chae
  • Patent number: 11820884
    Abstract: The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. Specifically, the thermoplastic resin composition includes a first polypropylene resin having crystallinity of 50% to 80%, a second polypropylene resin having a coefficient of linear thermal expansion of 70 ?m/m·° C. to 90 ?m/m·° C., an elastomer, and an inorganic filler.
    Type: Grant
    Filed: July 6, 2022
    Date of Patent: November 21, 2023
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, DAE HA CO., LTD.
    Inventors: Jin Young Yoon, Hee Joon Lee, Dong Eun Cha, Sun Jun Kwon, Chun Ho Park, Seung Ryong Jeong, Kwan Suk Ryu, Tae Kyung Lee
  • Publication number: 20230024056
    Abstract: The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. The thermoplastic resin composition includes a first propylene-ethylene copolymer, a second propylene-ethylene copolymer, a thermoplastic elastomer, an inorganic filler, and a sodium-phosphate-based nucleating agent as appropriate, and thus a molded article produced therefrom can exhibit improved mechanical rigidity, impact resistance, and dimensional stability. Even when formed to a low thickness for weight reduction, the molded article can be imparted with excellent processability, high tensile strength, a high flexural modulus, and high impact strength.
    Type: Application
    Filed: July 6, 2022
    Publication date: January 26, 2023
    Inventors: Jin Young Yoon, Hee Joon Lee, Dong Eun Cha, Sun Jun Kwon, Chun Ho Park, Seung Ryong Jeong, Seok Jin Yong, Hyung Tak Lee
  • Publication number: 20230016858
    Abstract: The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. Specifically, the thermoplastic resin composition includes a first polypropylene resin having crystallinity of 50% to 80%, a second polypropylene resin having a coefficient of linear thermal expansion of 70 ?m/m° C. to 90 ?m/m° C., an elastomer, and an inorganic filler.
    Type: Application
    Filed: July 6, 2022
    Publication date: January 19, 2023
    Inventors: Jin Young Yoon, Hee Joon Lee, Dong Eun Cha, Sun Jun Kwon, Chun Ho Park, Seung Ryong Jeong, Kwan Suk Ryu, Tae Kyung Lee
  • Publication number: 20230020121
    Abstract: The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. Specifically, the thermoplastic resin composition includes a polypropylene composite resin including high-crystalline polypropylene and the like, an elastomer, and an inorganic filler.
    Type: Application
    Filed: July 6, 2022
    Publication date: January 19, 2023
    Inventors: Jin Young Yoon, Hee Joon Lee, Dong Eun Cha, Sun Jun Kwon, Chun Ho Park, Seung Ryong Jeong, Jin Bo Chae
  • Publication number: 20230017798
    Abstract: The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. Specifically, the thermoplastic resin composition includes a base resin including at least two polypropylene-based resins having different melt indexes, an elastomer having a melt index (190° C., 2.16 kg) of 20 g/10 min to 35 g/10 min as measured by ASTM D1238, and inorganic particles, and has a flexural modulus (FM) of 2,500 MPa or more and a coefficient of linear thermal expansion (CLTE) of 60 ?m/m° C. or less.
    Type: Application
    Filed: July 6, 2022
    Publication date: January 19, 2023
    Inventors: Jin Young Yoon, Hee Joon Lee, Dong Eun Cha, Sun Jun Kwon, Chun Ho Park, Seung Ryong Jeong, Kyung Hwan Lim, Eun Hwa Jang
  • Publication number: 20230020477
    Abstract: The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. Specifically, the thermoplastic resin composition includes a polypropylene-based resin having an isotactic pentad fraction of 96% or more as measured by 13C-NMR, a thermoplastic elastomer, an inorganic filler having an average particle diameter of 0.1 ?m to 5 ?m, and a compatibilizer, and has a flexural modulus of 2,500 MPa or more and a coefficient of linear thermal expansion of 60 ?m/m·° C. or less.
    Type: Application
    Filed: July 6, 2022
    Publication date: January 19, 2023
    Inventors: Jin Young Yoon, Hee Joon Lee, Dong Eun Cha, Sun Jun Kwon, Chun Ho Park, Seung Ryong Jeong, Jeong Gil Ko, Yoon Hwan Lee
  • Patent number: 10569807
    Abstract: A side sill molding may include a front plate configured to have a length corresponding to a length of a side sill, a top plate configured to be connected to an upper end of the front plate, a bent part configured to be connected to the top plate and have a clip part formed at an inner side thereof, and a rib configured to connect a lower end of the clip part and a preset portion of the front plate.
    Type: Grant
    Filed: December 1, 2017
    Date of Patent: February 25, 2020
    Assignees: Hyundai Motor Company, Kia Motors Corporation, LG Hausys, Ltd.
    Inventors: Yong-Won Jeong, Seung-Mok Lee, Sun-Jun Kwon, Chun-Ho Park, Guo-Dong Jeong, Hyun-Seung Hwang
  • Publication number: 20180178847
    Abstract: A side sill molding may include a front plate configured to have a length corresponding to a length of a side sill, a top plate configured to be connected to an upper end of the front plate, a bent part configured to be connected to the top plate and have a clip part formed at an inner side thereof, and a rib configured to connect a lower end of the clip part and a preset portion of the front plate.
    Type: Application
    Filed: December 1, 2017
    Publication date: June 28, 2018
    Inventors: Yong-Won Jeong, Seung-Mok Lee, Sun-Jun Kwon, Chun-Ho Park, Guo-Dong Jeong, Hyun-Seung Hwang