Patents by Inventor Sun Kuen Wong

Sun Kuen Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8651159
    Abstract: A die bonder is provided comprising a bond head including a collet for picking up a die and bonding the die at a bonding site. The die bonder further comprises a first motor which is connected to the collet by a shaft for driving the collet in driving directions towards and away from the bonding site and a second motor which is connected to the bond head for driving the bond head in directions parallel to the driving directions of the first motor. A rotary motor is also operatively connected to the collet for rotating the collet about a rotational axis that is parallel to the driving directions of the first motor. The shaft is slidably connected to the rotary motor and is slidable relative to the rotary motor when it is driven by the first motor to move.
    Type: Grant
    Filed: June 12, 2009
    Date of Patent: February 18, 2014
    Assignee: ASM Assembly Automation Ltd
    Inventors: Sun Kuen Wong, Hon Chiu Hui, Yin Fun Ng
  • Publication number: 20100314050
    Abstract: A die bonder is provided comprising a bond head including a collet for picking up a die and bonding the die at a bonding site. The die bonder further comprises a first motor which is connected to the collet by a shaft for driving the collet in driving directions towards and away from the bonding site and a second motor which is connected to the bond head for driving the bond head in directions parallel to the driving directions of the first motor. A rotary motor is also operatively connected to the collet for rotating the collet about a rotational axis that is parallel to the driving directions of the first motor. The shaft is slidably connected to the rotary motor and is slidable relative to the rotary motor when it is driven by the first motor to move.
    Type: Application
    Filed: June 12, 2009
    Publication date: December 16, 2010
    Inventors: Sun Kuen WONG, Hon Chiu HUI, Yin Fun NG
  • Patent number: 6949733
    Abstract: The position of a working point relative to a working space, such as a working point of a carriage on a gantry beam of an XY positioning table, is determined by measuring at least two sets of displacements. A first set of displacements, of the working point relative to an intermediate component, such as the gantry beam, includes a relatively large displacement (X) in a first linear degree of freedom and relatively small displacements (Y1?, Y2?), in at least two of the five degrees of freedom other than the first. The second set of displacements, of the intermediate component relative to the working space, includes a relatively large displacement (Y1, Y2), in a second linear degree of freedom, and relatively small displacements (X1?, X2?), in at least two of the five degrees of freedom other than the second.
    Type: Grant
    Filed: March 10, 2003
    Date of Patent: September 27, 2005
    Assignee: ASM Technology Singapore Pte Ltd
    Inventors: Gary Peter Widdowson, Sun Kuen Wong, Ajit Gaunekar
  • Publication number: 20040178327
    Abstract: The position of a working point relative to a working space, such as a working point of a carriage on a gantry beam of an XY positioning table, is determined by measuring at least two sets of displacements. A first set of displacements, of the working point relative to an intermediate component, such as the gantry beam, includes a relatively large displacement (X) in a first linear degree of freedom and relatively small displacements (Y1′, Y2′), in at least two of the five degrees of freedom other than the first. The second set of displacements, of the intermediate component relative to the working space, includes a relatively large displacement (Y1, Y2), in a second linear degree of freedom, and relatively small displacements (X1′, X2′), in at least two of the five degrees of freedom other than the second.
    Type: Application
    Filed: March 10, 2003
    Publication date: September 16, 2004
    Applicant: ASM Technology Singapore Pte Ltd
    Inventors: Gary Peter Widdowson, Sun Kuen Wong, Ajit Gaunekar
  • Patent number: 6616031
    Abstract: An apparatus and method are disclosed for providing bond force in a die bonding operation. The apparatus comprises means such as a compression spring for generating a primary bond force, and additionally means such as a voice coil for generating a compensatory bond force. The compensatory bond force can be controlled by varying the current to the voice coil so as to add to or reduce the bond force whereby a bond force comprising the sum of the primary bond force and the compensatory bond force may be controlled.
    Type: Grant
    Filed: July 17, 2001
    Date of Patent: September 9, 2003
    Assignee: ASM Assembly Automation Limited
    Inventors: Sun Kuen Wong, Ming Yeung Luke Wan
  • Publication number: 20030015569
    Abstract: An apparatus and method are disclosed for providing bond force in a die bonding operation. The apparatus comprises means such as a compression spring for generating a primary bond force, and additionally means such as a voice coil for generating a compensatory bond force. The compensatory bond force can be controlled by varying the current to the voice coil so as to add to or reduce the bond force whereby a bond force comprising the sum of the primary bond force and the compensatory bond force may be controlled.
    Type: Application
    Filed: July 17, 2001
    Publication date: January 23, 2003
    Inventors: Sun Kuen Wong, Ming Yeung Luke Wan