Abstract: An organic light-emitting display apparatus for selectively realizing circular polarization according to external light conditions, including a substrate; an organic light-emitting device on the substrate; a sealing member on the organic light-emitting device; a phase retardation layer on a surface of the substrate, the organic light-emitting device, or the sealing member; and a linear polarization layer on another surface of the substrate, the organic light-emitting device, or the sealing member, wherein the linear polarization layer is located to be closer to a source of external light than the phase retardation layer, and wherein the linear polarization layer comprises a photochromic material.

Abstract: Thin film encapsulation for a flat panel display device and a method of manufacturing the thin film encapsulation structure. The thin film encapsulation structure of the flat panel display device includes thin film layers covering a display unit formed on a substrate, wherein the thin film layers comprise a plurality of inorganic layers and a hexamethyldisiloxane (HMDSO) layer interposed between the inorganic layers. Accordingly, as multiple layers of the thin film encapsulation structure may be formed in a single chamber, the manufacturing process may be simplified, and also, as the HMDSO layer, which is flexible, absorbs stresses, a risk of cracks occurring may also be reduced.

Abstract: Provided is a flat panel display apparatus including a sealant which has a small effective width and is able to effectively attach a substrate and an encapsulation substrate. The flat panel display apparatus includes the substrate, a display unit disposed on the substrate, the encapsulation substrate disposed facing the substrate so that the display unit is disposed on inner side of the encapsulation substrate, and the sealant attaching the substrate and the encapsulation substrate, wherein an end surface of the sealant facing the substrate contacts a silicon oxide layer disposed on the substrate.

Abstract: Provided are an organic light emitting display device and a method of manufacturing the same. The organic light emitting display device includes a substrate; an sealing substrate facing the substrate, an organic light emitting unit disposed between the substrate and the sealing substrate and having a plurality of organic light emitting devices emitting light, and a plurality of grooves formed in a light extracting surface of the organic light emitting display device through which the light is emitted to the outside. In one embodiment, the grooves are formed on the sealing substrate, and in another embodiment, the grooves are formed on the substrate.

Abstract: An organic light emitting display (OLED) device and a method of manufacturing the same, the OLED device including a first substrate having an organic emission unit on a surface thereof, a second substrate above the first substrate, an inorganic sealing member between the first substrate and the second substrate, the inorganic sealing member bonding the first substrate and the second substrate. and a filler, the filler filling a space between the first substrate and the second substrate, wherein a volume of the filler is greater than a volume of a space between the first substrate, the second substrate, and the inorganic sealing member prior to bonding the first substrate and the second substrate.

Abstract: Provided are display panel, method of manufacturing the same, and frit composition used in the display panel. A display panel comprising: a first substrate, a second substrate facing the first substrate and a frit bonding the first substrate and the second substrate together, wherein the frit has an optical density of more than about 0.0683/?m for laser light of any one wavelength in a wavelength range of about 760 to about 860 nm.

Abstract: Provided are an organic light-emitting display device and a manufacturing method of the organic light emitting display device. The organic light-emitting display device includes: a substrate; a display unit formed on the substrate; an encapsulation substrate formed above the display unit; a first sealant bonding the substrate and the encapsulation substrate; a filler formed between the substrate and the encapsulation substrate; and a second sealant interposed between the first sealant and the filler so as to separate the filler from the first sealant, wherein a distance of a portion of the substrate and the encapsulation substrate is smaller than that of other portions of the substrate and the encapsulation substrate. Accordingly, penetration of impurities, such as oxygen or water, from the outside into the organic light emitting display device is prevented.

Abstract: Embodiments of the disclosure provide an organic light-emitting display device and a manufacturing method of the organic light-emitting display device. The organic light-emitting display device includes a substrate; a display unit formed on the substrate; an encapsulation substrate formed above the display unit; a first sealant bonding the substrate and the encapsulation substrate; and a filler disposed between the substrate and the encapsulation substrate. In addition, a second sealant is provided to separate the first sealant and the filler. The adhesive strength of the second sealant is greater than an adhesive strength of the filler.

Abstract: A sealing filler for an organic light emitting device display includes a siloxane polymer having a surface tension of about 20 dyn/cm or less. The siloxane polymer may be represented by where each of R1 to R10 is independently a non-polar substituent, and n ranges from 20 to 50.

Abstract: Disclosed are light emitting display and method of manufacturing the same. The light emitting display according to the present embodiments includes a first substrate including a plurality of light emitting devices and a pad portion, all of which are formed therein; a second substrate disposed to face the light emitting devices; and a bonding layer bonded to the light emitting devices and the second substrate, wherein a stepped portion is formed at a predetermined depth in an edge of the second substrate that is adjacent to the pad portion, and the bonding layer is extended to the stepped portion. Since the bonding layer is not bonded to the pad portion due to the depth of the stepped portion when the second substrate is bonded to the first substrate, poor electrical contact may be prevented, and it easy to remove the encapsulation substrate to expose the pad portion.

Abstract: An organic light emitting display and a method of manufacturing the same are disclosed. In one embodiment, the display includes i) a first substrate, ii) a second substrate facing the first substrate and iii) a display unit formed between the first and second substrates and including organic light emitting diodes (OLEDs). The display further includes i) a sealant formed between the first and second substrates so as to substantially surround the display unit, wherein the first and second substrates are bonded to each other via the sealant and ii) a filler formed at an inner side of the sealant to cover the display unit, and wherein a magnetic substance is dispersed in the filler.

Abstract: Disclosed are a novel, high-yield method for preparing entecavir and intermediates used therein.

Abstract: An organic light emitting diode display having a display panel comprising a first substrate and a second substrate disposed facing the first substrate, the first substrate comprising a display area and a pad area, a buffer member disposed on one surface of the first substrate, the buffering member having a buffer layer and an adhesive layer formed on at least one surface of the buffer layer, and a bezel or a case accommodating the display panel and buffer member.

Abstract: An organic light emitting diode (OLED) display is disclosed. In one embodiment, the OLED display includes i) a display substrate, ii) an OLED array, iii) an encapsulation substrate arranged opposite to the display substrate with respect to the OLED array, iv) a sealing member configured to seal the display substrate and the encapsulation substrate and v) a filler applied in a space formed between the display substrate and the encapsulation substrate. In one embodiment, the height of the filler is more than about 1.2 times the height of the OLED array.

Abstract: A flat panel display apparatus includes a flat display panel including first and second substrates facing each other with a display unit therebetween, the first substrate extending beyond the second substrate, a portion of the first substrate extending beyond the second substrate defining a protruding portion, an outermost edge of the protruding portion defining a protruding edge of the first substrate, and corners of the protruding portion being chamfered, and a bezel surrounding the flat display panel.

Abstract: In an organic light emitting display apparatus and a method of manufacturing the same, the organic light emitting display apparatus comprises: a first substrate, one surface of which is divided into a non-display area and a display area including an organic light emitting diode (OLED); a second substrate, one surface of which faces the one surface of the first substrate; and a bonding member disposed between the first and second substrates so as to surround the display area of the first substrate, and bonding the first and second substrates to each other to define an inner portion including the display area and an outer portion including the non-display area. A bonding portion formed by the bonding member includes an effective bonding portion and a non-effective bonding portion.

Abstract: An organic light-emitting diode display device includes a substrate, a display unit on the substrate, a touch unit facing the substrate, and a sealing portion surrounding the display unit. The sealing portion couples the substrate to the touch unit and includes glass frit. The touch unit includes an encapsulation substrate, a first conductive layer on the encapsulation substrate, an insulating layer on a portion of the first conductive layer and the encapsulation substrate, and a second conductive layer on the first conductive layer and the insulating layer. The insulating layer of the touch unit includes an organosilicon compound and has a thermal decomposition temperature of about 360° C. or more.

Abstract: An organic light emitting diode display device having a frit which can improve mechanical strength and adhesion between the upper substrate and the lower substrate, and a method of fabricating the same are disclosed. The organic light emitting diode display device includes a lower substrate, an organic light emitting diode disposed on the lower substrate, an upper substrate to be coupled to the lower substrate, and a frit disposed between the lower substrate and the upper substrate to couple both the lower substrate and the upper substrate to each other where the frit has a plurality of pores.

Abstract: A silicon composition with a silicon compound represented by Formula 1 and a silicon compound represented by Formula 2: wherein, R1, R2, R3, R4, R11, R12, R13, R14, R15, R16, R17, R18, and R19 are each independently a C1-C4 alkyl group, R5, R6, R7, R8, R9, and R10 are each independently hydrogen or deuterium, k, m, and n are positive integers, and the ratio of k to the sum of m and n is from about 1:0.001 to about 1:0.2; and an organic light emitting device including the same.

Abstract: A laser irradiation apparatus for bonding a first substrate to a second substrate using bonding members and a method of manufacturing a display device using the same, the laser irradiation apparatus including a stage on which the first substrate is mounted, bonding members disposed between the first substrate and the second substrate, a laser oscillating member configured to irradiate a laser beam onto the bonding members, and a temperature maintaining member co-operating with the first substrate to maintain a temperature of the first substrate at a predetermined temperature.