Patents by Inventor Sundar Raman
Sundar Raman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240096855Abstract: A method of wafer-level manufacturing of an optical package (285) is disclosed. The method comprises forming an apertured substrate (170; 405) by a process of vacuum injection molding, each aperture (175A; 175B) in the apertured substrate configured to support an optical element (225; 420; 425). The method also comprises coupling the apertured substrate to a further substrate (255) comprising optical devices (260, 265) aligned with the apertures in the apertured substrate. Also disclosed is optical package (285, 600) formed according to the method and an apparatus, such as a smartphone, comprising the optical package.Type: ApplicationFiled: December 8, 2021Publication date: March 21, 2024Applicant: ams-OSRAM Asia Pacific Pte. Ltd.Inventors: Zhen Kai NAM, Qi Chuan YU, Kam Wah LEONG, Yeu Woon CHAN, Royce VIRINTHORN, Sundar Raman GNANA SAMBANDAM, Zhang Xin SUN
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Publication number: 20230296782Abstract: A system and a method are disclosed for detecting a spurious signal in a Global Navigation Satellite System (GNSS) receiver. A detector of the GNSS receiver determines a first sequence of known bits or known-bit transitions of a space vehicle (SV) signal of a target SV. A second sequence is determined based on a coherent sum of the SV signal being tracked by the GNSS receiver. A first reliability sequence may be associated with the first sequence, and a second reliability sequence that may be associated with the second sequence. A correlation statistic of the first sequence is determined based on the second sequence. Whether the first SV signal is a spurious signal is determined based on a comparison of the correlation statistic to a threshold value.Type: ApplicationFiled: August 3, 2022Publication date: September 21, 2023Inventors: Sundar RAMAN, Raul H. ETKIN, Jamie A. HENRIKSEN
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Publication number: 20230266479Abstract: A system and a method are disclosed for verifying a Global Navigation Satellite System (GNSS) space vehicle (SV) signal. An extremely weak frame synchronization (EWFS) verification process is run on a current SV signal with respect to another verified SV signal. An indication is set that frame synchronization for the current SV signal is complete after full frame synchronization occurs based on a peak EWFS correlation value of the current SV signal being equal to or greater than a first threshold. The indication may be set early based on the peak EWFS correlation value of the current SV signal being greater than a second threshold value that is greater than the first threshold. Tracking of the current SV signal may be terminated early based on the peak EWFS correction value of the current SV signal being less than a third threshold that is less that the first threshold.Type: ApplicationFiled: August 3, 2022Publication date: August 24, 2023Inventors: Ali JAFARNIA JAHROMI, Francis Keith SCHERRER, Sundar RAMAN, William Joseph HIGGINS
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Patent number: 11550063Abstract: A receiver and method thereof are provided for synchronizing with a global navigation satellite system (GNSS) including a plurality of satellite vehicles (SVs). The method includes starting a verification process and a bitsync (BS) process in parallel with a first SV among the plurality of SVs, and upon completing the verification process while still performing the BS process, starting a track channel process with the first SV based on an interim BS result obtained at the time of completing the verification process, and starting a frame sync (FS) process with first SV based on the interim BS result. An aligned acquisition (AA) process may be started with a second SV among the plurality of SVs, upon completing the verification process, based on the interim BS result.Type: GrantFiled: April 30, 2021Date of Patent: January 10, 2023Inventors: Ali Jafarnia Jahromi, Sundar Raman, Pravesh Asthana, William Higgins
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Publication number: 20220350034Abstract: A receiver and method thereof are provided for synchronizing with a global navigation satellite system (GNSS) including a plurality of satellite vehicles (SVs). The method includes starting a verification process and a bitsync (BS) process in parallel with a first SV among the plurality of SVs, and upon completing the verification process while still performing the BS process, starting a track channel process with the first SV based on an interim BS result obtained at the time of completing the verification process, and starting a frame sync (FS) process with first SV based on the interim BS result. An aligned acquisition (AA) process may be started with a second SV among the plurality of SVs, upon completing the verification process, based on the interim BS result.Type: ApplicationFiled: April 30, 2021Publication date: November 3, 2022Inventors: Ali Jafarnia Jahromi, Sundar Raman, Pravesh Asthana, William Higgins
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Publication number: 20220229362Abstract: A method of manufacturing a master for use in a wafer-scale replication process is disclosed. The method comprises at least one step of forming a layer of photoresist on a substrate and exposing the layer of photoresist to a radiation pattern to form at least one patterned layer. The method also comprises a step of developing the at least one patterned layer to provide one or more structures defining the master. In an embodiment, the at least one step of forming the layer of photoresist comprises a process of dry film lamination.Type: ApplicationFiled: May 28, 2020Publication date: July 21, 2022Inventors: Ji Wang, Kam Wah Leong, QiChuan Yu, Sundar Raman Gnana Sambandam
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Patent number: 11018269Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.Type: GrantFiled: February 21, 2017Date of Patent: May 25, 2021Assignee: ams Sensor Singapore Pte. Ltd.Inventors: Qichuan Yu, Hartmut Rudmann, Ji Wang, Kian Siang Ng, Simon Gubser, James Eilertsen, Sundar Raman Gnana Sambandam
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Patent number: 10886420Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable spectral filter layer is produced which defines apertures. Then, trenches are produced which extend through the clear encapsulation and establish sidewalls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches and producing aperture stops. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.Type: GrantFiled: April 5, 2017Date of Patent: January 5, 2021Assignee: ams Sensors Singapore Pte. Ltd.Inventors: Qichuan Yu, Hartmut Rudmann, Ji Wang, Kian Siang Ng, Simon Gubser, James Eilertsen, Sundar Raman Gnana Sambandam
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Patent number: 10566467Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate, thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material.Type: GrantFiled: November 15, 2016Date of Patent: February 18, 2020Assignee: ams Sensors Singapore Pte. Ltd.Inventors: Qichuan Yu, Hartmut Rudmann, Ji Wang, Kian Siang Ng, Simon Gubser, James Eilertsen, Sundar Raman Ghana Sambandam
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Publication number: 20190123213Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable spectral filter layer is produced which defines apertures. Then, trenches are produced which extend through the clear encapsulation and establish sidewalls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches and producing aperture stops. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.Type: ApplicationFiled: April 5, 2017Publication date: April 25, 2019Inventors: Qichuan Yu, Hartmut Rudmann, Ji Wang, Kian Siang Ng, Simon Gubser, James Eilertsen, Sundar Raman Gnana Sambandam
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Publication number: 20190097066Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate, thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material.Type: ApplicationFiled: November 15, 2016Publication date: March 28, 2019Inventors: Qichuan Yu, Hartmut Rudmann, Ji Wang, Kian Siang NG, Simon Gubser, James Eilertsen, Sundar Raman Ghana Sambandam
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Publication number: 20190051762Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.Type: ApplicationFiled: February 21, 2017Publication date: February 14, 2019Applicant: Heptagon Micro Optics Pte. Ltd.Inventors: Qichuan Yu, Hartmut Rudmann, Ji Wang, Kian Siang NG, Simon Gubser, James Eilertsen, Sundar Raman Gnana Sambandam
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Patent number: 9983291Abstract: Methods, apparatuses, and devices are disclosed to estimate a position of a mobile device using, for example, beacon signals transmitted using virtual access points utilizing a single, physical transceiver. Determination that beacon signals emanate from a single, physical transceiver may be based, at least in part, on a similarity among acquired beacon signals conveying identifiers, such as media access control identification (MAC ID) addresses and/or basic service set identifiers (BSSIDs), and on measurement of beacon signal characteristics, such as received signal strength at a mobile device and/or round trip time between the mobile device and the transceiver.Type: GrantFiled: November 10, 2014Date of Patent: May 29, 2018Assignee: QUALCOMM IncorporatedInventors: Ju-Yong Do, Sai Pradeep Venkatraman, Sundar Raman, Weiyi Liu, Gengsheng Zhang
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Patent number: 9900918Abstract: Method, device, and computer program product that may improve communications between a mobile device and an access point device are disclosed. In one embodiment, an access point device includes a transceiver configured to receive signals from a mobile device, a processor coupled to the transceiver, and a memory coupled to the processor, the memory having stored thereon code configured to be executed by the processor, the code instructing the processor to: control a plurality of beacons in the access point device, obtain range measurements using the plurality of beacons in the access point device, and assist calibration of a beacon in the mobile device using the range measurements obtained by the plurality of beacons in the access point device.Type: GrantFiled: October 26, 2015Date of Patent: February 20, 2018Assignee: QUALCOMM IncorporatedInventors: Ju-Yong Do, Sai Pradeep Venkatraman, Weihua Gao, Amir Abbas Emadzadeh, Sundar Raman, Gengsheng Zhang
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Patent number: 9869770Abstract: Control and feature systems for processing signals from a satellite positioning system include an expert system receiver manager; a joint detection, carrier centring and bit sync acquisition subsystem; peak detection; a multi-dimensional measurement interpolation subsystem; a system for mode switching between a navigational signal; and power control module for receiver.Type: GrantFiled: December 12, 2014Date of Patent: January 16, 2018Assignee: QUALCOMM IncorporatedInventors: Mangesh Chansarkar, Sundar Raman, Charles P. Norman, Paul A. Underbrink, Henry D. Falk, James Brown, Robert Harvey, Peter Michali, William Higgins, Gensheng Zhang, Qingwen Zhang
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Patent number: 9609488Abstract: Methods, systems, and devices are described for managing broadcasts of data in wireless communications. A request to join a multicast session is received. A plurality of broadcast technology based identifiers associated with the multicast session are received. Each broadcast technology based identifier identifies one of a plurality of radio access technologies (RATs) broadcasting the multicast session. One of the plurality of RATs is selected. A multicast stream of data associated with the multicast session is received from the selected RAT.Type: GrantFiled: January 29, 2014Date of Patent: March 28, 2017Assignee: QUALCOMM IncorporatedInventors: Hariharan Sukumar, Sundar Raman, Shailesh Maheshwari
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Publication number: 20170074972Abstract: Disclosed are methods, systems and devices for providing location based services in a venue. To estimate its location, in a particular implementation, a mobile device may obtain a measurement of a range to a transponder device positioned at a known location based on measurements of a signal round-trip time (RTT) in a message exchange with the transponder device. Positioning assistance data from a server may enable the mobile device to measure a delay at the transponder device in providing a response to a probe message to thereby more accurately measure the signal RTT.Type: ApplicationFiled: November 28, 2016Publication date: March 16, 2017Inventors: Ju-Yong Do, Gengsheng Zhang, Sundar Raman, Chandrakant Mehta, Arie Rahmat, Lionel Jacques Garin
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Patent number: 9588216Abstract: Methods and apparatus for processing positioning assistance data are provided. An exemplary method includes receiving, from a positioning server, virtual access point (VAP) data including a list of unique identifiers, and determining a location of a mobile device by using the VAP. The VAP data indicates that the unique identifiers included on the list identify signals originating from the same physical access point. The unique identifiers can be MAC addresses. In an example, the location determining the can include actively scanning a signal identified by a unique identifier on the list and not actively scanning a different signal identified by a different unique identifier also on the list. Not scanning the other MAC addresses that are on the access point's list and assigned to the mobile device keeps the mobile device from performing duplicative scanning that wastes time, processor cycles, and energy.Type: GrantFiled: November 10, 2014Date of Patent: March 7, 2017Assignee: QUALCOMM IncorporatedInventors: Ju-yong Do, Gengsheng Zhang, Lionel Jacques Garin, Sai Pradeep Venkatraman, Weiyi Liu, Sundar Raman
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Publication number: 20170026909Abstract: Example methods, apparatuses, or articles of manufacture are disclosed herein that may be utilized, in whole or in part, to facilitate or support one or more operations or techniques for selective downloading of one or more positioning tiles using a cache of transmitter parameters, such as for use in or with a mobile communication device, for example.Type: ApplicationFiled: July 24, 2015Publication date: January 26, 2017Inventors: Weihua Gao, Gengsheng Zhang, Sundar Raman
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Patent number: 9547068Abstract: Disclosed are methods, systems and devices for providing location based services in a venue. To estimate its location, in a particular implementation, a mobile device may obtain a measurement of a range to a transponder device positioned at a known location based on measurements of a signal round-trip time (RTT) in a message exchange with the transponder device. Positioning assistance data from a server may enable the mobile device to measure a delay at the transponder device in providing a response to a probe message to thereby more accurately measure the signal RTT.Type: GrantFiled: September 3, 2014Date of Patent: January 17, 2017Assignee: QUALCOMM IncorporatedInventors: Ju-Yong Do, Gengsheng Zhang, Sundar Raman, Chandrakant Mehta, Arie Rahmat, Lionel Jacques Garin