Patents by Inventor Sundeepan Sennik

Sundeepan Sennik has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11725399
    Abstract: A flooring underlayment comprises a membrane that includes a body panel having a panel top surface and a panel underside surface spaced apart from the panel top surface by a panel thickness. The membrane further includes a plurality of dimples projecting downward from the panel underside surface, each dimple having a dimple upper end open to the panel top surface, a closed dimple lower end spaced apart from the dimple upper end by a dimple height, and a dimple sidewall extending between the dimple upper end and the dimple lower end, the dimple sidewall configured to inhibit collapse of the dimple height when a load is applied to the flooring underlayment during use. The membrane includes a plurality of grooves open to the panel top surface and formed within a groove body projecting downward from the panel underside surface, each groove shaped to receive an elongated heating element therein.
    Type: Grant
    Filed: October 17, 2022
    Date of Patent: August 15, 2023
    Assignee: DMX MEMBRANES LIMITED
    Inventor: Sundeepan Sennik
  • Publication number: 20220178151
    Abstract: A foam board article for installation against a base surface comprises a rigid foam layer including (a) a panel having an underside surface and a topside surface opposite the underside surface; and (b) a plurality of underside protrusions projecting from the underside surface for supporting the panel in spaced apart relation from the base surface to provide an air gap therebetween.
    Type: Application
    Filed: December 9, 2021
    Publication date: June 9, 2022
    Inventor: Sundeepan SENNIK
  • Publication number: 20220136641
    Abstract: A membrane for installation circumferentially about a pipe includes: (a) a substrate including: (i) a panel having an underside surface on an underside of the substrate for facing the pipe and a topside surface on a topside of the substrate opposite the underside, (ii) a plurality of underside protrusions projecting form the underside surface for supporting the panel radially apart from the pipe; and (iii) a plurality of topside protrusions projecting from the topside surface. The membrane further includes (b) a foam layer extending over the topside of the substrate; and (c) a heat-reflecting layer extending over the foam layer.
    Type: Application
    Filed: October 26, 2021
    Publication date: May 5, 2022
    Inventor: Sundeepan Sennik
  • Publication number: 20190338535
    Abstract: An underlayment for installation between a base surface and a flooring material includes (a) a structural membrane formed of a structural material and including a panel and a plurality of dimples projecting from an underside surface of the panel. Each dimple has a dimple tip spaced apart from the underside surface. The underlayment further includes (b) a plurality of discrete dimple endcaps comprising a resilient material. Each endcap is fixed relative to, and covers at least a portion of, the dimple tip of a respective dimple. The endcaps support the dimples above the base surface when the underlayment is installed.
    Type: Application
    Filed: May 6, 2019
    Publication date: November 7, 2019
    Inventor: Sundeepan Sennik
  • Patent number: 9869100
    Abstract: An underlayment for a floor includes a dimpled substrate having a generally planar top side, an opposed bottom side, and a plurality of dimples formed therein. Each dimple is bounded by a dimple wall, and includes a dimple opening along the top side. A smoothing layer is bonded beneficial to the top side of the dimpled substrate and overlays and occludes the dimple openings.
    Type: Grant
    Filed: November 8, 2016
    Date of Patent: January 16, 2018
    Assignee: DMX PLASTICS LIMITED
    Inventor: Sundeepan Sennik
  • Publication number: 20170114551
    Abstract: An underlayment for a floor includes a dimpled substrate having a generally planar top side, an opposed bottom side, and a plurality of dimples formed therein. Each dimple is bounded by a dimple wall, and includes a dimple opening along the top side. A smoothing layer is bonded to the top side of the dimpled substrate and overlays and occludes the dimple openings.
    Type: Application
    Filed: November 8, 2016
    Publication date: April 27, 2017
    Inventor: Sundeepan Sennik