Abstract: The invention relates to a grid array type lead frame having a plurality of leads classified into groups by length. The leads extend to respective lead ends, in each of which at least one different plane direction-converting lead part and/or at least one identical plane direction-converting lead part is formed by at least one bending part, whereby the lead ends are distributed in a grid array. The invention also includes a grid array type lead frame, which is as small as or similar to that of semiconductor chip in area while the lead ends are arrayed on one plane, and are at a farther distance away from neighboring ones but in a higher number per area, in such a manner that they form a grid array.

Abstract: The invention relates to a grid array type lead frame having a plurality of leads classified into groups by length forming a lead end grid array semiconductor package. The leads extend to respective lead ends, in each of which at least one different plane direction-converting lead part and/or at least one identical plane direction-converting lead part is formed by at least one bending part, whereby the lead ends are distributed in a grid array. The invention includes a lead end grid array semiconductor package employing the grid array type lead frame, which is as small as or similar to that of semiconductor chip in area while the lead ends are arrayed on one plane, farther distant way from neighboring ones but in a higher number per area, in such a manner that they form a grid array.