Abstract: An apparatus includes an injection part, a transfer part, a pressure supply part, a collision part and an emission part. An object is injected through the injection part. The transfer part is connected to the injection part, and bended at a plurality of points thereof. The object passes through the transfer part. The pressure supply part is connected to the transfer part and supplies a pressure into the transfer part to move the object. The collision part collides with the object moving in the transfer part to treat a surface of the object. The emission part is connected to the transfer part, and the object having the treated surface is emitted through the emission part.

Abstract: A polishing apparatus including a chuck for supporting a wafer while exposing a peripheral portion of the wafer, a polishing head for polishing the peripheral portion of the wafer, and a polishing solution supplying assembly provided above the chuck and configured to spray a polishing solution on the wafer and to form a liquid curtain on the chuck to protect the wafer when the wafer is polished may be provided.

Abstract: A polishing apparatus including a chuck for supporting a wafer while exposing a peripheral portion of the wafer, a polishing head for polishing the peripheral portion of the wafer, and a polishing solution supplying assembly provided above the chuck and configured to spray a polishing solution on the wafer and to form a liquid curtain on the chuck to protect the wafer when the wafer is polished may be provided.

Abstract: An apparatus includes an injection part, a transfer part, a pressure supply part, a collision part and an emission part. An object is injected through the injection part. The transfer part is connected to the injection part, and bended at a plurality of points thereof. The object passes through the transfer part. The pressure supply part is connected to the transfer part and supplies a pressure into the transfer part to move the object. The collision part collides with the object moving in the transfer part to treat a surface of the object. The emission part is connected to the transfer part, and the object having the treated surface is emitted through the emission part.

Abstract: A test apparatus and method tests a pad conditioner of a chemical mechanical polishing apparatus. The pad conditioner test apparatus includes a main body having a conditioner mounting section that supports the pad conditioner, a conditioner head raising/lowering system that raises and lowers the head of the pad conditioner while the pad conditioner is supported on the test apparatus, and a discrimination section that detects the ability of the head to be raised/lowered in accordance with a program so that the condition of the head can be determined. The test apparatus can prevent various problems that otherwise would occur if a new pad conditioner were directly installed in the chemical mechanical polishing apparatus.

Abstract: A test apparatus and method tests a pad conditioner of a chemical mechanical polishing apparatus. The pad conditioner test apparatus includes a main body having a conditioner mounting section that supports the pad conditioner, a conditioner head raising/lowering system that raises and lowers the head of the pad conditioner while the pad conditioner is supported on the test apparatus, and a discrimination section that detects the ability of the head to be raised/lowered in accordance with a program so that the condition of the head can be determined. The test apparatus can prevent various problems that otherwise would occur if a new pad conditioner were directly installed in the chemical mechanical polishing apparatus.

Abstract: A polishing head of a wafer polishing apparatus includes a body, a center supporter installed in a center of the body, a perforated plate including an upper plate and a lower plate that is disposed below the center supporter and has a plurality of thru-holes, a membrane covering the perforated plate, and a moving member for moving the lower plate up and down. By moving the lower plate up and down, the polishing head forcibly recovers an elasticity of the membrane (especially at an edge portion of the membrane).

Abstract: A polishing head of a wafer polishing apparatus includes a body, a center supporter installed in a center of the body, a perforated plate including an upper plate and a lower plate that is disposed below the center supporter and has a plurality of thru-holes, a membrane covering the perforated plate, and a moving member for moving the lower plate up and down. By moving the lower plate up and down, the polishing head forcibly recovers an elasticity of the membrane (especially at an edge portion of the membrane).