Patents by Inventor Sung Chul Park

Sung Chul Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230253539
    Abstract: A method for manufacturing an electrode for secondary battery, including a pressing process in which a load is applied to an electrode active material slurry when the solid content of the electrode active material slurry is 70 wt % to 98 wt % during the process of drying the electrode active material slurry coated as one or more layers on a current collector. An apparatus for manufacturing the same is also provided.
    Type: Application
    Filed: April 25, 2022
    Publication date: August 10, 2023
    Applicant: LG Energy Solution, Ltd.
    Inventors: Jegon Lee, Sung Chul Park, Miseon Kim, Hanmin Lim
  • Publication number: 20230172131
    Abstract: The present invention relates to a method for producing oats having high-content avenanthramides using elicitors.
    Type: Application
    Filed: April 7, 2021
    Publication date: June 8, 2023
    Inventors: Cha Young KIM, Yu Jeong JEONG, Jae Cheol JEONG, Soyoung KIM, Tae Hee KIM, Sung Chul PARK, Jiyoung LEE, Suk Weon KIM, Suhyun PARK
  • Publication number: 20230158701
    Abstract: An electrode cutting device is provided. The electrode cutting device may perform a full-width cutting process and an edge cutting process together to simplify the manufacturing process, thereby significantly improving work efficiency. Particularly, an edge of the electrode is uniformly cut to prevent defects from occurring.
    Type: Application
    Filed: July 13, 2021
    Publication date: May 25, 2023
    Applicant: LG Energy Solution, Ltd.
    Inventors: Sung Chul Park, Sang Wook Kim, Chung Hee Lee, Dong Hyeuk Park
  • Patent number: 11652104
    Abstract: A semiconductor device including a substrate having a plurality of active fins, each of the plurality of active fins extending in a first direction, first and second gate structures crossing over the plurality of active fins, the first and second gate structures extending in a second direction different from the first direction, the first and second gate structures spaced apart from each other in the first direction, at least one insulating barrier extending in the first direction and between the plurality of active fins, the insulating barrier separating lower portions of the first and second gate structures from each other, and a gate isolation layer connected to a portion of the insulating barrier, the gate isolation unit separating upper portions of the first and second gate structures from each other may be provided.
    Type: Grant
    Filed: May 13, 2019
    Date of Patent: May 16, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dong Hyun Kim, Sung Chul Park
  • Publication number: 20230145850
    Abstract: A sheet cutting and fusion apparatus including upper and lower cutters at uppermost and lowermost surfaces, respectively, of a plurality of overlapping sheets. The upper and lower cutters includes first and second cutting surfaces configured for contacting the lower cutter without any step when the upper cutter is moved vertically and the upper cutter without any step when the lower cutter is moved vertically, respectively; first and second fusion portions parallel to the first cutting surface and to the second cutting surface, respectively; first and second steps extending between the first cutting surface and first fusion portion and extending between the second cutting surface and second fusion portion, respectively; lower and upper surfaces configured to face one of the sheets, respectively; and first and second connection portions each having a curved corner connecting the lower surface and first fusion portion and connecting the upper surface and second fusion portion, respectively.
    Type: Application
    Filed: January 28, 2022
    Publication date: May 11, 2023
    Applicant: LG Energy Solution, Ltd.
    Inventors: Hyeon Jin Lee, Sang Wook Kim, Sung Chul Park, Sin Young Park, Dong Hyeuk Park, Ji Woon Lee
  • Publication number: 20230134315
    Abstract: Disclosed is a portable communication device including a housing, a first printed circuit board (PCB) disposed in the housing, a wireless communication circuit mounted on the first PCB, and a second PCB including a connection part connected with the first PCB, a first PCB portion extended from the connection part and having greater flexibility than the connection part, a second PCB portion extended from the first PCB portion and having less flexibility than the first PCB portion, a third PCB portion extended from the second PCB portion and having greater flexibility than the second PCB portion, a fourth PCB portion extended from the third PCB portion and having less flexibility than the first PCB portion, a signal line extended to the connection part along the first, second, third, and fourth PCB portions, and vias arranged in at least a partial area of the second PCB portion or the fourth PCB portion, wherein a portion of the signal line is located between some of the vias.
    Type: Application
    Filed: December 28, 2022
    Publication date: May 4, 2023
    Inventors: Han-Min CHO, Chan-Gi PARK, Yeon-Sang YUN, Tae-Wook HAM, Hei-Seong KWAK, Byoung-II SON, Sung-Chul PARK
  • Patent number: 11621440
    Abstract: The present invention provides a composition for forming an insulating layer for a lithium secondary battery, which includes a binder polymer; a coloring agent including at least one selected from the group consisting of an organic dye, an oil-soluble dye and an organic phosphor; and a solvent, and has a viscosity of 1,000 cP or more at 25° C.
    Type: Grant
    Filed: February 1, 2019
    Date of Patent: April 4, 2023
    Inventors: Sung Chul Park, Ung Ju Lee, Koo Seung Chung, Won Hee Jeong, Jung Woo Yoo, Young Jae Kim
  • Patent number: 11616518
    Abstract: The present invention relates to an electronic device and, more particularly, to an electronic device and a method for transmitting and receiving signals.
    Type: Grant
    Filed: May 26, 2022
    Date of Patent: March 28, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yong-Lim Go, Tae-Sik Yun, Sung-Chul Park
  • Publication number: 20230083309
    Abstract: An electronic device is provided.
    Type: Application
    Filed: September 16, 2022
    Publication date: March 16, 2023
    Inventors: Seong Beom HONG, Hyung Wook KIM, Sung Chul PARK
  • Patent number: 11569564
    Abstract: An electronic device includes a housing including a first plate, a second plate opposite to the first plate, and a side member surrounding a space between the first plate and the second plate, and including at least part of a conductive material, a flexible printed circuit board (FPCB) attached on an inner surface of the housing, a first antenna element which is included in the FPCB and in which a slot is formed, and a first radio frequency integrated circuit (RFIC) for the first antenna element. An opening is formed in the side member or the second plate of the housing. The FPCB is attached the inner surface of the housing such that at least part in which the slot of the first antenna element is formed is exposed through the opening. At least part of the opening is filled with an insulating material.
    Type: Grant
    Filed: March 25, 2022
    Date of Patent: January 31, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Sung Chul Park
  • Patent number: 11569565
    Abstract: Disclosed is an electronic device comprising a first component, a second component, and a signal path interface coupled between the first component and the second component, the signal path interface including a printed circuit board (PCB) having a rigid PCB portion and a flexible PCB portion, wherein a first signal line and a second signal line extend through the rigid PCB portion and the flexible PCB portion for transmitting signals from the first component to the second components, and a plurality of ground lines extend through the rigid PCB portion and the flexible PCB portion, and wherein each of the plurality of ground lines extending through the rigid PCB portion is connected to one or more conductive layers through conductive vias.
    Type: Grant
    Filed: April 8, 2021
    Date of Patent: January 31, 2023
    Inventors: Han-Min Cho, Chan-Gi Park, Yeon-Sang Yun, Tae-Wook Ham, Hei-Seong Kwak, Byoung-Il Son, Sung-Chul Park
  • Patent number: 11561038
    Abstract: The present invention relates to a grain refrigerator including a housing having a grain storage space formed thereon to discharge grains stored therein, a fixing rod located at the center of the inside lower portion of the housing, dew condensation prevention means fixed to the fixing rod, a support plate located on a top periphery of the dew condensation prevention means, an evaporator disposed on the support plate to generate cool air, and a cooling tube disposed on a top periphery of the support plate on the outside of the evaporator to cool the grains, wherein a first pipe and a second pipe connected to the lower portion of the evaporator pass through a through hole of the support plate and a first drain hole of the dew condensation prevention means and are thus exposed to the outside of the housing.
    Type: Grant
    Filed: May 22, 2020
    Date of Patent: January 24, 2023
    Inventors: Sung-Chul Park, Nam-Gyu Park
  • Publication number: 20220367945
    Abstract: Disclosed are a pouch film shaping apparatus including a preheating lamp configured to preheat a metal barrier layer of a pouch film in order to increase stretching force of the pouch film and a pouch film shaping method.
    Type: Application
    Filed: October 16, 2020
    Publication date: November 17, 2022
    Applicant: LG Energy Solution, Ltd.
    Inventors: Jeong Woo Hong, Sang Wook Kim, Sung Chul Park, Dong Hyeuk Park
  • Publication number: 20220359928
    Abstract: Provided is a battery module having a bidirectional cooling structure. The A battery module comprising: a module case comprising an upper cover plate and a lower cover plate; and at least two pouch cells accommodated in the module case, respectively including sealed portions on three sides thereof, wherein among the sealed portions, a sealed portion from which no electrode lead protrudes is folded in one direction, and the folded sealed portion is positioned on a side of the upper cover plate or the lower cover plate of the module case, wherein a thermal adhesive is attached directly to a pouch side of at least one of the at least two pouch cells located in a direction opposite to a folding direction of the folded sealed portion.
    Type: Application
    Filed: May 4, 2022
    Publication date: November 10, 2022
    Inventors: Seo Roh RHEE, Yang Kyu CHOI, Ji Eun KANG, Seok Min KIM, Sung Chul PARK, Ha Chul JEONG
  • Publication number: 20220328982
    Abstract: Disclosed is an electronic device. The electronic device according to an embodiment includes a plurality of antennas, and a communication circuit electrically connected with the plurality of antennas. The communication circuit includes a plurality of circuits receiving a signal in a first band and is configured to simultaneously receive the signal in the first band through two or more circuits of the plurality of circuits from two or more antennas, which are positioned adjacent to each other, from among the plurality of antennas. The number of the plurality of antennas is the same as the number of plurality of circuits.
    Type: Application
    Filed: June 9, 2022
    Publication date: October 13, 2022
    Inventors: Young Ju KIM, Jong Hyuk KIM, Sung Chul PARK
  • Publication number: 20220302936
    Abstract: The present invention relates to an electronic device and, more particularly, to an electronic device and a method for transmitting and receiving signals.
    Type: Application
    Filed: May 26, 2022
    Publication date: September 22, 2022
    Inventors: Yong-Lim GO, Tae-Sik YUN, Sung-Chul PARK
  • Patent number: 11450944
    Abstract: An electronic device is provided.
    Type: Grant
    Filed: April 26, 2021
    Date of Patent: September 20, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seong Beom Hong, Hyung Wook Kim, Sung Chul Park
  • Patent number: 11404798
    Abstract: An electronic device includes a housing and an antenna array disposed inside the housing. The antenna array includes multiple antenna elements separated in a pattern. At least one of the antenna elements includes a substantially flat conductive plate. The conductive plate includes a partially oval periphery having a first end and a second end, a partial major axis, a minor axis, and a straight periphery that makes a non-zero angle with the partial major axis, contacts or crosses the partial major axis, and interconnects the first end and the second end. A wireless communication circuit is electrically connected to the antenna elements, and transmits a first signal having a first frequency by feeding at or near the straight periphery, and a second signal having a second frequency which is greater than the first frequency by feeding part of the partially oval periphery at or near the minor axis.
    Type: Grant
    Filed: November 1, 2018
    Date of Patent: August 2, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Sung Chul Park
  • Patent number: 11394106
    Abstract: Various embodiments of the present invention relate to an electronic device comprising a wireless communication circuit, and a portable communication device.
    Type: Grant
    Filed: November 5, 2018
    Date of Patent: July 19, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dong Ju Lee, Won Jin Choi, Bong Sup Son, Moon Hyuk Choi, Se Woong Ahn, Su Ho Jin, Jung Hyun Park, Sung Jun Kim, Sung Chul Park, Ji Woo Lee
  • Patent number: 11383324
    Abstract: A method of optimizing laser welding of two different metals is disclosed herein. In some embodiments, a method for optimizing laser welding of two different metals comprising laser welding a plurality of samples comprising a first metal and a second metal to form a weld between the first metal and the second metal, the weld having a molten area, wherein each sample is laser welded using a different line energy, measuring the content of an intermetallic compound produced by the laser welding in the molten area of the weld in each sample, and determining the line energy of the laser that results in the content of the intermetallic compound produced in the molten area of the weld being less than 10%.
    Type: Grant
    Filed: December 10, 2019
    Date of Patent: July 12, 2022
    Inventors: Jin Soo Lee, Sung Chul Park, Bu Gon Shin, Soyoung Choo