Abstract: A semiconductor die stack structure includes a base die, a plurality of semiconductor die stack units, and bumps. Each of the plurality of semiconductor die stack units includes a lower semiconductor die and an upper semiconductor die. Each of the lower semiconductor die and the upper semiconductor die includes a body and a front-side pad structure. The front-side pad structure includes a front-side pad seed layer and a front-side pad pattern. The front-side pad pattern includes a first front-side pad portion, a second front-side pad portion, and a third front-side pad portion. The first front-side pad portion and the second front-side pad portion forms a staircase. The first front-side pad portion and the third front-side pad form a reverse staircase. The first front-side pad portion, the second front-side pad portion, and the third front-side pad include a same metal.

Abstract: An apparatus for measuring a temperature of a material includes a body unit disposed on an exit side of a heating furnace; a temperature measuring unit installed on the body unit and constructed to measure a temperature of a material which is extracted from the heating furnace; a foreign substance removing unit installed on the body unit and constructed to inject a fluid toward the material so as to remove foreign substances adhered to the material; and a moving unit installed on the body unit and constructed to move the temperature measuring unit.

Abstract: An apparatus for measuring a temperature of a material includes a body unit disposed on an exit side of a heating furnace; a temperature measuring unit installed on the body unit and constructed to measure a temperature of a material which is extracted from the heating furnace; a foreign substance removing unit installed on the body unit and constructed to inject a fluid toward the material so as to remove foreign substances adhered to the material; and a moving unit installed on the body unit and constructed to move the temperature measuring unit.