Patents by Inventor Sung-hyun SIM
Sung-hyun SIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11958874Abstract: According to the embodiment of the present disclosure, an organo tin compound is represented by the following Chemical Formula 1: In Chemical Formula 1, L1 and L2 are each independently selected from an alkoxy group having 1 to 10 carbon atoms and an alkylamino group having 1 to 10 carbon atoms, R1 is a substituted or unsubstituted aryl group having 6 to 8 carbon atoms, and R2 is selected from a substituted or unsubstituted linear alkyl group having 1 to 4 carbon atoms, a branched alkyl group having 3 to 4 carbon atoms, a cycloalkyl group having 3 to 6 carbon atoms, and an allyl group having 2 to 4 carbon atoms.Type: GrantFiled: April 11, 2022Date of Patent: April 16, 2024Assignees: EGTM Co., Ltd., SK hynix Inc.Inventors: Jang Keun Sim, Sung Jun Ji, Tae Young Lee, Shin Beom Kim, Sun Young Baik, Tae Hwan Lim, Dong Kyun Lee, Sang Hyun Lee, Su Pill Chun
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Publication number: 20240073416Abstract: The present invention relates to an apparatus and method for encoding and decoding an image by skip encoding. The image-encoding method by skip encoding, which performs intra-prediction, comprises: performing a filtering operation on the signal which is reconstructed prior to an encoding object signal in an encoding object image; using the filtered reconstructed signal to generate a prediction signal for the encoding object signal; setting the generated prediction signal as a reconstruction signal for the encoding object signal; and not encoding the residual signal which can be generated on the basis of the difference between the encoding object signal and the prediction signal, thereby performing skip encoding on the encoding object signal.Type: ApplicationFiled: November 6, 2023Publication date: February 29, 2024Applicants: Electronics and Telecommunications Research Institute, Kwangwoon University Industry-Academic Collaboration Foundation, Universily-lndustry Cooperation Group of Kyung Hee UniversityInventors: Sung Chang LIM, Ha Hyun LEE, Se Yoon JEONG, Hui Yong KIM, Suk Hee CHO, Jong Ho KIM, Jin Ho LEE, Jin Soo CHOI, Jin Woong KIM, Chie Teuk AHN, Dong Gyu SIM, Seoung Jun OH, Gwang Hoon PARK, Sea Nae PARK, Chan Woong JEON
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Patent number: 11764336Abstract: A semiconductor light emitting device includes a plurality of light emitting structures, an isolation layer covering side surfaces of the plurality of light emitting structures and insulating the plurality of light emitting structures from one another, a partition layer formed on the isolation layer, a first protective layer covering top surfaces of the plurality of light emitting structures and side walls of the partition layer, a reflective layer covering the first protective layer and disposed on the side walls of the partition layer, and a second protective layer covering the reflective layer.Type: GrantFiled: July 26, 2021Date of Patent: September 19, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sung Hyun Sim, Yong Il Kim, Ha Nul Yoo, Ji Hye Yeon, Jun Bu Youn, Ji Hoon Yun, Su Hyun Jo
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Publication number: 20230267304Abstract: A correlation recurrent unit and a correlation recurrent neural network are provided. An aspect provides a new neural network structure for training each decomposed time-series component by decomposing input time-series data xt into a plurality of time-series components (e.g., trend, seasonal, and remainder components) and improving the prediction performance of time-series data by training a relation between different time-series components.Type: ApplicationFiled: December 22, 2022Publication date: August 24, 2023Inventors: Hye Rim Bae, Sung-hyun Sim, Do Hee Kim, Han Seok Kang
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Publication number: 20210351330Abstract: A semiconductor light emitting device includes a plurality of light emitting structures, an isolation layer covering side surfaces of the plurality of light emitting structures and insulating the plurality of light emitting structures from one another, a partition layer formed on the isolation layer, a first protective layer covering top surfaces of the plurality of light emitting structures and side walls of the partition layer, a reflective layer covering the first protective layer and disposed on the side walls of the partition layer, and a second protective layer covering the reflective layer.Type: ApplicationFiled: July 26, 2021Publication date: November 11, 2021Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sung Hyun SIM, Yong II KIM, Ha Nul YOO, Ji Hye YEON, Jun Bu YOUN, Ji Hoon YUN, Su Hyun JO
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Patent number: 11113268Abstract: Disclosed are a device and a method for restoring missing operational data. The method for restoring missing operational data includes determining whether missing data is present in a first event defining operational data or a first resource constituting the operational data, extracting candidate data from a missing table, depending on a form in which the first resource is defined by the first event and a location where the missing data is identified, and processing the candidate data to restore the missing data, based on a predetermined restoration scheme.Type: GrantFiled: December 4, 2019Date of Patent: September 7, 2021Assignee: PUSAN NATIONAL UNIVERSITY INDUSTRY-UNIVERSITY COOPERATION FOUNDATIONInventors: Hye Rim Bae, Sung Hyun Sim, Yu Lim Choi, Riska Asriana Sutrisnowati
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Patent number: 11075326Abstract: A semiconductor light emitting device includes a plurality of light emitting structures, an isolation layer covering side surfaces of the plurality of light emitting structures and insulating the plurality of light emitting structures from one another, a partition layer formed on the isolation layer, a first protective layer covering top surfaces of the plurality of light emitting structures and side walls of the partition layer, a reflective layer covering the first protective layer and disposed on the side walls of the partition layer, and a second protective layer covering the reflective layer.Type: GrantFiled: June 26, 2020Date of Patent: July 27, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sung Hyun Sim, Yong Il Kim, Ha Nul Yoo, Ji Hye Yeon, Jun Bu Youn, Ji Hoon Yun, Su Hyun Jo
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Patent number: 10991857Abstract: A method of fabricating a light emitting device package includes forming a plurality of semiconductor light emitting parts, each having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer on a growth substrate, forming a partition structure having a plurality of light emitting windows on the growth substrate, filling each of the plurality of light emitting windows with a resin having a phosphor, and forming a plurality of wavelength conversion parts by planarizing a surface of the resin.Type: GrantFiled: June 17, 2019Date of Patent: April 27, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Wan Tae Lim, Sung Hyun Sim, Hanul Yoo, Yong Il Kim, Hye Seok Noh, Ji Hye Yeon
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Publication number: 20200328329Abstract: A semiconductor light emitting device includes a plurality of light emitting structures, an isolation layer covering side surfaces of the plurality of light emitting structures and insulating the plurality of light emitting structures from one another, a partition layer formed on the isolation layer, a first protective layer covering top surfaces of the plurality of light emitting structures and side walls of the partition layer, a reflective layer covering the first protective layer and disposed on the side walls of the partition layer, and a second protective layer covering the reflective layer.Type: ApplicationFiled: June 26, 2020Publication date: October 15, 2020Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sung Hyun SIM, Yong II KIM, Ha Nul YOO, Ji Hye YEON, Jun Bu YOUN, Ji Hoon YUN, Su Hyun JO
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Patent number: 10797040Abstract: A method of manufacturing a display module includes preparing a first substrate structure including an light-emitting diode (LED) array containing a plurality of LED cells, electrode pads connected to the first and second conductivity-type semiconductor layers, and a first bonding layer covering the LED array; preparing a second substrate structure including a plurality of thin-film transistor (TFT) cells disposed on a second substrate, and each having a source region, a drain region and a gate electrode disposed therebetween, the second substrate structure being provided by forming a circuit region, in which connection portions disposed to correspond to the electrode pads are exposed to one surface thereof, and by forming a second bonding layer covering the circuit region, respectively planarizing the first and second bonding layers, and bonding the first and second substrate structures to each other.Type: GrantFiled: February 21, 2020Date of Patent: October 6, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ji Hye Yeon, Su Hyun Jo, Sung Hyun Sim, Ha Nul Yoo, Yong Il Kim, Han Kyu Seong
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Patent number: 10734559Abstract: A light-emitting diode (LED) package includes a light-emitting structure, an optical wavelength conversion layer on the light-emitting structure, and an optical filter layer on the optical wavelength conversion layer. The light-emitting structure includes a first-conductivity-type semiconductor layer, an active layer on the first-conductivity-type semiconductor layer, and a second-conductivity-type semiconductor layer on the active layer, and emits first light having a first peak wavelength. The optical wavelength conversion layer absorbs the first light emitted from the light-emitting structure and emits second light having a second peak wavelength different from the first peak wavelength. The optical filter layer reflects the first light emitted from the light-emitting structure and transmits the second light emitted from the optical wavelength conversion layer.Type: GrantFiled: March 22, 2019Date of Patent: August 4, 2020Assignee: Samsung Electronics Co., Ltd.Inventors: Ha-nul Yoo, Yong-il Kim, Nam-goo Cha, Wan-tae Lim, Kyung-wook Hwang, Sung-hyun Sim, Hye-seok Noh
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Publication number: 20200210406Abstract: Disclosed are a device and a method for restoring missing operational data. The method for restoring missing operational data includes determining whether missing data is present in a first event defining operational data or a first resource constituting the operational data, extracting candidate data from a missing table, depending on a form in which the first resource is defined by the first event and a location where the missing data is identified, and processing the candidate data to restore the missing data, based on a predetermined restoration scheme.Type: ApplicationFiled: December 4, 2019Publication date: July 2, 2020Inventors: Hye Rim BAE, Sung Hyun SIM, Yu Lim CHOI, Riska Asriana SUTRISNOWATI
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Patent number: 10700246Abstract: A semiconductor light emitting device includes a plurality of light emitting structures, an isolation layer covering side surfaces of the plurality of light emitting structures and insulating the plurality of light emitting structures from one another, a partition layer formed on the isolation layer, a first protective layer covering top surfaces of the plurality of light emitting structures and side walls of the partition layer, a reflective layer covering the first protective layer and disposed on the side walls of the partition layer, and a second protective layer covering the reflective layer.Type: GrantFiled: March 12, 2019Date of Patent: June 30, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sung Hyun Sim, Yong Il Kim, Ha Nul Yoo, Ji Hye Yeon, Jun Bu Youn, Ji Hoon Yun, Su Hyun Jo
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Publication number: 20200194417Abstract: A method of manufacturing a display module includes preparing a first substrate structure including an light-emitting diode (LED) array containing a plurality of LED cells, electrode pads connected to the first and second conductivity-type semiconductor layers, and a first bonding layer covering the LED array; preparing a second substrate structure including a plurality of thin-film transistor (TFT) cells disposed on a second substrate, and each having a source region, a drain region and a gate electrode disposed therebetween, the second substrate structure being provided by forming a circuit region, in which connection portions disposed to correspond to the electrode pads are exposed to one surface thereof, and by forming a second bonding layer covering the circuit region, respectively planarizing the first and second bonding layers, and bonding the first and second substrate structures to each other.Type: ApplicationFiled: February 21, 2020Publication date: June 18, 2020Applicant: Samsung Electronics Co., Ltd.Inventors: Ji Hye Yeon, Su Hyun Jo, Sung Hyun Sim, Ha Nul Yoo, Yong Il Kim, Han Kyu Seong
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Patent number: 10636940Abstract: A semiconductor light-emitting device includes a light-emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, and a magnetic layer on the light-emitting structure. The magnetic layer may have at least one magnetization direction that is parallel to an upper surface of the active layer. The magnetic layer may generate a magnetic field that is parallel to the upper surface of the active layer. The magnetic layer may include multiple structures that may have different magnetization directions. Multiple magnetic layers may be included on the light-emitting structure. A magnetic layer may be on a contact electrode. A magnetic layer may be isolated from a pad electrode.Type: GrantFiled: April 28, 2016Date of Patent: April 28, 2020Assignee: Samsung Electronics Co., Ltd.Inventors: Wan Tae Lim, Yong Il Kim, Nam Goo Cha, Sung Hyun Sim
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Publication number: 20200105980Abstract: A semiconductor light emitting device includes a plurality of light emitting structures, an isolation layer covering side surfaces of the plurality of light emitting structures and insulating the plurality of light emitting structures from one another, a partition layer formed on the isolation layer, a first protective layer covering top surfaces of the plurality of light emitting structures and side walls of the partition layer, a reflective layer covering the first protective layer and disposed on the side walls of the partition layer, and a second protective layer covering the reflective layer.Type: ApplicationFiled: March 12, 2019Publication date: April 2, 2020Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sung Hyun SIM, Yong Il KIM, Ha Nul YOO, Ji Hye YEON, Jun Bu YOUN, Ji Hoon YUN, Su Hyun JO
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Patent number: 10607877Abstract: A chip mounting method includes providing a first substrate including a light transmissive substrate having first and second surfaces, a sacrificial layer provided on the first surface, and a plurality of chips bonded to the sacrificial layer, obtaining first mapping data by testing the chips, the first mapping data defining coordinates of normal chips and defective chips among the chips, disposing a second substrate below the first surface, disposing the normal chips on the second substrate by radiating a first laser beam to positions of the sacrificial layer corresponding to the coordinates of the normal chips, based on the first mapping data, to remove portions of the sacrificial layer thereby separating the normal chips from the light transmissive substrate, and mounting the normal chips on the second substrate by radiating a second laser beam to a solder layer of the second substrate.Type: GrantFiled: January 12, 2018Date of Patent: March 31, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jin Sub Lee, Han Kyu Seong, Yong Il Kim, Sung Hyun Sim, Dong gun Lee
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Patent number: 10573632Abstract: A method of manufacturing a display module includes preparing a first substrate structure including an light-emitting diode (LED) array containing a plurality of LED cells, electrode pads connected to the first and second conductivity-type semiconductor layers, and a first bonding layer covering the LED array; preparing a second substrate structure including a plurality of thin-film transistor (TFT) cells disposed on a second substrate, and each having a source region, a drain region and a gate electrode disposed therebetween, the second substrate structure being provided by forming a circuit region, in which connection portions disposed to correspond to the electrode pads are exposed to one surface thereof, and by forming a second bonding layer covering the circuit region, respectively planarizing the first and second bonding layers, and bonding the first and second substrate structures to each other.Type: GrantFiled: November 9, 2018Date of Patent: February 25, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ji Hye Yeon, Su Hyun Jo, Sung Hyun Sim, Ha Nul Yoo, Yong Il Kim, Han Kyu Seong
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Patent number: 10573628Abstract: A light emitting device package includes a cell array including a plurality of semiconductor light emitting units, and having a first surface and a second surface opposite the first surface, each of the plurality of semiconductor light emitting units having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer stacked on each other.Type: GrantFiled: May 4, 2018Date of Patent: February 25, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Yong Il Kim, Wan Tae Lim, Young Jin Choi, Sung Hyun Sim
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Patent number: 10566382Abstract: A semiconductor light emitting device includes a plurality of light emitting cells including a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer between the first and second conductivity type semiconductor layers, an insulating layer on the plurality of light emitting cells and having a first opening and a second opening defining a first contact region of the first conductivity type semiconductor layer and a second contact region of the second conductivity type semiconductor layer, respectively, in each of the plurality of light emitting cells, a connection electrode on the insulating layer and connecting the first contact region and the second contact region to electrically connect the plurality of light emitting cells to each other, a transparent support substrate on the insulating layer and the connection electrode, and a transparent bonding layer between the insulating layer and the transparent support substrate.Type: GrantFiled: October 20, 2017Date of Patent: February 18, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ji Hye Yeon, Han Kyu Seong, Wan Tae Lim, Sung Hyun Sim, Hanul Yoo