Patents by Inventor Sung-Jae Oh
Sung-Jae Oh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240103076Abstract: A deep learning-based MLCC stacked alignment inspection system includes an integrated defect detection unit configured to detect core areas requiring inspection of image data in which a stacked structure is photographed from a semiconductor MLCC chip by using at least one deep learning-based core area detection model, perform segmentation in the detected core areas, determine whether a defect exists according to a standard margin percentage range, and enable defect detection by generating normal and/or defective data based on the determination result, a result analysis unit configured to perform visualization for respective results of the core area detection, segmentation, and defect detection of the integrated defect detection unit, and provide stepwise analysis data for the visualized respective results so as to determine whether to modify corresponding data, and a data storage configured to store the normal and/or defective data, and stepwise analysis data.Type: ApplicationFiled: November 1, 2022Publication date: March 28, 2024Inventors: Heung-Seon OH, Sung Bin SON, Jun Uk JUNG, Hyun Jae KIM
-
Publication number: 20240081286Abstract: Disclosed is a data collection apparatus for sea creatures including a main body, an antenna, a battery case and a separation unit. The main body includes a sensor assembly configured to collect information about surroundings of a target creature to be recorded, and a battery coupler formed at one side of the main body. The antenna protrudes in one direction from the main body so as to send data to outside. The battery case has a male connector configured such that at least a part thereof is accommodated in the battery coupler so as to be rotatably coupled thereto, and a battery installed in the battery case so as to supply electrical energy to the main body. The separation unit is detachably coupled to the battery case, and is fixed to the target creature to be recorded.Type: ApplicationFiled: October 28, 2022Publication date: March 14, 2024Inventors: Seung Jae Baek, Sung Yong Oh, Yong Jae Kim
-
Publication number: 20240066984Abstract: An electric vehicle and a cruise control method therefore are capable of improving ride comfort by reducing a pitch caused by a road surface deceleration factor. A method of controlling a smart cruise control function includes determining a target speed of a vehicle that is traveling when a road surface deceleration factor in front of the vehicle is detected, entering the road surface deceleration factor while traveling at a constant speed corresponding to the determined target speed, and performing pitch reduction control upon entering the road surface deceleration factor.Type: ApplicationFiled: January 19, 2023Publication date: February 29, 2024Inventors: Sung Jae Oh, Hui Un Son, Seok Min Jeong, Jin Kyeom Cho
-
Publication number: 20230223365Abstract: A semiconductor device including a relatively thin interposer excluding a through silicon hole and a manufacturing method thereof are provided. The method includes forming an interposer on a dummy substrate. The forming of the interposer includes, forming a dielectric layer on the dummy substrate, forming a pattern and a via on the dielectric layer, and forming a seed layer at the pattern and the via of the dielectric layer and forming a redistribution layer and a conductive via on the seed layer. A semiconductor die is connected with the conductive via facing an upper portion of the interposer, and the semiconductor die is encapsulated with an encapsulant. The dummy substrate is removed from the interposer. A bump is connected with the conductive via facing a lower portion of the interposer.Type: ApplicationFiled: December 12, 2022Publication date: July 13, 2023Inventors: Jong Sik Paek, Won Chul Do, Doo Hyun Park, Eun Ho Park, Sung Jae Oh
-
Patent number: 11673568Abstract: A method for providing engine start information for a hybrid electric vehicle includes determining a likelihood of engine start for each of a plurality of reasons for engine start, and displaying a reason for engine start having a highest likelihood of engine start from among the plurality of reasons for engine start and engine start information including the highest likelihood of engine start in consideration of a type of at least one reason for engine start and a level of the likelihood of engine start.Type: GrantFiled: November 9, 2020Date of Patent: June 13, 2023Assignees: Hyundai Motor Company, Kia Motors CorporationInventors: Sung Bae Jeon, Jae Ho Lee, Song Il Park, Sung Jae Oh, Hui Un Son, Min Gyu Heo, Jin Kyeom Cho
-
Publication number: 20230056209Abstract: Disclosed is a vehicle strut insulator that includes first and second bushes (100 and 200) having different hardness characteristics. The first bush (100) having a relatively high hardness is disposed in a left-right direction of a vehicle that affects the handling performance, and the second bush (200) having a relatively low hardness is disposed in a forward-backward direction of the vehicle that affects the ride comfort. Accordingly, the vehicle strut insulator can satisfy both requirements for handling performance, ride comfort and road noise performance.Type: ApplicationFiled: July 19, 2022Publication date: February 23, 2023Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Sung Jae Oh, Sang Hoon Yoo
-
Patent number: 11584355Abstract: Disclosed is a method of controlling a hybrid electric vehicle having a transmission, an engine, and first and second drive motors. The method includes: performing charging through the first drive motor using the power of the engine by engaging an engine clutch disposed between the engine and the first drive motor while a vehicle is stopped with the gear stage shifted to the parking (P) range; turning off the engine and controlling the clutch of the transmission to enter an open state when the gear stage is shifted to the driving (D) range; and commencing movement of the vehicle using the second drive motor alone or using at least one of the first drive motor or the engine together with the second drive motor based on at least one of requested torque, available torque of the second drive motor, or the speed of the first drive motor.Type: GrantFiled: December 4, 2020Date of Patent: February 21, 2023Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATIONInventors: Jin Kyeom Cho, Hui Un Son, Gyu Ri Lee, Sung Bae Jeon, Sung Jae Oh, Myung Woo Kim, Yeon Bok Kim, Yeong Jin Cho
-
Publication number: 20230002217Abstract: In one example, an electronic device can comprise (a) a first substrate comprising a first encapsulant extending from the first substrate bottom side to the first substrate top side, and a first substrate interconnect extending from the substrate bottom side to the substrate top side and coated by the first encapsulant, (b) a first electronic component embedded in the first substrate and comprising a first component sidewall coated by the first encapsulant, (c) a second electronic component coupled to the first substrate top side, (d) a first internal interconnect coupling the second electronic component to the first substrate interconnect, and (e) a cover structure on the first substrate and covering the second component sidewall and the first internal interconnect. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: July 12, 2022Publication date: January 5, 2023Inventor: Sung Jae Oh
-
Patent number: 11527496Abstract: A semiconductor device including a relatively thin interposer excluding a through silicon hole and a manufacturing method thereof are provided. The method includes forming an interposer on a dummy substrate. The forming of the interposer includes, forming a dielectric layer on the dummy substrate, forming a pattern and a via on the dielectric layer, and forming a seed layer at the pattern and the via of the dielectric layer and forming a redistribution layer and a conductive via on the seed layer. A semiconductor die is connected with the conductive via facing an upper portion of the interposer, and the semiconductor die is encapsulated with an encapsulant. The dummy substrate is removed from the interposer. A bump is connected with the conductive via facing a lower portion of the interposer.Type: GrantFiled: June 2, 2020Date of Patent: December 13, 2022Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.Inventors: Jong Sik Paek, Won Chul Do, Doo Hyun Park, Eun Ho Park, Sung Jae Oh
-
Patent number: 11383970Abstract: In one example, an electronic device can comprise (a) a first substrate comprising a first encapsulant extending from the first substrate bottom side to the first substrate top side, and a first substrate interconnect extending from the substrate bottom side to the substrate top side and coated by the first encapsulant, (b) a first electronic component embedded in the first substrate and comprising a first component sidewall coated by the first encapsulant, (c) a second electronic component coupled to the first substrate top side, (d) a first internal interconnect coupling the second electronic component to the first substrate interconnect, and (e) a cover structure on the first substrate and covering the second component sidewall and the first internal interconnect. Other examples and related methods are also disclosed herein.Type: GrantFiled: July 9, 2019Date of Patent: July 12, 2022Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.Inventor: Sung Jae Oh
-
Publication number: 20220009476Abstract: Disclosed is a method of controlling a hybrid electric vehicle having a transmission, an engine, and first and second drive motors. The method includes: performing charging through the first drive motor using the power of the engine by engaging an engine clutch disposed between the engine and the first drive motor while a vehicle is stopped with the gear stage shifted to the parking (P) range; turning off the engine and controlling the clutch of the transmission to enter an open state when the gear stage is shifted to the driving (D) range; and commencing movement of the vehicle using the second drive motor alone or using at least one of the first drive motor or the engine together with the second drive motor based on at least one of requested torque, available torque of the second drive motor, or the speed of the first drive motor.Type: ApplicationFiled: December 4, 2020Publication date: January 13, 2022Applicants: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATIONInventors: Jin Kyeom CHO, Hui Un SON, Gyu Ri LEE, Sung Bae JEON, Sung Jae OH, Myung Woo KIM, Yeon Bok KIM, Yeong Jin CHO
-
Publication number: 20210179129Abstract: A method for providing engine start information for a hybrid electric vehicle includes determining a likelihood of engine start for each of a plurality of reasons for engine start, and displaying a reason for engine start having a highest likelihood of engine start from among the plurality of reasons for engine start and engine start information including the highest likelihood of engine start in consideration of a type of at least one reason for engine start and a level of the likelihood of engine start.Type: ApplicationFiled: November 9, 2020Publication date: June 17, 2021Inventors: Sung Bae Jeon, Jae Ho Lee, Song Il Park, Sung Jae Oh, Hui Un Son, Min Gyu Heo, Jin Kyeom Cho
-
Publication number: 20210020591Abstract: A semiconductor device including a relatively thin interposer excluding a through silicon hole and a manufacturing method thereof are provided. The method includes forming an interposer on a dummy substrate. The forming of the interposer includes, forming a dielectric layer on the dummy substrate, forming a pattern and a via on the dielectric layer, and forming a seed layer at the pattern and the via of the dielectric layer and forming a redistribution layer and a conductive via on the seed layer. A semiconductor die is connected with the conductive via facing an upper portion of the interposer, and the semiconductor die is encapsulated with an encapsulant. The dummy substrate is removed from the interposer. A bump is connected with the conductive via facing a lower portion of the interposer.Type: ApplicationFiled: June 2, 2020Publication date: January 21, 2021Inventors: Jong Sik Paek, Won Chul Do, Doo Hyun Park, Eun Ho Park, Sung Jae Oh
-
Publication number: 20210009406Abstract: In one example, an electronic device can comprise (a) a first substrate comprising a first encapsulant extending from the first substrate bottom side to the first substrate top side, and a first substrate interconnect extending from the substrate bottom side to the substrate top side and coated by the first encapsulant, (b) a first electronic component embedded in the first substrate and comprising a first component sidewall coated by the first encapsulant, (c) a second electronic component coupled to the first substrate top side, (d) a first internal interconnect coupling the second electronic component to the first substrate interconnect, and (e) a cover structure on the first substrate and covering the second component sidewall and the first internal interconnect. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: July 9, 2019Publication date: January 14, 2021Inventor: Sung Jae Oh
-
Patent number: 10679952Abstract: A semiconductor device including a relatively thin interposer excluding a through silicon hole and a manufacturing method thereof are provided. The method includes forming an interposer on a dummy substrate. The forming of the interposer includes, forming a dielectric layer on the dummy substrate, forming a pattern and a via on the dielectric layer, and forming a seed layer at the pattern and the via of the dielectric layer and forming a redistribution layer and a conductive via on the seed layer. A semiconductor die is connected with the conductive via facing an upper portion of the interposer, and the semiconductor die is encapsulated with an encapsulant. The dummy substrate is removed from the interposer. A bump is connected with the conductive via facing a lower portion of the interposer.Type: GrantFiled: February 10, 2017Date of Patent: June 9, 2020Assignee: Amkor Technology, Inc.Inventors: Jong Sik Paek, Won Chul Do, Doo Hyun Park, Eun Ho Park, Sung Jae Oh
-
Patent number: 9728514Abstract: A semiconductor device including a relatively thin interposer excluding a through silicon hole and a manufacturing method thereof are provided. The method includes forming an interposer on a dummy substrate. The forming of the interposer includes, forming a dielectric layer on the dummy substrate, forming a pattern and a via on the dielectric layer, and forming a seed layer at the pattern and the via of the dielectric layer and forming a redistribution layer and a conductive via on the seed layer. A semiconductor die is connected with the conductive via facing an upper portion of the interposer, and the semiconductor die is encapsulated with an encapsulant. The dummy substrate is removed from the interposer. A bump is connected with the conductive via facing a lower portion of the interposer.Type: GrantFiled: July 11, 2016Date of Patent: August 8, 2017Assignee: AMKOR TECHNOLOGY, INC.Inventors: Jong Sik Paek, Won Chul Do, Doo Hyun Park, Eun Ho Park, Sung Jae Oh
-
Publication number: 20170154861Abstract: A semiconductor device including a relatively thin interposer excluding a through silicon hole and a manufacturing method thereof are provided. The method includes forming an interposer on a dummy substrate. The forming of the interposer includes, forming a dielectric layer on the dummy substrate, forming a pattern and a via on the dielectric layer, and forming a seed layer at the pattern and the via of the dielectric layer and forming a redistribution layer and a conductive via on the seed layer. A semiconductor die is connected with the conductive via facing an upper portion of the interposer, and the semiconductor die is encapsulated with an encapsulant. The dummy substrate is removed from the interposer. A bump is connected with the conductive via facing a lower portion of the interposer.Type: ApplicationFiled: February 10, 2017Publication date: June 1, 2017Inventors: Jong Sik Paek, Won Chul Do, Doo Hyun Park, Eun Ho Park, Sung Jae Oh
-
Patent number: 9667204Abstract: A power amplification apparatus includes a multiple output bias voltage generation unit, a dynamic bias modulator, and a power amplifier. The multiple output bias voltage generation unit generates first and second bias voltages using an inductor coupled between an input voltage and a plurality of capacitors. The capacitors are connected to the inductor in a non-overlapping manner. The dynamic bias modulator outputs the first bias voltage or the second bias voltage as a variable bias voltage based on results of comparing voltage of an envelope signal of a radio frequency (RF) signal to an envelope reference voltage. The power amplifier is biased in response to the variable bias voltage, amplifies power of the RF signal, and outputs the amplified RF signal to an antenna.Type: GrantFiled: May 3, 2016Date of Patent: May 30, 2017Assignee: Research & Business Foundation Sungkyunkwan UniversityInventors: Youngoo Yang, Jong Seok Bae, Sung Jae Oh, Soo Ho Cho
-
Publication number: 20170040955Abstract: A power amplification apparatus includes a multiple output bias voltage generation unit, a dynamic bias modulator, and a power amplifier. The multiple output bias voltage generation unit generates first and second bias voltages using an inductor coupled between an input voltage and a plurality of capacitors. The capacitors are connected to the inductor in a non-overlapping manner. The dynamic bias modulator outputs the first bias voltage or the second bias voltage as a variable bias voltage based on results of comparing voltage of an envelope signal of a radio frequency (RF) signal to an envelope reference voltage. The power amplifier is biased in response to the variable bias voltage, amplifies power of the RF signal, and outputs the amplified RF signal to an antenna.Type: ApplicationFiled: May 3, 2016Publication date: February 9, 2017Applicant: RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITYInventors: Youngoo YANG, Jong Seok BAE, Sung Jae OH, Soo Ho CHO
-
Publication number: 20160322317Abstract: A semiconductor device including a relatively thin interposer excluding a through silicon hole and a manufacturing method thereof are provided. The method includes forming an interposer on a dummy substrate. The forming of the interposer includes, forming a dielectric layer on the dummy substrate, forming a pattern and a via on the dielectric layer, and forming a seed layer at the pattern and the via of the dielectric layer and forming a redistribution layer and a conductive via on the seed layer. A semiconductor die is connected with the conductive via facing an upper portion of the interposer, and the semiconductor die is encapsulated with an encapsulant. The dummy substrate is removed from the interposer. A bump is connected with the conductive via facing a lower portion of the interposer.Type: ApplicationFiled: July 11, 2016Publication date: November 3, 2016Inventors: Jong Sik Paek, Won Chul Do, Doo Hyun Park, Eun Ho Park, Sung Jae Oh