Abstract: A collecting plate is disclosed. The collecting plate includes a body having a plurality of holes arranged in an array and a plurality of mitt members respectively disposed over the plurality of holes. The holes and the mitt members are configured to capture and store contaminant particle and prevent contaminant particles from entering processing chamber.

Abstract: The display device according to the present invention comprises: a printed circuit board on which a plurality of LEDs are mounted; a frame comprising a front surface for supporting the printed circuit board; and a cover member which covers the rear surface of the frame and comprises a plurality of outlets, wherein the frame comprises a first area extending from the front surface towards the rear surface, and a second area having pores and formed between the first area and the rear surface, and is provided to convect heat generated in the printed circuit board to the outlets via the first area and the pores.

Abstract: A heat processing system is disclosed. The heat processing system includes an enclosure, a heater, and a plurality of valves disposed on the enclosure. The heater is used to increase temperature within the enclosure. The plurality of valves have different sizes to uniformly and efficiently control the cooling within the enclosure.

Abstract: Disclosed are a display panel and a display device using the same. The display panel includes a semiconductor layer within a substrate and grounds electric charges entered from the outside through the semiconductor layer, thus protecting an array provided on the substrate and improving the reliability of the display device.

Abstract: A semiconductor structure is disclosed. The semiconductor structure includes a base layer and an etch stop layer having a plurality of elements and in physical contact with the base layer. The etch stop layer have a Boron (B) element configured to improve the etch profile of the etch stop layer.

Abstract: A display device is discussed, which has improved transmittance and relieves a visual difference in a camera region, even though a camera is provided in an active region, by changing the configuration of a substrate in a region corresponding to the camera.

Abstract: The instant disclosure discloses method comprising receiving a substrate; disposing a dielectric layer over the substrate; disposing a metallic material on the dielectric layer; disposing a passivation layer on top surface of the metallic material; and performing an alloy layer formation process to dispose a SiGe layer across top surface of the passivation layer.

Abstract: An outdoor display apparatus having a heat dissipation structure includes a first display module configured to display an image in a first direction, a second display module configured to display an image in a second direction opposite to the first direction, a housing configured to accommodate the first display module and the second display module, and having an inlet and an outlet, and a heat exchange device configured to receive heat from one of the first display module and the second display module and perform heat exchange, wherein the heat exchange device includes: a first heat exchange portion having at least one cooling passage to cool the first display module; a second heat exchange portion having at least one cooling passage to cool the second display module; and a heat exchanger configured to be selectively shared by the first heat exchange portion and the second heat exchange portion.

Abstract: A heat processing system is disclosed. The heat processing system includes an enclosure, a heater, and a plurality of valves disposed on the enclosure. The heater is used to increase temperature within the enclosure. The plurality of valves have different sizes to uniformly and efficiently control the cooling within the enclosure.

Abstract: A method for preventing a collision in a wafer processing system is provided. The method includes aligning a first sensor and a second sensor. The first sensor is disposed on a predetermined position of an elevating member connected to a bottom of a vertical wafer boat of the wafer processing system, and the second sensor is disposed on a shutter of a chamber of the wafer processing system. The method further includes activating the first sensor and the second sensor to monitor a path alongside the vertical wafer boat when the chamber is closed by the shutter.

Abstract: A vertical wafer boat for a diffusion process is provided. The vertical wafer boat includes a plurality of wafer racks. Each of the plurality of wafer racks includes a vertical support member and a plurality of wafer support arms. The plurality of wafer support arms extends from a sidewall of the vertical support member. Each of the wafer support arms includes a support body and a ledge. The support body is located between the vertical support member and the ledge. Centers of the support body and the ledge are horizontally aligned. A vertical thickness of the ledge is smaller than a vertical thickness of the support body.

Abstract: Disclosed herein is an outdoor display apparatus having a heat-radiating structure. The outdoor display apparatus includes a housing; a display module disposed inside the housing, and including a display panel on which an image is displayed; a heat-exchange module disposed on a rear surface of the display module, and configured to concentrate heat inside the housing on a rear surface of the display panel and discharge heat out of the housing; a protective glass disposed to correspond to a display area of the display panel, and configured to transmit infrared light; and a flow path formed inside the housing such that air flowing along the flow path transfers heat from the display panel to the heat-exchange module.

Abstract: A liquid crystal display device includes a liquid crystal display panel, a light guide plate disposed on a lower part of the liquid crystal display panel, an LED circuit substrate disposed along at least one side of the light guide plate to accommodate an LED on a front surface thereof, and a heat transmission member having a first part that faces a lower surface of the light guide plate and a second part that is extendedly bent from the first part and faces the LED circuit substrate.

Abstract: A collecting plate is disclosed. The collecting plate includes a body having a plurality of holes arranged in an array and a plurality of mitt members respectively disposed over the plurality of holes. The holes and the mitt members are configured to capture and store contaminant particle and prevent contaminant particles from entering processing chamber.

Abstract: The instant disclosure discloses method comprising receiving a substrate; disposing a dielectric layer over the substrate; disposing a metallic material on the dielectric layer; disposing a passivation layer on top surface of the metallic material; and performing an alloy layer formation process to dispose a SiGe layer across top surface of the passivation layer.

Abstract: A method of forming an oxide structure is disclosed. The method includes forming trenches on a top surface of a substrate and performing a surface treatment process on the substrate. The surface treatment includes forming an amorphous layer on the substrate, removing a portion of the amorphous layer to form a liner layer, and forming a dielectric liner on the liner layer. The liner layer formed are substantially uniform in thickness to prevent contamination and pinhole defects on the oxide structure.

Abstract: A semiconductor structure is disclosed. The semiconductor structure includes a base layer and an etch stop layer having a plurality of elements and in physical contact with the base layer. The etch stop layer have a Boron (B) element configured to improve the etch profile of the etch stop layer.

Abstract: The instant disclosure includes an implanting apparatus and a method thereof. The implanting apparatus has a chuck configured to carry a substrate is rotated a number of times at an angle during ion implantation. In this way, masks used during semiconductor fabrication is reduced.

Abstract: The instant disclosure discloses a semiconductor device comprising a substrate having a cell region; a device layer over the substrate; a plurality of capacitor lower electrodes over the device layer in the cell region, each of the capacitor lower electrodes has a U-shaped profile defining an inner surface in a cross section; a capacitor dielectric liner on the inner surfaces of the capacitor lower electrodes; and a SiGe layer over the capacitor dielectric liner, wherein the SiGe layer has a Ge concentration distribution that has a greatest value at a middle portion of the SiGe layer and decreases there-from upwardly and downwardly along a thickness direction.

Abstract: Provided is a display apparatus capable of enhancing the cooling efficiency. The display apparatus includes a display on which an image is to be displayed and a cooling device configured to discharge air from a rear side of the display by a fan. The cooling device includes a first fluid passage forming a first fluid flow at the rear side of the display and a second fluid passage forming a second fluid flow introduced from a periphery of the first fluid passage at the rear side of the display, to increase a flux of air discharged toward the display by the fan.