Abstract: A method of an aerial vehicle for urban air mobility may include: reporting, to a first base station, a measurement result for neighboring base stations including a second base station; receiving, from the first base station and as a processing result based on the measurement result, an indication of a failure of a handover to the second base station; requesting, to a control station, first location information indicating a first location to move according to the failure of the handover; receiving the first location information from the control station; and moving according to the received first location information.

Abstract: The present disclosure relates to an organometallic compound having the following structure of Chemical Formula 1, Ir(LA)m(LB)n, an organic light emitting diode (OLED) where the organometallic compound is applied to an emitting material layer and an organic light emitting device. The luminous efficiency, color purity and luminous lifespan of the OLED and the organic light emitting device can be improved.

Abstract: A composition for an organic optoelectronic device an organic optoelectronic device, and a display device, the composition including a first compound; a second compound; and a third compound, wherein the first compound, the second compound, and the third compound are different from each other, the first compound is represented by Chemical Formula I, the second compound is represented by Chemical Formula I, and the third compound is represented by Chemical Formula II or Chemical Formula III:

Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide methods for manufacturing a semiconductor device, and semiconductor devices produced thereby, that comprise forming an interposer including a reinforcement layer.

Abstract: An apparatus for predicting performance of a wheel in a vehicle: includes a learning device that generates a latent space for a plurality of two-dimensional (2D) wheel images based on a convolutional autoencoder (CAE), extracts a predetermined number of the plurality of 2D wheel images from the latent space, and learns a dataset having the plurality of 2D wheel images and performance values corresponding to the plurality of 2D wheel images; and a controller that predicts performance for the plurality of 2D wheel images based on a performance prediction model obtained by the learning device.

Abstract: A semiconductor device including a first interlayer insulating film; a conductive pattern in the first interlayer insulating film; a resistance pattern on the conductive pattern; an upper etching stopper film spaced apart from the resistance pattern, extending in parallel with a top surface of the resistance pattern, and including a first metal; a lower etching stopper film on the conductive pattern, extending in parallel with a top surface of the first interlayer insulating film, and including a second metal; and a second interlayer insulating film on the upper etching stopper film and the lower etching stopper film, wherein a distance from a top surface of the second interlayer insulating film to a top surface of the upper etching stopper film is smaller than a distance from the top surface of the second interlayer insulating film to a top surface of the lower etching stopper film.

Abstract: The present invention relates to an antibacterial peptide and an antibacterial compound targeting the Klebsiella pneumoniae VapBC toxin-antitoxin system, or their use.

Abstract: Disclosed herein is an untact DC electric-field sensor having improved sensitivity. The untact DC electric-field sensor has a circuit composed of a variable capacitor and an RF generator and improves sensitivity through resonance of the circuit by connecting an inductor to the sensor.

Abstract: The present invention provides methods for treating or ameliorating metabolic diseases, cholestatic liver diseases, or organ fibrosis, which comprises administering to a subject a therapeutically effective amount of a pharmaceutical composition comprising an isoxazole derivative, a racemate, an enantiomer, or a diastereoisomer thereof, or a pharmaceutically acceptable salt of the derivative, the racemate, the enantiomer, or the diastereoisomer.

Abstract: The present invention relates to a method for screening a cytokine having anticancer activity that inhibits the exosome secretion or suppresses the expression of PD-L1, wherein a vector composed of gene encoding cytokine, linker domain, and transmembrane domain transforms into cancer cells, and cytokine exhibiting anticancer activity can be selected, and thus the selected cytokine is provided as a new anticancer agent. In addition, the present invention relates to composition for preventing or treating cancer diseases, the composition comprising IL-15, selected using the above-mentioned screening technique, or expression promoter or activator thereof as an active ingredient. In the present invention, it was found that treating cancer cells with IL-15 suppresses exosome secretion and the expression of PD-L1, and it was also found that the anticancer effect is directly exhibited on the cancer cells. Therefore, IL-15 or expression promoter or activator can be effectively used to prevent or treat cancer diseases.

Abstract: The present invention relates to a peptide targeting a toxin-antitoxin system of Mycobacterium tuberculosis and a use thereof. Specifically, the antibiotic peptide of the present invention inhibits the formation of a toxin-antitoxin complex of Mycobacterium tuberculosis without affecting an active site of the toxin, thereby inducing the death of Mycobacterium tuberculosis by means of a separated toxin. Therefore, the antibiotic peptide can be usefully used as an antibiotic composition against Mycobacterium tuberculosis.

Abstract: An integrated circuit (IC) chip includes a via contact plug extending inside a through hole passing through a substrate and a device layer, a via contact liner surrounding the via contact plug, a connection pad liner extending along a bottom surface of the substrate, a dummy bump structure integrally connected to the via contact plug, and a bump structure connected to the connection pad liner. A method of manufacturing an IC chip includes forming an under bump metallurgy (UBM) layer inside and outside the through hole and forming a first connection metal layer, a second connection metal layer, and a third connection metal layer. The first connection metal layer covers the UBM layer inside the through hole, the second connection metal layer is integrally connected to the first connection metal layer, and the third connection metal layer covers the UBM layer on the connection pad liner.

Abstract: The present invention relates to a peptide targeting a toxin-antitoxin system of Mycobacterium tuberculosis and a use thereof. Specifically, the antibiotic peptide of the present invention inhibits the formation of a toxin-antitoxin complex of Mycobacterium tuberculosis without affecting an active site of the toxin, thereby inducing the death of Mycobacterium tuberculosis by means of a separated toxin. Therefore, the antibiotic peptide can be usefully used as an antibiotic composition against Mycobacterium tuberculosis.

Abstract: Provided is a 3D printer having a residual powder removal device, including: a cabinet configured to form an exterior and protect a plurality of parts embedded therein, a chamber configured to form a printing space where a 3D part is formed by being irradiated with a laser from a laser irradiator inside the cabinet, a concentration measurer configured to measure a concentration of metal powder scattered inside the chamber, a powder transfer unit configured to transfer the metal powder from inside the chamber, and a residual powder removal device configured to spray an inert gas into the chamber to forcibly scatter cohered metal powder, discharge the metal powder scattered inside the chamber to the outside along with the inert gas, and cause the metal powder to pass through a filter assembly so that the metal powder is filtered and the residual metal powder is removed from inside the chamber.

Abstract: The present invention relates to a peptide targeting a toxin-antitoxin system of Mycobacterium tuberculosis and a use thereof. Specifically, the antibiotic peptide of the present invention inhibits the formation of a toxin-antitoxin complex of Mycobacterium tuberculosis without affecting an active site of the toxin, thereby inducing the death of Mycobacterium tuberculosis by means of a separated toxin. Therefore, the antibiotic peptide can be usefully used as an antibiotic composition against Mycobacterium tuberculosis.

Abstract: A method of manufacturing a semiconductor device includes providing a substrate including a first region and a second region, forming a first channel layer in the first region of the substrate, forming an isolation region in the substrate to electrically isolate a portion of the first region from a portion of the second region, etching an upper surface of the second region of the substrate, forming a protection layer covering the first channel layer in the first region of the substrate and the second region of the substrate, removing the protection layer on the second region of the substrate, forming a gate insulation material layer on the protection layer and on the second region of the substrate, and removing the gate insulation material layer and the protection layer on the first region of the substrate.

Abstract: An integrated circuit (IC) chip includes a via contact plug extending inside a through hole passing through a substrate and a device layer, a via contact liner surrounding the via contact plug, a connection pad liner extending along a bottom surface of the substrate, a dummy bump structure integrally connected to the via contact plug, and a bump structure connected to the connection pad liner. A method of manufacturing an IC chip includes forming an under bump metallurgy (UBM) layer inside and outside the through hole and forming a first connection metal layer, a second connection metal layer, and a third connection metal layer. The first connection metal layer covers the UBM layer inside the through hole, the second connection metal layer is integrally connected to the first connection metal layer, and the third connection metal layer covers the UBM layer on the connection pad liner.

Abstract: An integrated circuit (IC) chip includes a via contact plug extending inside a through hole passing through a substrate and a device layer, a via contact liner surrounding the via contact plug, a connection pad liner extending along a bottom surface of the substrate, a dummy bump structure integrally connected to the via contact plug, and a bump structure connected to the connection pad liner. A method of manufacturing an IC chip includes forming an under bump metallurgy (UBM) layer inside and outside the through hole and forming a first connection metal layer, a second connection metal layer, and a third connection metal layer. The first connection metal layer covers the UBM layer inside the through hole, the second connection metal layer is integrally connected to the first connection metal layer, and the third connection metal layer covers the UBM layer on the connection pad liner.

Abstract: A semiconductor device includes first to fourth cells sequentially disposed on a substrate, first to third diffusion break structures, a first fin structure configured to protrude from the substrate, the first fin structure comprising first to fourth fins separated from each other by the first to third diffusion break structures, a second fin structure configured to protrude from the substrate, to be spaced apart from the first fin structure, the second fin structure comprising fifth to eighth fins separated from each other by the first to third diffusion break structures, the first to fourth gate electrodes being disposed in the first to fourth cells, respectively, and the number of fins in one cell of the first to fourth cells is different from the number of fins in an other cell of the first to fourth cells.

Abstract: A method of manufacturing a semiconductor device includes providing a substrate including a first region and a second region, forming a first channel layer in the first region of the substrate, forming an isolation region in the substrate to electrically isolate a portion of the first region from a portion of the second region, etching an upper surface of the second region of the substrate, forming a protection layer covering the first channel layer in the first region of the substrate and the second region of the substrate, removing the protection layer on the second region of the substrate, forming a gate insulation material layer on the protection layer and on the second region of the substrate, and removing the gate insulation material layer and the protection layer on the first region of the substrate.