Patents by Inventor Sung Ok Kim
Sung Ok Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240143940Abstract: The present invention relates to a context-based QA generation architecture, and an object of the present invention is to generate diverse QA pairs from a single context. To achieve the object, the present invention includes a latent variable generating network including at least one encoder and an artificial neural network (Multi-Layer Perceptron: MLP) and configured to train the artificial neural network using a first context, a first question, and a first answer, and generate a second question latent variable and a second answer latent variable by applying the trained artificial neural network to a second context, an answer generating network configured to generate a second answer by decoding the second answer latent variable, and a question generating network configured to generate a second question based on a second context and the second answer.Type: ApplicationFiled: December 18, 2023Publication date: May 2, 2024Inventors: Dong Hwan KIM, Sung Ju HWANG, Seanie LEE, Dong Bok LEE, Woo Tae JEONG, Han Su KIM, You Kyung KWON, Hyun Ok KIM
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Publication number: 20240120137Abstract: A mounting jig for manufacturing a tiling display device can include a supporting member, a plurality of jig magnets fixed to the supporting member, a hinge structure configured to rotate the plurality of jig magnets, and a guard rail configured to rotate in response to a rotation of the plurality of jig magnets, to reduce damage caused during detachment or attachment. The tiling display device includes a plurality of display devices disposed in the form of tiles. Each of the plurality of display devices includes a plurality of display elements, a plurality of circuits, a plurality of lines and a plurality of parts. The plurality of display elements can be a light emitting diode (LED) or a micro-LED including an n-type semiconductor layer, a p-type semiconductor layer, and a light emitting layer.Type: ApplicationFiled: December 18, 2023Publication date: April 11, 2024Applicant: LG Display Co., Ltd.Inventors: Han Seok KIM, Sung Hwan YOON, Sang Ok SEON, Jae Jun KIM
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Publication number: 20220057444Abstract: A semiconductor package test apparatus is provided. A semiconductor package test apparatus comprises a test board including a plurality of sensors, a chamber into which the test board is loaded, and a controller configured to control a temperature of the chamber, wherein the controller adjusts the temperature using the plurality of sensors.Type: ApplicationFiled: August 19, 2021Publication date: February 24, 2022Applicant: Samsung Electronics Co., Ltd.Inventors: Sung Ok KIM, Min Woo KIM, Ho Gyung KIM, Dahm YU, Jae Hyun KIM
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Patent number: 9880418Abstract: A display apparatus is provided. The display apparatus includes a display panel, a substrate, and a bottom chassis. The substrate is provided with light sources to emit light towards the display panel. The substrate includes a fixing hole formed between the light sources. The substrate is coupled to the bottom chassis. The bottom chassis includes a fixing protrusion to be coupled to the fixing hole. The fixing protrusion is formed with the bottom chassis to have a detachment prevention structure so that the fixing protrusion is prevented from being detached from the fixing hole.Type: GrantFiled: February 1, 2016Date of Patent: January 30, 2018Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jae Kwon Lee, Sung Ok Kim, Dea Woo Ryu, Yong Gil Lee, Chang Ho Cho
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Publication number: 20160223866Abstract: A display apparatus is provided. The display apparatus includes a display panel, a substrate, and a bottom chassis. The substrate is provided with light sources to emit light towards the display panel. The substrate includes a fixing hole formed between the light sources. The substrate is coupled to the bottom chassis. The bottom chassis includes a fixing protrusion to be coupled to the fixing hole. The fixing protrusion is formed with the bottom chassis to have a detachment prevention structure so that the fixing protrusion is prevented from being detached from the fixing hole.Type: ApplicationFiled: February 1, 2016Publication date: August 4, 2016Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jae Kwon LEE, Sung Ok KIM, Dea Woo RYU, Yong Gil LEE, Chang Ho CHO
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Patent number: 7602172Abstract: A test apparatus includes one handler connected to a tester and one test board divided into two or more sites or two or more test boards. Since only the sites on the test board (or test boards) need be duplicated, rather than the loading lanes or sorters of the handler, the test apparatus can be conveniently compact. Further, while testing semiconductor devices on one site or one test board, semiconductor devices in another site or on another test board can be sorted according to the test result. This enables the reduction or elimination of tester idle time to optimize the efficiency of the test apparatus.Type: GrantFiled: April 24, 2008Date of Patent: October 13, 2009Assignee: Samsung Electronics Co., Ltd.Inventors: Ae-Yong Chung, Sung-Ok Kim, Kyeong-Seon Shin, Jeong-Ho Bang
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Publication number: 20090140761Abstract: A method of testing a semiconductor device, which can reduce a period of time for testing a packaged semiconductor chip. First, semiconductor chips to be tested are classified in a lot unit. The semiconductor chips are fist tested in units of lots. The defective semiconductor chips among the semiconductor chips of a predetermined number of lots that are first time tested are collectively retested. First test data regarding the semiconductor chips may be classified and stored for each respective lot. Retest data regarding the semiconductor chips may be classified and stored for each respective lot. Test data regarding the semiconductor chips may be classified and stored into first test data and retest data for each respective lot.Type: ApplicationFiled: October 22, 2008Publication date: June 4, 2009Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sung-Ok KIM, Ae-Yong CHUNG, Se-Rae CHO, Chul-Min LEE, Eun-Seok LEE
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Publication number: 20080197874Abstract: A test apparatus includes one handler connected to a tester and one test board divided into two or more sites or two or more test boards. Since only the sites on the test board (or test boards) need be duplicated, rather than the loading lanes or sorters of the handler, the test apparatus can be conveniently compact. Further, while testing semiconductor devices on one site or one test board, semiconductor devices in another site or on another test board can be sorted according to the test result. This enables the reduction or elimination of tester idle time to optimize the efficiency of the test apparatus.Type: ApplicationFiled: April 24, 2008Publication date: August 21, 2008Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ae-Yong CHUNG, Sung-Ok KIM, Kyeong-Seon SHIN, Jeong-Ho BANG
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Test system of semiconductor device having a handler remote control and method of operating the same
Patent number: 7408339Abstract: A test system of a semiconductor device for a handler remote control is provided. The system includes: a tester for testing the semiconductor device; a handler connected to the tester through a GPIB (General Purpose Instruction Bus) communication cable; a tester server connected to the tester to download a test program, handler remote control program and a handler state check program to the tester; and communication data transmitted and received through the GPIB communication cable between the tester and the handler, wherein the communication data has basic communication data for an electrical test of the semiconductor device, communication data for the handler remote control, and communication data for a handler state check.Type: GrantFiled: May 15, 2007Date of Patent: August 5, 2008Assignee: Samsung Electronics Co., Ltd.Inventors: Ae-Yong Chung, Eun-Seok Lee, Jeong-Ho Bang, Kyeong-Seon Shin, Dae-Gab Chi, Sung-Ok Kim -
Patent number: 7378864Abstract: A test apparatus includes one handler connected to a tester and one test board divided into two or more sites or two or more test boards. Since only the sites on the test board (or test boards) need be duplicated, rather than the loading lanes or sorters of the handler, the test apparatus can be conveniently compact. Further, while testing semiconductor devices on one site or one test board, semiconductor devices in another site or on another test board can be sorted according to the test result. This enables the reduction or elimination of tester idle time to optimize the efficiency of the test apparatus.Type: GrantFiled: March 28, 2005Date of Patent: May 27, 2008Assignee: Samsung Electronics Co., Ltd.Inventors: Ae-Yong Chung, Sung-Ok Kim, Kyeong-Seon Shin, Jeong-Ho Bang
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TEST SYSTEM OF SEMICONDUCTOR DEVICE HAVING A HANDLER REMOTE CONTROL AND METHOD OF OPERATING THE SAME
Publication number: 20070290707Abstract: A test system of a semiconductor device for a handler remote control is provided. The system includes: a tester for testing the semiconductor device; a handler connected to the tester through a GPIB (General Purpose Instruction Bus) communication cable; a tester server connected to the tester to download a test program, handler remote control program and a handler state check program to the tester; and communication data transmitted and received through the GPIB communication cable between the tester and the handler, wherein the communication data has basic communication data for an electrical test of the semiconductor device, communication data for the handler remote control, and communication data for a handler state check.Type: ApplicationFiled: May 15, 2007Publication date: December 20, 2007Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ae-Yong CHUNG, Eun-Seok LEE, Jeong-Ho BANG, Kyeong-Seon SHIN, Dae-Gab CHI, Sung-Ok KIM -
Test system of semiconductor device having a handler remote control and method of operating the same
Patent number: 7230417Abstract: A test system of a semiconductor device for a handler remote control is provided. The system includes: a tester for testing the semiconductor device; a handler connected to the tester through a GPIB (General Purpose Instruction Bus) communication cable; a tester server connected to the tester to download a test program, handler remote control program and a handler state check program to the tester; and communication data transmitted and received through the GPIB communication cable between the tester and the handler, wherein the communication data has basic communication data for an electrical test of the semiconductor device, communication data for the handler remote control, and communication data for a handler state check.Type: GrantFiled: October 17, 2005Date of Patent: June 12, 2007Assignee: Samsung Electronics Co., Ltd.Inventors: Ae-Yong Chung, Eun-Seok Lee, Jeong-Ho Bang, Kyeong-Seon Shin, Dae-Gab Chi, Sung-Ok Kim -
Test system of semiconductor device having a handler remote control and method of operating the same
Publication number: 20060158211Abstract: A test system of a semiconductor device for a handler remote control is provided. The system includes: a tester for testing the semiconductor device; a handler connected to the tester through a GPIB (General Purpose Instruction Bus) communication cable; a tester server connected to the tester to download a test program, handler remote control program and a handler state check program to the tester; and communication data transmitted and received through the GPIB communication cable between the tester and the handler, wherein the communication data has basic communication data for an electrical test of the semiconductor device, communication data for the handler remote control, and communication data for a handler state check.Type: ApplicationFiled: October 17, 2005Publication date: July 20, 2006Inventors: Ae-Yong Chung, Eun-Seok Lee, Jeong-Ho Bang, Kyeong-Seon Shin, Dae-Gab Chi, Sung-Ok Kim -
Patent number: 6960908Abstract: An electrical testing method for a semiconductor package for detecting defects of sockets mounted on a device under test (DUT) board is provided. A tester performs electrical test, accumulates electrical test results, and compares the accumulated results to reference values. The result of the comparison decides whether a plurality of sockets mounted on the DUT board can be used or not. The decision results are transmitted to a handler so that the socket having the defects is not used on the DUT board.Type: GrantFiled: April 13, 2004Date of Patent: November 1, 2005Assignee: Samsung Electronics Co., Ltd.Inventors: Ae-yong Chung, Sung-Ok Kim, Jeong-ho Bang, Kyeong-seon Shin, Dae-gab Chi
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Publication number: 20050168236Abstract: A test apparatus includes one handler connected to a tester and one test board divided into two or more sites or two or more test boards. Since only the sites on the test board (or test boards) need be duplicated, rather than the loading lanes or sorters of the handler, the test apparatus can be conveniently compact. Further, while testing semiconductor devices on one site or one test board, semiconductor devices in another site or on another test board can be sorted according to the test result. This enables the reduction or elimination of tester idle time to optimize the efficiency of the test apparatus.Type: ApplicationFiled: March 28, 2005Publication date: August 4, 2005Applicant: Samsung Electronics Co., Ltd.Inventors: Ae-Yong Chung, Sung-Ok Kim, Kyeong-Seon Shin, Jeong-Ho Bang
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Patent number: 6922050Abstract: A method for testing semiconductor devices includes loading a customer tray with semiconductor devices to be tested. Groups of devices are transferred from the customer tray to buffer trays for testing. The number of devices in the customer tray is checked after each transfer. If the customer tray is empty, the number of semiconductor devices in the buffer trays is counted and compared with the number of semiconductor devices that can be tested simultaneously, typically either 64 or 128. If the number of semiconductor devices in the buffer trays is greater than the tester capacity, the semiconductor devices in at least one buffer tray are tested. If the number of semiconductor devices in the buffer trays is smaller than the tester capacity, semiconductor devices that were determined to be low quality in a prior test are loaded into a buffer tray, thus testing both untested and low quality devices together.Type: GrantFiled: April 28, 2004Date of Patent: July 26, 2005Assignee: Samsung Electronics Co., Ltd.Inventors: Ae-yong Chung, Sung-ok Kim, Jeong-ho Bang, Kyeong-seon Shin, Dae-gab Chi
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Patent number: 6903567Abstract: A test apparatus includes one handler connected to a tester and one test board divided into two or more sites or two or more test boards. Since only the sites on the test board (or test boards) need be duplicated, rather than the loading lanes or sorters of the handler, the test apparatus can be conveniently compact. Further, while testing semiconductor devices on one site or one test board, semiconductor devices in another site or on another test board can be sorted according to the test result. This enables the reduction or elimination of tester idle time to optimize the efficiency of the test apparatus.Type: GrantFiled: September 25, 2003Date of Patent: June 7, 2005Assignee: Samsung Electronics Co., Ltd.Inventors: Ae-Yong Chung, Sung-Ok Kim, Kyeong-Seon Shin, Jeong-Ho Bang
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Patent number: 6857090Abstract: A system and method automatically analyzes and manages loss factor data of test processes in which a great number of IC devices are tested as a lot with a number of testers. The lot contains a predetermined number of identical IC devices, and the lot test process is performed sequentially according to a predetermined number of test cycles. The system include a means for verifying test results for each of the test cycles and for determining whether or not a re-test is to be performed and an IC device loading/unloading means for loading IC devices to be tested and contained in the lot to a test head and for unloading the tested IC devices from the test head by sorting the tested IC devices according to the test results.Type: GrantFiled: October 9, 2001Date of Patent: February 15, 2005Assignee: Samsung Electronics Co., Ltd.Inventors: Kyu Sung Lee, Ae Yong Chung, Sung Ok Kim
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Publication number: 20040253753Abstract: A method for testing semiconductor devices includes loading a customer tray with semiconductor devices to be tested in a loader. The devices are moved from the customer tray into a test tray via a buffer tray of a loader buffer. The tested semiconductor devices are classified into high and low quality semiconductor devices. The classified semiconductor devices are unloaded from the test tray to the customer tray of an unloader via an unloader buffer. If the customer tray is not empty, the semiconductor devices are tested. If the customer tray is empty, the number of semiconductor devices in the buffer tray buffer is counted and compared with the number of semiconductor devices that can be tested simultaneously, typically either 64 or 128. If the number of semiconductor devices in the buffer tray is greater than the tester capacity, the semiconductor devices in the buffer tray are tested.Type: ApplicationFiled: April 28, 2004Publication date: December 16, 2004Applicant: Samsung Electronics Co., Ltd.Inventors: Ae-yong Chung, Sung-ok Kim, Jeong-ho Bang, Kyeong-seon Shin, Dae-gab Chi
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Publication number: 20040207387Abstract: An electrical testing method for a semiconductor package for detecting defects of sockets mounted on a device under test (DUT) board is provided. A tester performs electrical test, accumulates electrical test results, and compares the accumulated results to reference values. The result of the comparison decides whether a plurality of sockets mounted on the DUT board can be used or not. The decision results are transmitted to a handler so that the socket having the defects is not used on the DUT board.Type: ApplicationFiled: April 13, 2004Publication date: October 21, 2004Inventors: Ae-yong Chung, Sung-Ok Kim, Jeong-ho Bang, Kyeong-seon Shin, Dae-gab Chi