Patents by Inventor Sung Su Kim

Sung Su Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240053943
    Abstract: A device for video shooting in virtual production is provided. The device is a control device for video shooting in virtual production, in which a person or object located in front of a light-emitting diode (LED) wall is shot by a camera in a state in which at least one medium of media such as an image, a video, and a camera tracking linked video is displayed in front of the LED wall. The device includes: a display; and at least one processor configured to execute a program for controlling video shooting in virtual production and display a user interface of the program on the display.
    Type: Application
    Filed: November 8, 2021
    Publication date: February 15, 2024
    Inventor: Sung Su KIM
  • Publication number: 20240004816
    Abstract: An interface method in a system-on-chip includes: a process of transmitting, by a first circuit unit, first payload data transferred from a first functional block and a first signal for requesting buffer allocation for storing the first payload data to a second circuit unit, and decreasing a resource value in which an initial value is set to correspond to the number of payload data which may be stored in a buffer provided in the second circuit unit by one; a process of storing, by the second circuit unit, the first payload data in the buffer according to the first signal; a process of withdrawing, by the second circuit unit, payload data selected among the payload data stored in the buffer, and transferring the payload data to a second functional block, and transmitting a second signal indicating that the buffer is empty to the first circuit unit; and a process of increasing, by the first circuit unit, the resource value by one.
    Type: Application
    Filed: September 18, 2023
    Publication date: January 4, 2024
    Inventor: Sung Su KIM
  • Publication number: 20230282897
    Abstract: According to one aspect or the present invention, a battery module for an electric vehicle including a battery cell constituting a battery module, a sensing pad attached to a side surface of the battery cell, a battery management system (BMS) which performs transmission and reception communication with the sensing pad, and a cooling water pipe disposed under the battery cell can be provided.
    Type: Application
    Filed: March 3, 2023
    Publication date: September 7, 2023
    Inventor: Sung Su KIM
  • Publication number: 20230282930
    Abstract: Disclosed herein is a battery module including a battery pack in which battery cells for an electric vehicle are formed in the form of a bundle, wave type gauge bars which are disposed on both side surfaces of the battery pack and in which a plurality of valleys and ridges are formed, and a fire extinguishing support disposed between the gauge bar and the battery pack.
    Type: Application
    Filed: January 31, 2023
    Publication date: September 7, 2023
    Inventor: Sung Su KIM
  • Publication number: 20230261279
    Abstract: The present disclosure discloses a battery pack cooling structure through variably applying a thickness of a gap filler.
    Type: Application
    Filed: October 21, 2022
    Publication date: August 17, 2023
    Inventors: Seok Hwan HONG, Sung Su Kim
  • Publication number: 20230231257
    Abstract: Provided is a battery pack including a surface pressure maintaining structure is provided, which includes a battery cell and a surface pressure maintaining part that is disposed on one side of the battery cell and applies a surface pressure to the battery cell, wherein the surface pressure maintaining part includes a pair of inclination members that are arranged between the battery cells, move in a horizontal direction to press the battery cell, and have spaces therein, and an insertion member that is inserted between the pair of inclination members, allows the inclination members to slide, and has a space therein.
    Type: Application
    Filed: October 21, 2022
    Publication date: July 20, 2023
    Inventors: Sung Su KIM, Sang Hwan Park
  • Patent number: 11450644
    Abstract: A semiconductor package is provided. The semiconductor package may include a substrate, a chip stack disposed on the substrate, the chip stack including a plurality of semiconductor chips, a plurality of bonding wires electrically connecting the substrate to the plurality of semiconductor chips, a reinforcement layer disposed on the chip stack, and a molding layer surrounding side surfaces of the chip stack and the bonding wires and contacting side surfaces of the reinforcement layer. The reinforcement layer may include a lower layer including an adhesive, an intermediate layer disposed on the lower layer, and an upper layer disposed on the intermediate layer. The intermediate layer may have elongation in a range of 5% to 70%. The upper layer may have elongation less than 5%.
    Type: Grant
    Filed: September 15, 2020
    Date of Patent: September 20, 2022
    Assignee: SK hynix Inc.
    Inventors: Sung Su Kim, Byoung Jun Ahn
  • Patent number: 11412197
    Abstract: An electronic device includes: a display; a first image sensor configured to output a first image signal based on sensing a first light passing through the display; a second image sensor configured to output a second image signal based on sensing a second light that does not pass through the display; and a processor configured to: generate a first optical value and a second optical value based on the second image signal, the second optical value being different from the first optical value; based on the first optical value satisfying a first condition, correct the first image signal by using the second optical value.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: August 9, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sung-Ho Cha, Sung Su Kim
  • Publication number: 20220163500
    Abstract: The present disclosure relates to a marker for identifying Korean ginseng cultivars and a method of identifying Korean ginseng cultivars using the same. Specifically, the present disclosure provides a marker for identification of Korean ginseng cultivars, which is obtained by identifying and separating an active ingredient, which is contained only in Korean ginseng cultivars, among non-saponin components. In addition, the present disclosure makes it possible to determine whether a product sold as Korean ginseng is Korean ginseng by separating and purifying the active ingredient without using a conventional molecular biological method.
    Type: Application
    Filed: November 19, 2021
    Publication date: May 26, 2022
    Inventors: Ji Won LEE, Sung Su KIM, Jun Kee HONG, Ji Won MOON
  • Publication number: 20220163978
    Abstract: A vertical take-off and landing aircraft using a hybrid electric propulsion system, according to an embodiment of the present invention, includes: a first control step (S1) of changing a destination when an engine (10), a power generator (20), an engine control unit (30), a power management device (40), a control unit (50), a battery management system (60), a main battery (62) and the like malfunction, thereby causing a normal flight to be difficult; a second control step (S2) of performing control so that an aerial vehicle (1) glides to a point (T), at which same has entered a first space (CEP-1) required for landing or a wider second space (CEP-2) considered safe, and maintains lift and has minimized flight air resistance after passing through the point (T); a third control step (S3) of performing control so that lift is increased and performing control so that a nose cone is switched into an upward direction; and a fourth control step (S4) of performing control so that lift is gradually reduced, and contro
    Type: Application
    Filed: March 9, 2020
    Publication date: May 26, 2022
    Inventors: Chang Mo MOON, Ji Ho MOON, Sung Su Kim
  • Publication number: 20220089684
    Abstract: The present invention relates to a type 1 interferon neutralizing FC-fusion protein and a use thereof and, more specifically, to: a dimer-type polypeptide to which a monomer comprising an interferon receptor fragment or an antibody Fc fragment is bound; a preparation method there for; and a pharmaceutical composition comprising same. The type 1 interferon neutralizing FC-fusion protein of the present invention blocks binding between type 1 interferon and an interferon receptor, and has an excellent ability of inhibiting the signaling and biological activities of interferon, thereby enabling diseases mediated by a type 1 interferon to be effectively treated.
    Type: Application
    Filed: December 20, 2019
    Publication date: March 24, 2022
    Inventors: Young Kee SHIN, Sae Hyung LEE, Sung Su KIM
  • Publication number: 20220049132
    Abstract: Disclosed is a semiconductor package polyimide film, which may prevent the stripping of a thermoplastic polyimide layer by reducing a difference in the average coefficient of linear thermal expansion between a substrate film and the thermoplastic polyimide layer, and may be readily detached after a reflow process is completed since the thermoplastic polyimide layer to be attached to a lead frame has a glass transition temperature less than or equal to a reflow process temperature.
    Type: Application
    Filed: June 18, 2019
    Publication date: February 17, 2022
    Inventors: Kye Ung LEE, Sung Su KIM, Ho Young PARK, Tae Seok LEE
  • Publication number: 20220046215
    Abstract: An electronic device includes: a display; a first image sensor configured to output a first image signal based on sensing a first light passing through the display; a second image sensor configured to output a second image signal based on sensing a second light that does not pass through the display; and a processor configured to: generate a first optical value and a second optical value based on the second image signal, the second optical value being different from the first optical value; based on the first optical value satisfying a first condition, correct the first image signal by using the second optical value.
    Type: Application
    Filed: May 25, 2021
    Publication date: February 10, 2022
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sung-Ho CHA, Sung Su KIM
  • Patent number: 11217540
    Abstract: A semiconductor package according to an aspect includes a package substrate, a first semiconductor chip disposed on the package substrate and including a first through electrode, a second semiconductor chip stacked on the first semiconductor chip and having a second through electrode, and a nonconductive film disposed in a bonding zone between the first semiconductor chip and the second semiconductor chip. At an edge portion of the bonding zone, an edge portion of the first semiconductor chip is recessed in the lateral direction, based on an edge portion of the second semiconductor chip.
    Type: Grant
    Filed: June 29, 2020
    Date of Patent: January 4, 2022
    Assignee: SK hynix Inc.
    Inventor: Sung Su Kim
  • Publication number: 20210407965
    Abstract: A semiconductor package is provided. The semiconductor package may include a substrate, a chip stack disposed on the substrate, the chip stack including a plurality of semiconductor chips, a plurality of bonding wires electrically connecting the substrate to the plurality of semiconductor chips, a reinforcement layer disposed on the chip stack, and a molding layer surrounding side surfaces of the chip stack and the bonding wires and contacting side surfaces of the reinforcement layer. The reinforcement layer may include a lower layer including an adhesive, an intermediate layer disposed on the lower layer, and an upper layer disposed on the intermediate layer. The intermediate layer may have elongation in a range of 5% to 70%. The upper layer may have elongation less than 5%.
    Type: Application
    Filed: September 15, 2020
    Publication date: December 30, 2021
    Applicant: SK hynix Inc.
    Inventors: Sung Su KIM, Byoung Jun AHN
  • Publication number: 20210159190
    Abstract: A semiconductor package according to an aspect includes a package substrate, a first semiconductor chip disposed on the package substrate and including a first through electrode, a second semiconductor chip stacked on the first semiconductor chip and having a second through electrode, and a nonconductive film disposed in a bonding zone between the first semiconductor chip and the second semiconductor chip. At an edge portion of the bonding zone, an edge portion of the first semiconductor chip is recessed in the lateral direction, based on an edge portion of the second semiconductor chip.
    Type: Application
    Filed: June 29, 2020
    Publication date: May 27, 2021
    Applicant: SK hynix Inc.
    Inventor: Sung Su KIM
  • Publication number: 20210115134
    Abstract: The invention of the present application relates to a use of an antibody biding specifically to ECL-2 of claudin 3 and functional fragments thereof in cancer cell detection, diagnosis, imaging, and application to cancer treatment (anticancer use of the antibody itself, and application to ADC and CAR-expression cells (particularly immune cells)), an antibody that includes a characteristic CDR sequence exerting a remarkable effect in such uses, and a functional fragment thereof.
    Type: Application
    Filed: March 27, 2019
    Publication date: April 22, 2021
    Inventors: Young Kee SHIN, Sung Youl HONG, Young Deug KIM, Jun Young CHOI, Heo Bin YANG, Ha Yeon PARK, Sung Su KIM
  • Patent number: 10869495
    Abstract: The present invention relates to a food composition for improvement and prevention of estrogen deficiency, the composition containing a thistle extract or a thistle and thyme complex extract as an active ingredient. The present invention has advantages of alleviating estrogen deficiency in climacteric women and improving symptoms caused by estrogen deficiency, such as facial flushing, sweating, fatigue, anxiety, depression, memory impairment, insomnia, increased blood cholesterol, weight gain, and reduced bone density.
    Type: Grant
    Filed: October 19, 2015
    Date of Patent: December 22, 2020
    Assignee: FAMENITY CO., LTD.
    Inventors: Ji Won Lee, Sung Su Kim
  • Patent number: 10813055
    Abstract: Disclosed are an uplink resource allocation method and a cognitive small cell network system performing the method. In the method, a small cell manager collects an access request from a small cell user and forms a preference relationship for each small cell user. Then, sub-channel-specific transmission power for providing a maximum data transmission rate at the time of uplink transmission is calculated and the calculated sub-channel-specific transmission power information is transferred to the small cell user. Meanwhile, the small cell user forms all possible sub-channel-specific preference relations and thereafter, transmits the access request for each sub-channel having a maximum preference relationship to the small cell manager.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: October 20, 2020
    Assignee: UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY
    Inventors: Choong Seon Hong, Tuan Leanh, Sung Su Kim
  • Patent number: 10719925
    Abstract: A radiographic imaging control method includes combining a plurality of images by applying a first weight to the plurality of images, displaying a composite image, acquired by combining the plurality of images, newly receiving a second weight with respect to the composite image, recombining the plurality of images based on the received second weight, and displaying a recombined image, acquired by recombining the plurality of images.
    Type: Grant
    Filed: June 26, 2017
    Date of Patent: July 21, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kang Eui Lee, Hyun Hwa Oh, Sung Su Kim, Young Hun Sung