Patents by Inventor Sung W. Moon

Sung W. Moon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230339194
    Abstract: The present disclosure provides a thermally conductive article including a pad having first and second opposed major surfaces and a thickness therebetween. The thickness is formed of entangled thermally conductive fibers and at least a portion of the entangled thermally conductive fibers have at least one terminal end at the first opposed major surface, the opposed second major surface, or both. The pad is at least partially impregnated with a polymer. Another thermally conductive article is provided including a) a pad having first and second opposed major surfaces and a thickness therebetween; b) a first thermally conductive skin layer; and c) a second thermally conductive skin layer. The thickness of the pad is formed of aligned thermally conductive fibers, and at least a portion of the thermally conductive fibers have a terminal end at the first opposed major surface and the opposed second major surface.
    Type: Application
    Filed: February 18, 2021
    Publication date: October 26, 2023
    Inventors: Jacob P. Podkaminer, Jens Eichler, Peter J. Schneider, Sebastian Goris, Victor Ho, Joseph A. Dunbar, Matthew T. Johnson, Jay B. Preston, Matthew H. Frey, Eric L. Askeland, Steven D. Solomonson, Sung W. Moon, Michael P. Wald
  • Publication number: 20230230852
    Abstract: A cold plate having a copper base plate and a plurality of fins on the copper base plate. The fins are porous and made by 3D printing a copper-silver alloy on the copper base plate. Alternatively, the fins can be 3D printed and then adhered to the copper base plate with a brazing material. The copper base plate is placed on electronics to be cooled, such as a chip package, using a thermal interface material. An optional manifold can be placed on the copper base plate for circulating a coolant across the fins.
    Type: Application
    Filed: July 9, 2021
    Publication date: July 20, 2023
    Inventors: Elizaveta Y. Plotnikov, Sung W. Moon, Nicholas A. Proite, Myron K. Jordan
  • Publication number: 20220415752
    Abstract: A direct to chip cooling film for two-phase cooling. The film includes a dielectric layer having a first surface for attachment to a cold plate or circuits and having a second surface. A metal layer is on the second surface of the dielectric layer with a pattern of features on a side opposite the dielectric layer. This surface pattern provides increased surface area and multiple nucleation sites for bubbles formation for two-phase cooling. The features can also include metal nodules to further enhance the nucleation.
    Type: Application
    Filed: December 1, 2020
    Publication date: December 29, 2022
    Inventors: Ravi Palaniswamy, Sung W. Moon, Brinda B. Badri, Siang Sin Foo
  • Patent number: 5426753
    Abstract: A memory decoding system for a portable data terminal includes a memory controller, a memory storage, a first selection signal generator, and a second selection signal generator. The memory controller generates address signals and data signals. The memory storage is divided into a plurality of memory regions, and is controlled in such a manner as to write and read for the specified uses through the memory controller. The first selection signal generator outputs memory selecting signals to select one memory type of the memory storage. The second selection signal generator generates memory selecting signals to select another memory type of the memory storage. The portable terminal can be formed into a more compact type.
    Type: Grant
    Filed: April 25, 1994
    Date of Patent: June 20, 1995
    Assignee: Gold Star Co., Ltd.
    Inventor: Sung W. Moon