Patents by Inventor Sung-Wei Lee
Sung-Wei Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11972974Abstract: An IC structure includes a transistor, a source/drain contact, a metal oxide layer, a non-metal oxide layer, a barrier structure, and a via. The transistor includes a gate structure and source/drain regions on opposite sides of the gate structure. The source/drain contact is over one of the source/drain regions. The metal oxide layer is over the source/drain contact. The non-metal oxide layer is over the metal oxide layer. The barrier structure is over the source/drain contact. The barrier structure forms a first interface with the metal oxide layer and a second interface with the non-metal oxide layer, and the second interface is laterally offset from the first interface. The via extends through the non-metal oxide layer to the barrier structure.Type: GrantFiled: January 13, 2022Date of Patent: April 30, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Sung-Li Wang, Shuen-Shin Liang, Yu-Yun Peng, Fang-Wei Lee, Chia-Hung Chu, Mrunal Abhijith Khaderbad, Keng-Chu Lin
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Patent number: 11959695Abstract: The present invention relates to a liquid cooling system with water quality monitoring, which comprises a first inlet, a first outlet, a heat exchange unit, a sensing unit, and a control unit connected to the sensing unit and a first pump. The heat exchange unit has a heat exchanger connected to the first inlet and the first pump connected to the first outlet and the heat exchanger. The first pump is used to drive a first working liquid after heat exchange in the heat exchanger. The sensing unit senses a pH value of a first working liquid to generate a sense signal. The control unit compares the sense signal with a preset pH range to generate a compared result which is sent to an external interface. By means of the design of the present invention, the pH value of water can be monitored.Type: GrantFiled: October 29, 2019Date of Patent: April 16, 2024Assignee: FOSITEK CORPORATIONInventor: Sung-Wei Lee
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Patent number: 11934213Abstract: A liquid-cooling device includes multiple water blocks and at least one connection tube. Each of the water blocks has a water incoming end, a water outgoing end and a water-receiving space in communication with the water incoming end and the water outgoing end. The connection tube is disposed between each two water blocks. Two ends of the connection tube are respectively connected with the water incoming end of one of the two water blocks and the water outgoing end of the other water block, whereby the water-receiving spaces of the two water blocks communicate with each other via the connection tube. The connection tube has at least one bellows section between two ends of the connection tube. The liquid-cooling device solves the problems of the conventional liquid-cooling device that when the water block is welded, thermal deformation is produced to cause tolerance and the manufacturing cost is higher.Type: GrantFiled: February 18, 2021Date of Patent: March 19, 2024Assignee: ASIA VITAL COMPONENTS (CHINA) CO., LTD.Inventors: Pai-Ling Kao, Sung-Wei Lee, Kuan-Lin Huang, Ming-Tsung Yang
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Patent number: 11892252Abstract: An adaptable liquid connector structure includes a case, an intermediate member and a liquid connector main body. The case is a hollow frame. The intermediate member is located in the case and includes an opening formed at a front area thereof for mounting the liquid connector main body therein, a locating bore located below the opening, and a plurality of elastic elements mounted on outer sides and a rear side of thereof. The intermediate member is supported by the elastic elements to suspend in the case and the elastic elements absorb assembly tolerance of the adaptable liquid connector structure, such that the liquid connector main body mounted therein is allowed for a positional floating adjustment in and relative to the case upward, downward, leftward and rightward to be smoothly, correctly and securely connected to an adaptor connector.Type: GrantFiled: August 12, 2021Date of Patent: February 6, 2024Assignee: ASIA VITAL COMPONENTS CO., LTD.Inventors: Ming-Tsung Yang, Kuan-Lin Huang, Sung-Wei Lee
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Patent number: 11805621Abstract: A memory auxiliary heat transfer structure is correspondingly assembled with at least one memory unit and a water-cooling assembly. The memory auxiliary heat transfer structure includes a main body. The main body has a first end, a second end and a middle section. The middle section has a heated side and a contact side. The heated side is disposed corresponding to at least one chip disposed on the memory unit. The contact side is attached to and assembled with the water-cooling assembly. The memory auxiliary heat transfer structure serves to reduce the friction between the memory unit and the water-cooling assembly and fill the gap so as to reduce the heat resistance.Type: GrantFiled: February 7, 2020Date of Patent: October 31, 2023Assignee: ASIA VITAL COMPONENTS (CHINA) CO., LTD.Inventor: Sung-Wei Lee
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Publication number: 20230050005Abstract: An adaptable liquid connector structure includes a case, an intermediate member and a liquid connector main body. The case is a hollow frame. The intermediate member is located in the case and includes an opening formed at a front area thereof for mounting the liquid connector main body therein, a locating bore located below the opening, and a plurality of elastic elements mounted on outer sides and a rear side of thereof. The intermediate member is supported by the elastic elements to suspend in the case and the elastic elements absorb assembly tolerance of the adaptable liquid connector structure, such that the liquid connector main body mounted therein is allowed for a positional floating adjustment in and relative to the case upward, downward, leftward and rightward to be smoothly, correctly and securely connected to an adaptor connector.Type: ApplicationFiled: August 12, 2021Publication date: February 16, 2023Inventors: Ming-Tsung Yang, Kuan-Lin Huang, Sung-Wei Lee
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Publication number: 20220316817Abstract: A liquid-cooling heat dissipation structure includes a substrate and a cover body mated with the substrate to define a heat exchange chamber therebetween. A radiating fin unit and a stop section are disposed in the heat exchange chamber. The stop section serves to first divide a cooling liquid entering the heat exchange chamber, whereby the cooling liquid first flows through the periphery of the radiating fin unit and then flow into the middle of the radiating fin unit so that the cooling liquid is prevented from straightly passing through the radiating fin unit. Multiple cooperative flow-stopping protrusions are disposed in the periphery of the radiating fin unit to help the cooling liquid to uniformly flow through the radiating fin unit. By means of the structural design of the liquid-cooling heat dissipation structure, the heat exchange efficiency is greatly enhanced.Type: ApplicationFiled: March 30, 2021Publication date: October 6, 2022Inventors: Sung-Wei Lee, Kuan-Lin Huang, Ming-Tsung Yang
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Publication number: 20220316820Abstract: A water block reinforcement structure includes a substrate and a cover body mated with the substrate to define a heat exchange chamber therebetween. At least one radiating fin assembly and at least one reinforcement section are disposed in the heat exchange chamber. The reinforcement section has an upper end connected with the inner face of the cover body by a connection means.Type: ApplicationFiled: March 30, 2021Publication date: October 6, 2022Inventors: Sung-Wei Lee, Kuan-Lin Huang, Ming-Tsung Yang
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Publication number: 20220261019Abstract: A liquid-cooling device includes multiple water blocks and at least one connection tube. Each of the water blocks has a water incoming end, a water outgoing end and a water-receiving space in communication with the water incoming end and the water outgoing end. The connection tube is disposed between each two water blocks. Two ends of the connection tube are respectively connected with the water incoming end of one of the two water blocks and the water outgoing end of the other water block, whereby the water-receiving spaces of the two water blocks communicate with each other via the connection tube. The connection tube has at least one bellows section between two ends of the connection tube. The liquid-cooling device solves the problems of the conventional liquid-cooling device that when the water block is welded, thermal deformation is produced to cause tolerance and the manufacturing cost is higher.Type: ApplicationFiled: February 18, 2021Publication date: August 18, 2022Inventors: Pai-Ling Kao, Sung-Wei Lee, Kuan-Lin Huang, Ming-Tsung Yang
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Patent number: 11229143Abstract: A liquid-cooling heat dissipation system capable of regulating water quality includes a first liquid inlet, a first liquid outlet, a heat exchange unit, a sensation unit, a water quality regulating unit for containing and releasing an agent and a control unit. The heat exchange unit has a heat exchanger, a first pump and a mating opening connected with the water quality regulating unit. The sensation unit detects the pH value of a first working liquid and transmits a sensation signal to the control unit. The control unit compares the sensation signal with a preset pH value range to generate and transmit a comparison result to an external interface, whereby the water quality regulating unit is manually controlled to release the agent or not. Alternatively, according to the comparison result, the control unit automatically controls the water quality regulating unit to release the agent or not.Type: GrantFiled: October 29, 2019Date of Patent: January 18, 2022Assignee: ASIA VITAL COMPONENTS CO., LTD.Inventor: Sung-Wei Lee
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Publication number: 20210251105Abstract: A memory auxiliary heat transfer structure is correspondingly assembled with at least one memory unit and a water-cooling assembly. The memory auxiliary heat transfer structure includes a main body. The main body has a first end, a second end and a middle section. The middle section has a heated side and a contact side. The heated side is disposed corresponding to at least one chip disposed on the memory unit. The contact side is attached to and assembled with the water-cooling assembly. The memory auxiliary heat transfer structure serves to reduce the friction between the memory unit and the water-cooling assembly and fill the gap so as to reduce the heat resistance.Type: ApplicationFiled: February 7, 2020Publication date: August 12, 2021Inventor: Sung-Wei Lee
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Publication number: 20210123685Abstract: A liquid-cooling heat dissipation system capable of regulating water quality includes a first liquid inlet, a first liquid outlet, a heat exchange unit, a sensation unit, a water quality regulating unit for containing and releasing an agent and a control unit. The heat exchange unit has a heat exchanger, a first pump and a mating opening connected with the water quality regulating unit. The sensation unit detects the pH value of a first working liquid and transmits a sensation signal to the control unit. The control unit compares the sensation signal with a preset pH value range to generate and transmit a comparison result to an external interface, whereby the water quality regulating unit is manually controlled to release the agent or not. Alternatively, according to the comparison result, the control unit automatically controls the water quality regulating unit to release the agent or not.Type: ApplicationFiled: October 29, 2019Publication date: April 29, 2021Inventor: Sung-Wei Lee
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Publication number: 20210123669Abstract: The present invention relates to a liquid cooling system with water quality monitoring, which comprises a first inlet, a first outlet, a heat exchange unit, a sensing unit, and a control unit connected to the sensing unit and a first pump. The heat exchange unit has a heat exchanger connected to the first inlet and the first pump connected to the first outlet and the heat exchanger. The first pump is used to drive a first working liquid after heat exchange in the heat exchanger. The sensing unit senses a pH value of a first working liquid to generate a sense signal. The control unit compares the sense signal with a preset pH range to generate a compared result which is sent to an external interface. By means of the design of the present invention, the pH value of water can be monitored.Type: ApplicationFiled: October 29, 2019Publication date: April 29, 2021Inventor: Sung-Wei Lee
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Patent number: 10809776Abstract: A water block mounting holder with reinforced structure includes a holder body and a reinforcement structure provided on an upper side of the holder body, and is used with a water block to attach the latter to a heat-producing element mounted on a motherboard. The holder body has a hollow-out central opening and a plurality of through holes spaced along an outer area of the holder body for a plurality of fixing elements provided on the motherboard to extend therethrough and fixedly hold the holder body to the motherboard, so that the holder body is connected to the water block with the opening being fitted around the water block. With the reinforcement structure provided on the holder body, the water block mounting holder has effectively reinforced overall structural strength to avoid pressure deformation thereof.Type: GrantFiled: March 28, 2019Date of Patent: October 20, 2020Assignee: ASIA VITAL COMPONENTS (CHINA) CO., LTD.Inventor: Sung-Wei Lee
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Publication number: 20200110448Abstract: A water block mounting holder with reinforced structure includes a holder body and a reinforcement structure provided on an upper side of the holder body, and is used with a water block to attach the latter to a heat-producing element mounted on a motherboard. The holder body has a hollow-out central opening and a plurality of through holes spaced along an outer area of the holder body for a plurality of fixing elements provided on the motherboard to extend therethrough and fixedly hold the holder body to the motherboard, so that the holder body is connected to the water block with the opening being fitted around the water block. With the reinforcement structure provided on the holder body, the water block mounting holder has effectively reinforced overall structural strength to avoid pressure deformation thereof.Type: ApplicationFiled: March 28, 2019Publication date: April 9, 2020Inventor: Sung-Wei Lee
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Patent number: 9746249Abstract: A heat pipe structure includes a first tubular body and a second tubular body. The first tubular body has a first receiving space. A first working fluid is contained in the first receiving space. The second tubular body is disposed in the first receiving space. The second tubular body has a second receiving space. A second working fluid is contained in the second receiving space. The solidification temperature of the first working fluid is different from the solidification temperature of the second working fluid so that the heat pipe structure can be activated at low temperature to keep operating at normal temperature to enhance the performance. Moreover, the assembly applicability is enhanced to lower the assembling cost.Type: GrantFiled: November 12, 2014Date of Patent: August 29, 2017Assignee: Asia Vital Components Co., Ltd.Inventor: Sung-Wei Lee
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Publication number: 20160131435Abstract: A heat pipe structure includes a first tubular body and a second tubular body. The first tubular body has a first receiving space. A first working fluid is contained in the first receiving space. The second tubular body is disposed in the first receiving space. The second tubular body has a second receiving space. A second working fluid is contained in the second receiving space. The solidification temperature of the first working fluid is different from the solidification temperature of the second working fluid so that the heat pipe structure can be activated at low temperature to keep operating at normal temperature to enhance the performance. Moreover, the assembly applicability is enhanced to lower the assembling cost.Type: ApplicationFiled: November 12, 2014Publication date: May 12, 2016Inventor: Sung-Wei Lee
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Publication number: 20140284845Abstract: A motor water-cooling structure and a manufacturing method thereof are disclosed. The motor water-cooling structure includes a motor case having a wall portion and a tube. The tube is embedded in the wall portion to serve as a flow passage. To manufacture the motor water-cooling structure, the tube is positioned in a mold cavity of a mold, and the motor case is formed in the mold by pour molding to embed the tube therein, so that the motor case and the tube form an integral body. With the manufacturing method, the motor water-cooling structure can be formed with reduced material, labor and time to save the manufacturing costs, and the risk of water leakage can be avoided.Type: ApplicationFiled: June 5, 2014Publication date: September 25, 2014Inventor: Sung-Wei Lee
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Patent number: 8702386Abstract: A fan includes a frame and an impeller. The impeller is disposed in the frame and the impeller has a plurality of blades. Each blade has a wing part and a flap part, and the wing part and the flap part form a predetermined angle. A blade is also disclosed.Type: GrantFiled: July 27, 2006Date of Patent: April 22, 2014Assignee: Delta Electronics, Inc.Inventors: Sung-Wei Lee, Shun-Chen Chang, Wen-Shi Huang
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Patent number: 8629587Abstract: A water-cooling structure for electric motor includes a motor main body, a heat-dissipation base, and a vortex-forming section. The motor main body is externally fitted around the heat-dissipation base. The heat-dissipation base is provided around an outer circumferential surface with at least one main flow passage. The vortex-forming section is provided in the main flow passage to create vortex effect on a type of cooling liquid flowing in the main flow passage, so as to enable an increased heat transfer efficiency of the water-cooling structure.Type: GrantFiled: December 23, 2010Date of Patent: January 14, 2014Assignee: Asia Vital Components Co., Ltd.Inventors: Pai-Ling Kao, Sung-Wei Lee, Jing-Rong Peng