Patents by Inventor Sung-Yao Chang

Sung-Yao Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11990443
    Abstract: In an embodiment, an interposer has a first side, a first integrated circuit device attached to the first side of the interposer with a first set of conductive connectors, each of the first set of conductive connectors having a first height, a first die package attached to the first side of the interposer with a second set of conductive connectors, the second set of conductive connectors including a first conductive connector and a second conductive connector, the first conductive connector having a second height, the second conductive connector having a third height, the third height being different than the second height, a first dummy conductive connector being between the first side of the interposer and the first die package, an underfill disposed beneath the first integrated circuit device and the first die package, and an encapsulant disposed around the first integrated circuit device and the first die package.
    Type: Grant
    Filed: April 9, 2021
    Date of Patent: May 21, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Kuan-Yu Huang, Sung-Hui Huang, Shang-Yun Hou, Shu Chia Hsu, Yu-Yun Huang, Wen-Yao Chang, Yu-Jen Cheng
  • Publication number: 20240096776
    Abstract: A package substrate is provided and includes a core board body and a first circuit structure and a second circuit structure disposed on opposite sides of the core board body, where the number of wiring layers of the second circuit structure is different from the number of wiring layers of the first circuit structure, so that the package substrate is asymmetrical. The first circuit structure and the second circuit structure are designed according to the thickness and coefficient of thermal expansion of the first dielectric layer of the first circuit structure and the second dielectric layer of the second circuit structure, so as to prevent the problem of warping from occurring to the package substrate.
    Type: Application
    Filed: August 31, 2023
    Publication date: March 21, 2024
    Inventors: Andrew C. CHANG, Min-Yao CHEN, Sung-Kun LIN
  • Patent number: 6826395
    Abstract: A system and a method for a secure trading mechanism combining wireless communication and wired communication are proposed, which, in the condition of two-way trading constructed based on network connection of a wireless communication device functioning in two-way transmission to a trading server and a trading host of a wired communication devices, allow the trading to be performed in real time and the correctness to be determined for data transmitted between different levels of the network according to a secure communication protocol defined in each communication device, so as to assure the security of trading data in transmission, and prevent the trading data from being acquired or changed without authorization.
    Type: Grant
    Filed: August 1, 2001
    Date of Patent: November 30, 2004
    Assignee: Telepaq Technology, Inc.
    Inventors: Jun-Yih Lee, Sung-Yao Chang, Ching-Feng Wang
  • Publication number: 20020188951
    Abstract: The convention transmission method is an on-demand data communication, in which one discloses a demand and one provides a supply. However, this communication way is not suitable nowadays. Since amount of current data transmission is very large. In order to improve the quality in service, the service provider provides actively the required service to the customer. After browsing by the customer, then the customer transfers the selection items to the service provider and then the service provider provides required service to the customers, By this way, the customer may browse products rapidly and the quality of information service is improved.
    Type: Application
    Filed: June 6, 2001
    Publication date: December 12, 2002
    Applicant: TelePaq Technology Inc.
    Inventors: Sung-Yao Chang, Ching-Feng Wang
  • Publication number: 20020019223
    Abstract: A system and a method for a secure trading mechanism combining wireless communication and wired communication are proposed, which, in the condition of two-way trading constructed based on network connection of a wireless communication device functioning in two-way transmission to a trading server and a trading host of a wired communication devices, allow the trading to be performed in real time and the correctness to be determined for data transmitted between different levels of the network according to a secure communication protocol defined in each communication device, so as to assure the security of trading data in transmission, and prevent the trading data from being acquired or changed without authorization.
    Type: Application
    Filed: August 1, 2001
    Publication date: February 14, 2002
    Applicant: Telepaq Technology, Inc.
    Inventors: Jun-Yih Lee, Sung-Yao Chang, Ching-Feng Wang