Patents by Inventor Sung Yole YUN

Sung Yole YUN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing light-emitting device packages, light-emitting device package strip, and light-emitting device package
    Patent number: 10667345
    Abstract: Disclosed is a method for manufacturing a chip scale package (CSP) for a light-emitting diode (LED). The method may include a light-emitting device mounting step for mounting a plurality of light-emitting devices on a substrate strip, a phosphor forming step for forming a phosphor on the plurality of light-emitting devices, a reflective member forming step for forming a reflective member on the substrate strip to surround the phosphor, and a package singulation step for singulating unit packages by cutting the substrate strip and the reflective member.
    Type: Grant
    Filed: February 14, 2018
    Date of Patent: May 26, 2020
    Assignee: LUMENS CO., LTD.
    Inventors: Seung Hyun Oh, Seung Hoon Lee, Sung Yole Yun, Jung A Lim, Sung Sik Jo, In Soo Kim, Tae Kyung Yoo
  • Light emitting device package, backlight unit, illumination apparatus, and method of manufacturing light emitting device package
    Patent number: 10074788
    Abstract: Disclosed herein are a light emitting device package, a backlight unit, an illumination apparatus, and a method of manufacturing a light emitting device package capable of being used for a display application or an illumination application.
    Type: Grant
    Filed: October 24, 2017
    Date of Patent: September 11, 2018
    Assignee: LUMENS CO., LTD.
    Inventors: Seung-Hyun Oh, Sung-Sik Jo, Jung-A Lim, Sung-Yole Yun, Ji-Yeon Lee, Bo-Young Kim
  • METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE PACKAGES, LIGHT-EMITTING DEVICE PACKAGE STRIP, AND LIGHT-EMITTING DEVICE PACKAGE
    Publication number: 20180177019
    Abstract: Disclosed is a method for manufacturing a chip scale package (CSP) for a light-emitting diode (LED). The method may include a light-emitting device mounting step for mounting a plurality of light-emitting devices on a substrate strip, a phosphor forming step for forming a phosphor on the plurality of light-emitting devices, a reflective member forming step for forming a reflective member on the substrate strip to surround the phosphor, and a package singulation step for singulating unit packages by cutting the substrate strip and the reflective member.
    Type: Application
    Filed: February 14, 2018
    Publication date: June 21, 2018
    Applicant: LUMENS CO., LTD.
    Inventors: Seung Hyun OH, Seung Hoon LEE, Sung Yole YUN, Jung A LIM, Sung Sik JO, In Soo KIM, Tae Kyung YOO
  • Method for manufacturing light-emitting device packages, light-emitting device package strip, and light-emitting device package
    Patent number: 9930750
    Abstract: A method for manufacturing a chip scale package (CSP) for a light-emitting diode (LED). The method may include a light-emitting device mounting step for mounting a plurality of light-emitting devices on a substrate strip, a phosphor forming step for forming a phosphor on the plurality of light-emitting devices, a reflective member forming step for forming a reflective member on the substrate strip to surround the phosphor, and a package singulation step for singulating unit packages by cutting the substrate strip and the reflective member.
    Type: Grant
    Filed: August 19, 2015
    Date of Patent: March 27, 2018
    Assignee: LUMENS CO., LTD.
    Inventors: Seung Hyun Oh, Seung Hoon Lee, Sung Yole Yun, Jung A Lim, Sung Sik Jo, In Soo Kim, Tae Kyung Yoo
  • LIGHT EMITTING DEVICE PACKAGE, BACKLIGHT UNIT, ILLUMINATION APPARATUS, AND METHOD OF MANUFACTURING LIGHT EMITTING DEVICE PACKAGE
    Publication number: 20180047884
    Abstract: Disclosed herein are a light emitting device package, a backlight unit, an illumination apparatus, and a method of manufacturing a light emitting device package capable of being used for a display application or an illumination application.
    Type: Application
    Filed: October 24, 2017
    Publication date: February 15, 2018
    Applicant: LUMENS CO., LTD.
    Inventors: Seung-Hyun OH, Sung-Sik JO, Jung-A LIM, Sung-Yole YUN, Ji-Yeon LEE, Bo-Young KIM
  • Light emitting device package, backlight unit, illumination apparatus, and method of manufacturing light emitting device package
    Patent number: 9831407
    Abstract: Disclosed herein are a light emitting device package, a backlight unit, an illumination apparatus, and a method of manufacturing a light emitting device package capable of being used for a display application or an illumination application.
    Type: Grant
    Filed: November 20, 2014
    Date of Patent: November 28, 2017
    Assignee: LUMENS CO., LTD.
    Inventors: Seung-Hyun Oh, Sung-Sik Jo, Jung-A Lim, Sung-Yole Yun, Ji-Yeon Lee, Bo-Young Kim
  • LIGHT EMITTING DEVICE PACKAGE, BACKLIGHT UNIT, ILLUMINATION APPARATUS, AND METHOD OF MANUFACTURING LIGHT EMITTING DEVICE PACKAGE
    Publication number: 20160300988
    Abstract: Disclosed herein are a light emitting device package, a backlight unit, an illumination apparatus, and a method of manufacturing a light emitting device package capable of being used for a display application or an illumination application.
    Type: Application
    Filed: November 20, 2014
    Publication date: October 13, 2016
    Applicant: LUMENS CO., LTD.
    Inventors: Seung-Hyun OH, Sung-Sik JO, Jung-A LIM, Sung-Yole YUN, Ji-Yeon LEE, Bo-Young KIM
  • METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE PACKAGES, LIGHT-EMITTING DEVICE PACKAGE STRIP, AND LIGHT-EMITTING DEVICE PACKAGE
    Publication number: 20160057833
    Abstract: Disclosed is a method for manufacturing a chip scale package (CSP) for a light-emitting diode (LED). The method may include a light-emitting device mounting step for mounting a plurality of light-emitting devices on a substrate strip, a phosphor forming step for forming a phosphor on the plurality of light-emitting devices, a reflective member forming step for forming a reflective member on the substrate strip to surround the phosphor, and a package singulation step for singulating unit packages by cutting the substrate strip and the reflective member.
    Type: Application
    Filed: August 19, 2015
    Publication date: February 25, 2016
    Inventors: Seung Hyun OH, Seung Hoon LEE, Sung Yole YUN, Jung A LIM, Sung Sik JO, In Soo KIM, Tae Kyoung YOO