Patents by Inventor SUNG-EUN PYO

SUNG-EUN PYO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20150318268
    Abstract: A multi-chip package includes a first semiconductor chip and a second semiconductor chip. The first semiconductor chip has a first active surface. The second semiconductor chip has a second active surface facing the first active surface. The second active surface is electrically connected with the first active surface and the first active surface of the first semiconductor chip and the second active surface of the second semiconductor chip are bonded to each other without an adhesive.
    Type: Application
    Filed: April 27, 2015
    Publication date: November 5, 2015
    Inventors: JUNG-SEOK AHN, SANG-WON KIM, YOUNG-SANG CHO, KWANG-CHUL CHOI, SUNG-EUN PYO