Abstract: A system includes a transmitter to transmit a set of bits associated with signaling having one or more levels. The system includes a receiver coupled to the transmitter, the receiver to receive the set of bits and generate a first plurality of digital values, each digital value generated at a first timing value and a plurality of reference voltages, the reference voltage incremented based at least in part on generating a digital value of the first plurality of digital values. The receiver is to generate a second plurality of digital values at a second timing value and the plurality of reference voltages, the first timing value incremented to the second timing value based at least in part on generating the first plurality of digital values. The system includes a controller to determine an amplitude associated with each the first and second plurality of digital values.

Abstract: A system includes a transmitter to transmit a set of bits associated with signaling having one or more levels. The system includes a receiver coupled to the transmitter, the receiver to receive the set of bits and generate a first plurality of digital values, each digital value generated at a first timing value and a plurality of reference voltages, the reference voltage incremented based at least in part on generating a digital value of the first plurality of digital values. The receiver is to generate a second plurality of digital values at a second timing value and the plurality of reference voltages, the first timing value incremented to the second timing value based at least in part on generating the first plurality of digital values. The system includes a controller to determine an amplitude associated with each the first and second plurality of digital values.

Abstract: Various embodiments include a memory device that recovers from write errors and read errors more quickly relative to prior memory devices. Certain patterns of write data and read data may result on poor signal quality on the memory interface between memory controllers and memory devices. The disclosed memory device, synchronously with the memory controller, scrambles read data before transmitting the data to the memory controller and descrambles received from the memory controller. The scrambling and descrambling results in a different pattern on the memory interface even for the same read data or write data. Therefore, when a write operation or a read operation fails, and the operation is replayed, the pattern transmitted on the memory interface is different when the operation is replayed. As a result, the memory device more easily recovers from data patterns that cause poor signal quality on the memory interface.

Abstract: Various embodiments include a memory device that recovers from write errors and read errors more quickly relative to prior memory devices. Certain patterns of write data and read data may result on poor signal quality on the memory interface between memory controllers and memory devices. The disclosed memory device, synchronously with the memory controller, scrambles read data before transmitting the data to the memory controller and descrambles received from the memory controller. The scrambling and descrambling results in a different pattern on the memory interface even for the same read data or write data. Therefore, when a write operation or a read operation fails, and the operation is replayed, the pattern transmitted on the memory interface is different when the operation is replayed. As a result, the memory device more easily recovers from data patterns that cause poor signal quality on the memory interface.

Abstract: An integrated circuit (IC) system includes an IC coupled to a package. The package, in turn, is coupled to a ball grid array. The integrated circuit is electrically coupled to the ball grid array by a plurality of package through-hole (PTH) vias that penetrate through the package. Each PTH via includes a conductive element associated with a differential signaling pair. The conductive elements within a given differential signaling pair are disposed in the package at specific locations, relative to other conductive elements in other differential signaling pairs, to reduce crosstalk between those differential signaling pairs. At least one advantage of technique described herein is that the conductive elements within the package can be densely packed together without inducing excessive crosstalk. Therefore, the package can support a large number of differential signaling pairs, allowing high-throughput data communication.

Abstract: An integrated circuit (IC) system includes an IC coupled to a package. The package, in turn, is coupled to a ball grid array. The integrated circuit is electrically coupled to the ball grid array by a plurality of package through-hole (PTH) vias that penetrate through the package. Each PTH via includes a conductive element associated with a differential signaling pair. The conductive elements within a given differential signaling pair are disposed in the package at specific locations, relative to other conductive elements in other differential signaling pairs, to reduce crosstalk between those differential signaling pairs. At least one advantage of technique described herein is that the conductive elements within the package can be densely packed together without inducing excessive crosstalk. Therefore, the package can support a large number of differential signaling pairs, allowing high-throughput data communication.