Abstract: Thin indium-less “optically porous” layers adapted to replace traditional ITO layers are provided herein. A thin metalized film adapted to carry an electrical charge can include a dense pattern of small openings to allow the transmission of light to or from an underlying semiconductor material. The pattern of openings can create a regular or irregular grid pattern of low aspect ratio fine-line metal conductors. Creation of this optically porous metalized film can include the printing of a catalytic precursor material, such as palladium in solution in a pattern on a substrate, drying or curing the catalytic precursor, and the deposition of a thin layer of metal, such as copper on the dried precursor to form the final conductive and optically porous film.

Abstract: The present invention is directed to a process for forming a layer of palladium on a substrate, comprising:preparing a solution of a palladium precursor, wherein the palladium precursor consists ofPd(OOCR.sup.1).sub.m (OOCR.sup.2).sub.nwhereinR.sup.1 is hydrogen, alkyl, alkenyl, alkynyl, --R.sup.3 COOH, alkyl from 1 to 5 carbons substituted with one or two hydroxyl groups,R.sup.2 is hydrogen, alkyl, alkenyl, alkynyl, --R.sup.3 COOH, alkyl from 1 to 5 carbon atoms substituted with one or two hydroxyl groups, --CHO,R.sup.3 is alkyl, and alkyl groups from 1 to 5 carbon atoms substituted with one or two hydroxyl groupsm and n are real numbers or fractions, and m+n=2;applying the palladium precursor to the surface of the substrate;decomposing the palladium precursor by subjecting the precursor to heat.

Abstract: A process for forming a layer of gold on a substrate, comprising: preparing a solution of a gold precursor wherein the gold precursor consists ofAu(OH).sub.p (OOCR.sup.1).sub.q (OOCR.sup.2).sub.rwherein R.sup.1 is selected from the group of hydrogen, alkyl, alkenyl, and alkynyl, and R.sup.2 is selected from the group of hydrogen, alkyl from 2 to 10 carbon atoms, alkenyl, or alkynyl, and p+q+r=3. Applying the solution of the gold precursor to the surface of the substrate. Decomposing the gold precursor by subjecting the gold precursor to heat.