Patents by Inventor Supin Chen
Supin Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240128222Abstract: Methods of manufacturing a sealed electrical device for embedded integrated circuit (IC) chips are described, as well as the resulting devices themselves. The sealed electrical device is created by removing material from a substrate to form a pocket in the substrate. An unencapsulated, or bare, IC chip can be placed within the pocket with connection pads of the IC chip facing outward. A gap between the IC chip and a side of the pocket can be filled with a filler. An uncured polymer can be cast over the substrate, which can be allowed to cure into a flat polymer sheet. Conductive traces can be patterned on the polymer sheet and to the connection pads of the IC chip. The conductive traces can then be coated with polymer to form a ribbon cable. Substrate can then be removed from underneath the ribbon cable, leaving substrate around the pocket to protect the IC chip.Type: ApplicationFiled: October 18, 2022Publication date: April 18, 2024Applicant: Neuralink Corp.Inventors: Supin Chen, Dongjin Seo, Abhivyakti Gautam, Zachary M . Tedoff
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Patent number: 11801381Abstract: The present disclosure relates to a modular system for deep brain stimulation (DBS) and electrocorticography (ECoG). The system may have an implantable neuromodulator for generating electrical stimulation signals adapted to be applied to a desired region of a brain via an attached electrode array. An aggregator module may be used for collecting and aggregating electrical signals and transmitting the electrical signals to the neuromodulator. A control module may be used which is in communication with the aggregator module for controlling generation of the electrical signals and transmitting the electrical signals to the aggregator.Type: GrantFiled: December 9, 2016Date of Patent: October 31, 2023Assignee: Lawrence Livermore National Security, LLCInventors: Satinderpall S. Pannu, Kedar G. Shah, Supin Chen, Marissa Crosetti, Timir B. Datta-Chaudhuri, Sarah H. Felix, Anna N. Ivanovskaya, Jason Jones, Kye Young Lee, Susant Patra, Vanessa Tolosa, Angela C. Tooker
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Patent number: 11444056Abstract: Disclosed is a sandwich assembly containing a thin film electrode array for use with high density electrodes. To minimize the volume required by the associated electronics, the electrode array and integrated circuits are sandwiched over a Printed Circuit Board (PCB), which may have other integrated circuits on an opposite side. Among other things, the disclosed apparatus, system, and method improve over previous systems by providing holes and vias that facilitate communication between a custom chip above the PCB and a field-programmable gate array (FPGA) below. The thin film electrode array can be fastened by bucking a pillar of stacked gold or other metal balls to rivet the thin film flex circuit. The system can include a thin film array having embedded wire traces and holes, a PCB having vias aligned with the holes, chips including an analog-to-digital converter (ADC) sandwiching the thin film, and solder connections from the chips through the holes to the vias.Type: GrantFiled: July 9, 2020Date of Patent: September 13, 2022Assignee: Neuralink Corp.Inventors: Supin Chen, Camilo A. Diaz-Botia, Dongjin Seo, Vanessa M. Tolosa
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Patent number: 11357975Abstract: A cylindrical microelectrode array having an elongated cylindrical core, and a multilayer structure conformally folded around and affixed to the cylindrical core so as to extend between opposite ends of the core. The multilayer structure has integrated sections including an electrode section with electrodes exposed through electrically insulating layers, a connector section with conductive bond pads for interfacing with external electronics, and a cable section with conductive traces encapsulated in electrically insulating layers and which connect between the electrodes and their corresponding bond pads. The array may be fabricated using a planar multilayer structure having the electrode, connector, and cable sections, and conformally folding the multilayer structure around and affixing to the cylindrical core. The cable section in particular may be conformally coiled around and affixed to the cylindrical core so that the electrical conduits helically extend between the connector and electrode sections.Type: GrantFiled: June 9, 2016Date of Patent: June 14, 2022Assignee: Lawrence Livermore National Security, LLCInventors: Kedar G. Shah, Supin Chen, Sarah H. Felix, Satinderpall S. Pannu, Susant Patra, Vanessa Tolosa, Angela C. Tooker, Jason Jones
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Monolithic, biocompatible feedthrough for hermetically sealed electronics and methods of manufacture
Patent number: 11107703Abstract: Methods of manufacturing a biocompatible, hermetic feedthrough monolithically integrated with a biocompatible ribbon cable are described, as well as the resulting devices themselves. The hermetic feedthrough is created by placing glass over a mold of doped silicon or other material with a higher melting temperature than the glass and heating it to reflow the glass into the mold. The glass is then ground or otherwise removed to reveal a flat surface, and tiny pillars that were in the mold are isolated in the glass to form electrically conductive vias. The flat surface is used to cast a polymer and build up a ribbon cable, photolithographically or otherwise, that is monolithically attached to the vias.Type: GrantFiled: July 9, 2020Date of Patent: August 31, 2021Assignee: Neuralink Corp.Inventors: Vanessa M. Tolosa, Camilo A. Diaz-Botia, Supin Chen, Felix Deku, Yu Niu Huang, Mark J. Hettick, Zachary M. Tedoff -
Monolithic, Biocompatible Feedthrough for Hermetically Sealed Electronics and Methods of Manufacture
Publication number: 20210013051Abstract: Methods of manufacturing a biocompatible, hermetic feedthrough monolithically integrated with a biocompatible ribbon cable are described, as well as the resulting devices themselves. The hermetic feedthrough is created by placing glass over a mold of doped silicon or other material with a higher melting temperature than the glass and heating it to reflow the glass into the mold. The glass is then ground or otherwise removed to reveal a flat surface, and tiny pillars that were in the mold are isolated in the glass to form electrically conductive vias. The flat surface is used to cast a polymer and build up a ribbon cable, photolithographically or otherwise, that is monolithically attached to the vias.Type: ApplicationFiled: July 9, 2020Publication date: January 14, 2021Applicant: Neuralink Corp.Inventors: Vanessa M. Tolosa, Camilo A. Diaz-Botia, Supin Chen, Felix Deku, Yu Niu Huang, Mark J. Hettick, Zachary M. Tedoff -
Publication number: 20210008364Abstract: Disclosed is a sandwich assembly containing a thin film electrode array for use with high density electrodes. To minimize the volume required by the associated electronics, the electrode array and integrated circuits are sandwiched over a Printed Circuit Board (PCB), which may have other integrated circuits on an opposite side. Among other things, the disclosed apparatus, system, and method improve over previous systems by providing holes and vias that facilitate communication between a custom chip above the PCB and a field-programmable gate array (FPGA) below. The thin film electrode array can be fastened by bucking a pillar of stacked gold or other metal balls to rivet the thin film flex circuit. The system can include a thin film array having embedded wire traces and holes, a PCB having vias aligned with the holes, chips including an analog-to-digital converter (ADC) sandwiching the thin film, and solder connections from the chips through the holes to the vias.Type: ApplicationFiled: July 9, 2020Publication date: January 14, 2021Applicant: Neuralink Corp.Inventors: Supin Chen, Camilo A. Diaz-Botia, Dongjin Seo, Vanessa M. Tolosa
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Publication number: 20200085375Abstract: Disclosed are biocompatible multi-electrode devices capable of being implanted in sensitive tissue, such as the brain, and methods for fabricating such arrays. The disclosed arrays can be implanted in living biological tissue with a single needle insertion. The devices can include linear arrays with contacts along an edge, linear arrays with multiple electrodes per opening in a parylene support layer, multi-thread electrode arrays, tree-like electrode arrays, and combinations thereof. In an embodiment, a compliant electrode apparatus can comprise a biocompatible and bio-implantable compliant dielectric having a top edge defined by a top and a side along a length of the dielectric, insulated electrical traces oriented along the length of the dielectric, and electrode contacts coupled to the traces and situated on the side along the length of the dielectric, wherein an exposed portion of a respective electrode contact protrudes beyond the top edge of the dielectric.Type: ApplicationFiled: September 12, 2019Publication date: March 19, 2020Applicant: Neuralink Corp.Inventors: Vanessa M. Tolosa, Zachary M. Tedoff, Timothy L. Hanson, Timothy J. Gardner, Camilo A. Diaz-Botia, Supin Chen
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Publication number: 20190054295Abstract: The present disclosure relates to a modular system for deep brain stimulation (DBS) and electrocorticography (ECoG). The system may have an implantable neuromodulator for generating electrical stimulation signals adapted to be applied to a desired region of a brain via an attached electrode array. An aggregator module may be used for collecting and aggregating electrical signals and transmitting the electrical signals to the neuromodulator. A control module may be used which is in communication with the aggregator module for controlling generation of the electrical signals and transmitting the electrical signals to the aggregator.Type: ApplicationFiled: December 9, 2016Publication date: February 21, 2019Applicants: Lawrence Livermore National Security, LLC, Lawrence Livermore National Security, LLCInventors: Satinderpall S. PANNU, Kedar G. SHAH, Supin CHEN, Marissa CROSETTI, Timir B. DATTA-CHAUDHURI, Sarah H. FELIX, Anna N. IVANOVSKAYA, Jason JONES, Kye Young LEE, Susant PATRA, Vanessa TOLOSA, Angela C. TOOKER
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Publication number: 20180169406Abstract: A cylindrical microelectrode array having an elongated cylindrical core, and a multilayer structure conformally folded around and affixed to the cylindrical core so as to extend between opposite ends of the core. The multilayer structure has integrated sections including an electrode section with electrodes exposed through electrically insulating layers, a connector section with conductive bond pads for interfacing with external electronics, and a cable section with conductive traces encapsulated in electrically insulating layers and which connect between the electrodes and their corresponding bond pads. The array may be fabricated using a planar multilayer structure having the electrode, connector, and cable sections, and conformally folding the multilayer structure around and affixing to the cylindrical core. The cable section in particular may be conformally coiled around and affixed to the cylindrical core so that the electrical conduits helically extend between the connector and electrode sections.Type: ApplicationFiled: June 9, 2016Publication date: June 21, 2018Inventors: Kedar G. Shah, Supin Chen, Sarah H. Felix, Satinderpall S. Pannu, Susant Patra, Venessa Tolosa
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Patent number: 9481615Abstract: Disclosed herein are methods of performing microchemical reactions and electro-wetting-on-dielectric devices (EWOD devices) for use in performing those reactions. These devices and method are particularly suited for preparing radiochemical compounds, particularly compounds containing 18F.Type: GrantFiled: October 9, 2015Date of Patent: November 1, 2016Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIAInventors: R. Michael Van Dam, Chang-Jin Kim, Supin Chen, Huijiang Ding, Gaurav Jitendra Shah, Pei Yuin Keng
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Publication number: 20160107951Abstract: Disclosed herein are methods of performing microchemical reactions and electro-wetting-on-dielectric devices (EWOD devices) for use in performing those reactions. These devices and method are particularly suited for preparing radiochemical compounds, particularly compounds containing 18F.Type: ApplicationFiled: October 9, 2015Publication date: April 21, 2016Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIAInventors: R. Michael Van Dam, Chang-Jin Kim, Supin Chen, Huijiang Ding, Gaurav Jitendra Shah, Pei Yuin Keng
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Patent number: 9193640Abstract: Disclosed herein are methods of performing microchemical reactions and electro-wetting-on-dielectric devices (EWOD devices) for use in performing those reactions. These devices and method are particularly suited for preparing radiochemical compounds, particularly compounds containing 18F.Type: GrantFiled: March 10, 2015Date of Patent: November 24, 2015Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIAInventors: R. Michael Van Dam, Chang-Jin Kim, Supin Chen, Huijiang Ding, Gaurav Jitendra Shah, Pei Yuin Keng
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Publication number: 20150203416Abstract: Disclosed herein are methods of performing microchemical reactions and electro-wetting-on-dielectric devices (EWOD devices) for use in performing those reactions. These devices and method are particularly suited for preparing radiochemical compounds, particularly compounds containing 18F.Type: ApplicationFiled: March 10, 2015Publication date: July 23, 2015Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIAInventors: R. Michael Van Dam, Chang-Jin Kim, Supin Chen, Huijiang Ding, Gaurav Jitendra Shah, Pei Yuin Keng
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Patent number: 9005544Abstract: Disclosed herein are methods of performing microchemical reactions and electro-wetting-on-dielectric devices (EWOD devices) for use in performing those reactions. These devices and method are particularly suited for preparing radiochemical compounds, particularly compounds containing 18F.Type: GrantFiled: October 15, 2010Date of Patent: April 14, 2015Assignee: The Regents of the University of CaliforniaInventors: R. Michael Van Dam, Chang-Jin Kim, Supin Chen, Huijiang Ding, Gaurav Jitendra Shah, Pei Yuin Keng
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Publication number: 20120264932Abstract: Disclosed herein are methods of performing microchemical reactions and electro- wetting-on-dielectric devices (EWOD devices) for use in performing those reactions. These devices and method are particularly suited for preparing radiochemical compounds, particularly compounds containing 18F.Type: ApplicationFiled: October 15, 2010Publication date: October 18, 2012Inventors: R. Michael Van Dam, Chang-Jin Kim, Supin Chen, Huijiang Ding, Gaurav Jitendra Shah, Pei Yuin Keng