Patents by Inventor SURAJIT KUMAR
SURAJIT KUMAR has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10132003Abstract: Embodiments disclosed herein generally related to a processing chamber, and more specifically a heat modulator assembly for use in a processing chamber. The heat modulator assembly includes a heat modulator housing and a plurality of heat modulators. The heat modulator housing includes a housing member defining a housing plane, a sidewall, and an annular extension. The sidewall extends perpendicular to the housing plane. The annular extension extends outward from the sidewall. The plurality of heat modulators is positioned in the housing member.Type: GrantFiled: July 21, 2017Date of Patent: November 20, 2018Assignee: APPLIED MATERIALS, INC.Inventors: Shu-Kwan Lau, Surajit Kumar, Joseph M. Ranish, Zhiyuan Ye, Kartik Shah, Mehmet Tugrul Samir, Errol Antonio C. Sanchez
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Patent number: 10119192Abstract: Embodiments described herein relate to a base ring assembly for use in a substrate processing chamber. In one embodiment, the base ring assembly comprises a ring body sized to be received within an inner circumference of the substrate processing chamber, the ring body comprising a loading port for passage of the substrate, a gas inlet, and a gas outlet, wherein the gas inlet and the gas outlet are disposed at opposing ends of the ring body, and an upper ring configured to dispose on a top surface of the ring body, and a lower ring configured to dispose on a bottom surface of the ring body, wherein the upper ring, the lower ring, and the ring body, once assembled, are generally concentric or coaxial.Type: GrantFiled: April 22, 2016Date of Patent: November 6, 2018Assignee: APPLIED MATERIALS, INC.Inventors: Steve Aboagye, Paul Brillhart, Surajit Kumar, Anzhong Chang, Satheesh Kuppurao, Mehmet Tugrul Samir, David K. Carlson
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Publication number: 20180023214Abstract: Embodiments disclosed herein generally related to a processing chamber, and more specifically a heat modulator assembly for use in a processing chamber. The heat modulator assembly includes a heat modulator housing and a plurality of heat modulators. The heat modulator housing includes a housing member defining a housing plane, a sidewall, and an annular extension. The sidewall extends perpendicular to the housing plane. The annular extension extends outward from the sidewall. The plurality of heat modulators is positioned in the housing member.Type: ApplicationFiled: July 21, 2017Publication date: January 25, 2018Inventors: Shu-Kwan LAU, Surajit KUMAR, Joseph M. RANISH, Zhiyuan YE, Kartik SHAH, Mehmet Tugrul SAMIR, Errol Antonio C. SANCHEZ
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Publication number: 20180005856Abstract: Embodiments of the invention relate to a dome assembly. The dome assembly includes an upper dome comprising a central window, and an upper peripheral flange engaging the central window at a circumference of the central window, wherein a tangent line on an inside surface of the central window that passes through an intersection of the central window and the upper peripheral flange is at an angle of about 8° to about 16° with respect to a planar upper surface of the peripheral flange, a lower dome comprising a lower peripheral flange and a bottom connecting the lower peripheral flange with a central opening, wherein a tangent line on an outside surface of the bottom that passes through an intersection of the bottom and the lower peripheral flange is at an angle of about 8° to about 16° with respect to a planar bottom surface of the lower peripheral flange.Type: ApplicationFiled: September 18, 2017Publication date: January 4, 2018Inventors: Anzhong CHANG, Paul BRILLHART, Surajit KUMAR, Satheesh KUPPURAO, Mehmet Tugrul SAMIR, David K. CARLSON, Steve ABOAGYE, Anh N. NGUYEN, Kailash Kiran PATALAY, Joseph M. RANISH, Oleg V. SEREBRYANOV, Dongming IU, Shu-Kwan LAU, Zuoming ZHU, Herman DINIZ
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Patent number: 9768043Abstract: Embodiments of the present disclosure relate to a dome assembly. The dome assembly includes an upper dome including a central window, and an upper peripheral flange engaging the central window at a circumference of the central window, wherein a tangent line on an inside surface of the central window that passes through an intersection of the central window and the upper peripheral flange is at an angle of about 8° to about 16° with respect to a planar upper surface of the peripheral flange, a lower dome comprising a lower peripheral flange and a bottom connecting the lower peripheral flange with a central opening, wherein a tangent line on an outside surface of the bottom that passes through an intersection of the bottom and the lower peripheral flange is at an angle of about 8° to about 16° with respect to a planar bottom surface of the lower peripheral flange.Type: GrantFiled: December 18, 2013Date of Patent: September 19, 2017Assignee: APPLIED MATERIALS, INC.Inventors: Anzhong Chang, Paul Brillhart, Surajit Kumar, Satheesh Kuppurao, Mehmet Tugrul Samir, David K. Carlson, Steve Aboagye, Anh N. Nguyen, Kailash Kiran Patalay, Joseph M. Ranish, Oleg Serebryanov, Dongming Iu, Shu-Kwan Lau, Zuoming Zhu, Herman Diniz
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Publication number: 20160348276Abstract: A reflector for processing a semiconductor substrate is provided. The reflector includes an annular body having an outer edge, an inner edge, and a bottom side. The bottom side includes a plurality of first surfaces and a plurality of second surfaces. Each first surface and each second surface is positioned at a different angular location around the annular body. Each first surface is a curved surface having a radius of curvature from about 1.50 inches to about 2.20 inches.Type: ApplicationFiled: May 27, 2016Publication date: December 1, 2016Inventors: Shu-Kwan LAU, Surajit KUMAR, Kartik SHAH, Mehmet Tugrul SAMIR
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Publication number: 20160230276Abstract: Embodiments described herein relate to a base ring assembly for use in a substrate processing chamber. In one embodiment, the base ring assembly comprises a ring body sized to be received within an inner circumference of the substrate processing chamber, the ring body comprising a loading port for passage of the substrate, a gas inlet, and a gas outlet, wherein the gas inlet and the gas outlet are disposed at opposing ends of the ring body, and an upper ring configured to dispose on a top surface of the ring body, and a lower ring configured to dispose on a bottom surface of the ring body, wherein the upper ring, the lower ring, and the ring body, once assembled, are generally concentric or coaxial.Type: ApplicationFiled: April 22, 2016Publication date: August 11, 2016Inventors: Steve ABOAGYE, Paul BRILLHART, Surajit KUMAR, Anzhong CHANG, Satheesh KUPPURAO, Mehmet Tugrul SAMIR, David K. CARLSON
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Publication number: 20160169593Abstract: Apparatus for controlling the thermal uniformity of a substrate are provided. The thermal uniformity of the substrate may be controlled to be more uniform or the thermal uniformity of the substrate may be controlled to be non-uniform in a desired pattern. In some embodiments, an apparatus for controlling the thermal uniformity of a substrate includes: a substrate support having a support surface to support a substrate thereon; and a flow path disposed within the substrate support to flow a heat transfer fluid beneath the support surface, wherein the flow path comprises a first portion and a second portion, each portion having a substantially equivalent axial length, wherein the first portion is spaced about 2 mm to about 10 mm from the second portion, and wherein the first portion provides a flow of heat transfer fluid in a direction opposite a flow of heat transfer fluid of the second portion.Type: ApplicationFiled: February 22, 2016Publication date: June 16, 2016Inventors: KALLOL BERA, XIAOPING ZHOU, DOUGLAS A. BUCHBERGER, JR., ANDREW NGUYEN, HAMID TAVASSOLI, SURAJIT KUMAR, SHAHID RAUF
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Patent number: 9322097Abstract: Embodiments described herein relate to a base ring assembly for use in a substrate processing chamber. In one embodiment, the base ring assembly comprises a ring body sized to be received within an inner circumference of the substrate processing chamber, the ring body comprising a loading port for passage of the substrate, a gas inlet, and a gas outlet, wherein the gas inlet and the gas outlet are disposed at opposing ends of the ring body, and an upper ring configured to dispose on a top surface of the ring body, and a lower ring configured to dispose on a bottom surface of the ring body, wherein the upper ring, the lower ring, and the ring body, once assembled, are generally concentric or coaxial.Type: GrantFiled: March 18, 2013Date of Patent: April 26, 2016Assignee: APPLIED MATERIALS, INC.Inventors: Steve Aboagye, Paul Brillhart, Surajit Kumar, Anzhong Chang, Satheesh Kuppurao, Mehmet Tugrul Samir, David K. Carlson
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Patent number: 9267742Abstract: Apparatus for controlling the thermal uniformity of a substrate. In some embodiments, the thermal uniformity of the substrate is controlled to be more uniform. In some embodiments, the thermal uniformity of the substrate is controlled to be non-uniform in a desired pattern. In some embodiments, an apparatus for controlling thermal uniformity of a substrate includes a substrate support having a support surface to support a substrate thereon. A plurality of flow paths having a substantially equivalent fluid conductance are disposed within the substrate support to flow a heat transfer fluid beneath the support surface.Type: GrantFiled: September 20, 2010Date of Patent: February 23, 2016Assignee: APPLIED MATERIALS, INC.Inventors: Kallol Bera, Xiaoping Zhou, Douglas A. Buchberger, Jr., Andrew Nguyen, Hamid Tavassoli, Surajit Kumar, Shahid Rauf
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Patent number: 9248509Abstract: An electrostatic chuck assembly including a dielectric layer with a top surface to support a workpiece. A cooling channel base disposed below the dielectric layer includes a plurality of inner fluid conduits disposed beneath an inner portion of the top surface, and a plurality of outer fluid conduits disposed beneath an outer portion of the top surface. A chuck assembly includes a thermal break disposed within the cooling channel base between the inner and outer fluid conduits. A chuck assembly includes a fluid distribution plate disposed below the cooling channel base and the base plate to distribute a heat transfer fluid delivered from a common input to each inner or outer fluid conduit. The branches of the inner input manifold may have substantially equal fluid conductance.Type: GrantFiled: July 30, 2014Date of Patent: February 2, 2016Assignee: APPLIED MATERIALS, INC.Inventors: Hamid Tavassoli, Surajit Kumar, Kallol Bera, Xiaoping Zhou, Shane C. Nevil, Douglas A. Buchberger, Jr.
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Publication number: 20150083046Abstract: Embodiments described herein generally relate to an apparatus for heating substrates. In one embodiment, a susceptor comprises a ring shaped body having a central opening and a lip extending from an edge of the body that circumscribes the central opening. The susceptor comprises carbon fiber or graphene. In another embodiment, a method for forming a susceptor comprises molding carbon fiber with an organic binder into a shape of a ring susceptor and firing the organic binder. In yet another embodiment, a method for forming a susceptor comprises layering graphene sheets into a shape of a ring susceptor.Type: ApplicationFiled: September 24, 2014Publication date: March 26, 2015Inventors: Joseph M. RANISH, Paul BRILLHART, Mehmet Tugrul SAMIR, Shu-Kwan LAU, Surajit KUMAR
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Publication number: 20140346743Abstract: An electrostatic chuck assembly including a dielectric layer with a top surface to support a workpiece. A cooling channel base disposed below the dielectric layer includes a plurality of inner fluid conduits disposed beneath an inner portion of the top surface, and a plurality of outer fluid conduits disposed beneath an outer portion of the top surface. A chuck assembly includes a thermal break disposed within the cooling channel base between the inner and outer fluid conduits. A chuck assembly includes a fluid distribution plate disposed below the cooling channel base and the base plate to distribute a heat transfer fluid delivered from a common input to each inner or outer fluid conduit. The branches of the inner input manifold may have substantially equal fluid conductance.Type: ApplicationFiled: July 30, 2014Publication date: November 27, 2014Inventors: Hamid Tavassoli, Surajit Kumar, Kallol Bera, Xiaoping Zhou, Shane C. Nevil, Douglas A. Buchberger, JR.
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Publication number: 20140287170Abstract: An apparatus for processing a semiconductor substrate is described. The apparatus is a process chamber having an optically transparent upper dome and lower dome. Vacuum is maintained in the process chamber during processing. The upper dome is thermally controlled by flowing a thermal control fluid along the upper dome outside the processing region. Thermal lamps are positioned proximate the lower dome, and thermal sensors are disposed among the lamps. The lamps are powered in zones, and a controller adjusts power to the lamp zones based on data received from the thermal sensors. A reflective liner may provide for improved temperature measurement and heating of a substrate.Type: ApplicationFiled: February 21, 2014Publication date: September 25, 2014Inventors: JOSEPH M. RANISH, Paul Brillhart, Surajit Kumar
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Publication number: 20140261185Abstract: Embodiments described herein relate to a base ring assembly for use in a substrate processing chamber. In one embodiment, the base ring assembly comprises a ring body sized to be received within an inner circumference of the substrate processing chamber, the ring body comprising a loading port for passage of the substrate, a gas inlet, and a gas outlet, wherein the gas inlet and the gas outlet are disposed at opposing ends of the ring body, and an upper ring configured to dispose on a top surface of the ring body, and a lower ring configured to dispose on a bottom surface of the ring body, wherein the upper ring, the lower ring, and the ring body, once assembled, are generally concentric or coaxial.Type: ApplicationFiled: March 18, 2013Publication date: September 18, 2014Applicant: Applied Materials, Inc.Inventors: STEVE ABOAGYE, Paul Brillhart, Surajit Kumar, Anzhong Chang, Satheesh Kuppurao, Mehmet Tugrul Samir, David K. Carlson
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Patent number: 8822876Abstract: An electrostatic chuck assembly including a dielectric layer with a top surface to support a workpiece. A cooling channel base disposed below the dielectric layer includes a plurality of inner fluid conduits disposed beneath an inner portion of the top surface, and a plurality of outer fluid conduits disposed beneath an outer portion of the top surface. A chuck assembly includes a thermal break disposed within the cooling channel base between the inner and outer fluid conduits. A chuck assembly includes a fluid distribution plate disposed below the cooling channel base and the base plate to distribute a heat transfer fluid delivered from a common input to each inner or outer fluid conduit. The branches of the inner input manifold may have substantially equal fluid conductance.Type: GrantFiled: April 6, 2011Date of Patent: September 2, 2014Assignee: Applied Materials, Inc.Inventors: Hamid Tavassoli, Surajit Kumar, Kallol Bera, Xiaoping Zhou, Shane C. Nevil, Douglas A. Buchberger, Jr.
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Publication number: 20140199056Abstract: Embodiments of the invention relate to a dome assembly. The dome assembly includes an upper dome comprising a central window, and an upper peripheral flange engaging the central window at a circumference of the central window, wherein a tangent line on an inside surface of the central window that passes through an intersection of the central window and the upper peripheral flange is at an angle of about 8° to about 16° with respect to a planar upper surface of the peripheral flange, a lower dome comprising a lower peripheral flange and a bottom connecting the lower peripheral flange with a central opening, wherein a tangent line on an outside surface of the bottom that passes through an intersection of the bottom and the lower peripheral flange is at an angle of about 8° to about 16° with respect to a planar bottom surface of the lower peripheral flange.Type: ApplicationFiled: December 18, 2013Publication date: July 17, 2014Inventors: Anzhong CHANG, Paul BRILLHART, Surajit KUMAR, Satheesh KUPPURAO, Mehmet Tugrul SAMIR, David K. CARLSON, Steve ABOAGYE, Anh N. NGUYEN, Kailash Kiran PATALAY, Joseph M. RANISH, Oleg SEREBRYANOV, Dongming IU, Shu-Kwan LAU, Zuoming ZHU, Herman DINIZ
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Patent number: 8629370Abstract: A triaxial rod assembly for providing both RF power and DC voltage to a chuck assembly that supports a workpiece in a processing chamber during a manufacturing operation. In embodiments, a rod assembly includes a center conductor to be coupled to a chuck electrode for providing DC voltage to clamp a workpiece. Concentrically surrounding the center conductor is an annular RF transmission line to be coupled to an RF powered base to provide RF power to the chuck assembly. An insulator is disposed between the center conductor and RF transmission line. Concentrically surrounding the RF transmission line is a ground plane conductor coupled to a grounded base of the chuck to provide a reference voltage relative to the DC voltage. An insulator is disposed between the RF transmission line and the ground plane conductor.Type: GrantFiled: April 12, 2011Date of Patent: January 14, 2014Assignee: Applied Materials, Inc.Inventors: Hamid Tavassoli, Surajit Kumar, Shane C. Nevil, Douglas A. Buchberger, Jr.
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Publication number: 20120091104Abstract: An electrostatic chuck assembly including a dielectric layer with a top surface to support a workpiece. A cooling channel base disposed below the dielectric layer includes a plurality of inner fluid conduits disposed beneath an inner portion of the top surface, and a plurality of outer fluid conduits disposed beneath an outer portion of the top surface. A chuck assembly includes a thermal break disposed within the cooling channel base between the inner and outer fluid conduits. A chuck assembly includes a fluid distribution plate disposed below the cooling channel base and the base plate to distribute a heat transfer fluid delivered from a common input to each inner or outer fluid conduit. The branches of the inner input manifold may have substantially equal fluid conductance.Type: ApplicationFiled: April 6, 2011Publication date: April 19, 2012Applicant: APPLIED MATERIALS, INC.Inventors: Hamid Tavassoli, Surajit KUMAR, Kallol Bera, Xiaoping Zhou, Shane C. Nevil, Douglas A. Buchberger, JR.
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Publication number: 20110297650Abstract: A triaxial rod assembly for providing both RF power and DC voltage to a chuck assembly that supports a workpiece in a processing chamber during a manufacturing operation. In embodiments, a rod assembly includes a center conductor to be coupled to a chuck electrode for providing DC voltage to clamp a workpiece. Concentrically surrounding the center conductor is an annular RF transmission line to be coupled to an RF powered base to provide RF power to the chuck assembly. An insulator is disposed between the center conductor and RF transmission line. Concentrically surrounding the RF transmission line is a ground plane conductor coupled to a grounded base of the chuck to provide a reference voltage relative to the DC voltage. An insulator is disposed between the RF transmission line and the ground plane conductor.Type: ApplicationFiled: April 12, 2011Publication date: December 8, 2011Applicant: APPLIED MATERIALS, INC.Inventors: Hamid Tavassoli, Surajit Kumar, Shane C. Nevil, Douglas A. Buchberger, JR.