Patents by Inventor Suresh Shrauti

Suresh Shrauti has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • BARRIER LAYER DISPOSED BETWEEN A SUBSTRATE AND A TRANSPARENT CONDUCTIVE OXIDE LAYER FOR THIN FILM SILICON SOLAR CELLS
    Publication number: 20110088762
    Abstract: A method and apparatus for forming solar cells is provided. In one embodiment, a photovoltaic device includes a barrier layer disposed on a substrate, a TCO layer disposed on the barrier layer, and a p-i-n junction cell formed on the TCO layer. In another embodiment, a method for forming a photovoltaic device includes providing a substrate having a surface, forming a barrier layer on the surface of the substrate, forming a TCO layer on a top surface of the barrier layer, and forming a p-i-n junction cell on the TCO layer.
    Type: Application
    Filed: September 10, 2010
    Publication date: April 21, 2011
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Kaushal K. Singh, Deepak Pingalay, Suresh Shrauti
  • Method for Chemical Mechanical Planarization of A Metal-containing Substrate
    Publication number: 20090061630
    Abstract: A method using an associated composition for chemical mechanical planarization of a metal-containing substrate (e.g., a copper substrate) is described. This method affords low dishing and local erosion levels on the metal during CMP processing of the metal-containing substrate.
    Type: Application
    Filed: August 21, 2008
    Publication date: March 5, 2009
    Applicant: DuPont Air Products Nanomaterials LLC
    Inventors: Bentley J. Palmer, Ann Marie Meyers, Suresh Shrauti, Guangying Zhang, Ajoy Zutshi
  • RETAINING RING WITH CONDUCTIVE PORTION
    Publication number: 20080038999
    Abstract: A retaining ring for use with electrochemical mechanical processing is described. The retaining ring has a generally annular body formed with a conductive portion and a non-conductive portion. The non-conductive portion contacts the substrate during polishing. The conductive portion is electrically biased during polishing to reduce the edge effect that tends to occur with conventional electrochemical mechanical processing systems.
    Type: Application
    Filed: October 1, 2007
    Publication date: February 14, 2008
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Antoine Manens, Suresh Shrauti, Alain Duboust, Yan Wang, Liang-Yuh Chen
  • Retaining ring with conductive portion
    Patent number: 7276743
    Abstract: A retaining ring for use with electrochemical mechanical processing is described. The retaining ring has a generally annular body formed with a conductive portion and a non-conductive portion. The non-conductive portion contacts the substrate during polishing. The conductive portion is electrically biased during polishing to reduce the edge effect that tends to occur with conventional electrochemical mechanical processing systems.
    Type: Grant
    Filed: May 11, 2005
    Date of Patent: October 2, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Antoine P. Manens, Suresh Shrauti, Alain Duboust, Yan Wang, Liang-Yuh Chen
  • Retaining ring with conductive portion
    Publication number: 20050282322
    Abstract: A retaining ring for use with electrochemical mechanical processing is described. The retaining ring has a generally annular body formed with a conductive portion and a non-conductive portion. The non-conductive portion contacts the substrate during polishing. The conductive portion is electrically biased during polishing to reduce the edge effect that tends to occur with conventional electrochemical mechanical processing systems.
    Type: Application
    Filed: May 11, 2005
    Publication date: December 22, 2005
    Inventors: Antoine Manens, Suresh Shrauti, Alain Duboust, Yan Wang, Liang-Yuh Chen