Abstract: Systems and techniques for sensor-derived object flight performance tracking are described herein. A set of magnetometer readings may be obtained from a magnetometer included with an object. A local rotation axis of the object may be determined at a time using the set of magnetometer readings. The local rotation axis may describe rotation of the object around a local magnetic target. A global rotation axis may be calculated based on an initial orientation of the object. The global rotation axis may describe a fixed rotation axis of the object during flight in a global coordinate frame, wherein an angle between the global rotation axis and magnetic north remains constant during the flight. An orientation of the object may be determined for the time using the global rotation axis and the local rotation axis of the object at the time.

Abstract: Systems and techniques for sensor-derived object flight performance tracking are described herein. A set of magnetometer readings may be obtained from a magnetometer included with an object. A local rotation axis of the object may be determined at a time using the set of magnetometer readings. The local rotation axis may describe rotation of the object around a local magnetic target. A global rotation axis may be calculated based on an initial orientation of the object. The global rotation axis may describe a fixed rotation axis of the object during flight in a global coordinate frame, wherein an angle between the global rotation axis and magnetic north remains constant during the flight. An orientation of the object may be determined for the time using the global rotation axis and the local rotation axis of the object at the time.

Abstract: Systems and techniques for sensor-derived object flight performance tracking are described herein. A set of magnetometer readings may be obtained from a magnetometer included with an object. A local rotation axis of the object may be determined at a time using the set of magnetometer readings. The local rotation axis may describe rotation of the object around a local magnetic target. A global rotation axis may be calculated based on an initial orientation of the object. The global rotation axis may describe a fixed rotation axis of the object during flight in a global coordinate frame, wherein an angle between the global rotation axis and magnetic north remains constant during the flight. An orientation of the object may be determined for the time using the global rotation axis and the local rotation axis of the object at the time.

Abstract: Systems and techniques for sensor-derived object flight performance tracking are described herein. A set of magnetometer readings may be obtained from a magnetometer included with an object. A local rotation axis of the object may be determined at a time using the set of magnetometer readings. The local rotation axis may describe rotation of the object around a local magnetic target. A global rotation axis may be calculated based on an initial orientation of the object. The global rotation axis may describe a fixed rotation axis of the object during flight in a global coordinate frame, wherein an angle between the global rotation axis and magnetic north remains constant during the flight. An orientation of the object may be determined for the time using the global rotation axis and the local rotation axis of the object at the time.

Abstract: The present disclosure describes a number of embodiments related to devices, systems, and methods locating a an object using ultra-wide band (UWB) radio transceivers embedded in carpet or other flexible material that may be rolled up and moved to various locations. Once in a location, the carpet may be unrolled and the multiple embedded radio transceivers may receive a signal from a tag attached to the object sending UWB radio signals. Based on the signals received by the UWB radio transceivers, various processes including time-difference on arrival, time-of-flight, and phase shift may be used to determine the location or the movement of the object.

Abstract: The present disclosure describes a number of embodiments related to devices, systems, and methods locating a an object using ultra-wide band (UWB) radio transceivers embedded in carpet or other flexible material that may be rolled up and moved to various locations. Once in a location, the carpet may be unrolled and the multiple embedded radio transceivers may receive a signal from a tag attached to the object sending UWB radio signals. Based on the signals received by the UWB radio transceivers, various processes including time-difference on arrival, time-of-flight, and phase shift may be used to determine the location or the movement of the object.

Abstract: A method is disclosed for constructing a dual-sided chip package onto a leadframe having a die pad and a set of lead fingers corresponding to the die pad. Integrated circuit dies are disposed onto each side of the die pad while the leadframe is supported with support blocks having cavities that accept the integrated circuit dies and that support each lead finger and that provide clearance for stitch bonds of the previously formed wire bonds. Thereafter, a one step plastic mold is formed around each assembly comprising the dual integrated circuit dies, the die pads, and the wire bonds.

Abstract: A method is disclosed for constructing a dual-sided chip package onto a leadframe having a die pad and a set of lead fingers corresponding to the die pad. Integrated circuit dies are disposed onto each side of the die pad while the leadframe is supported with support blocks having cavities that accept the integrated circuit dies and that support each lead finger and that provide clearance for stitch bonds of the previously formed wire bonds. Thereafter, a one step plastic mold is formed around each assembly comprising the dual integrated circuit dies, the die pads, and the wire bonds.

Abstract: A method for constructing a dual sided integrated circuit chip package. A leadframe is formed comprising a set of die pads, and a set of lead fingers corresponding to each die pad. An integrated circuit die is disposed onto a first side and a second side of each die pad. Each integrated circuit die is wire bonded to the corresponding lead fingers. The temperature during the second side die attach and wire bonding steps is controlled and/or compatible materials are selected to prevent warping of the leadframe, and special steps are also implemented to eliminate mold flash, plastic mold cracking and overcuring and increasing the adhesion.

Abstract: A method of producing surface features having topological variances in the scribeline areas of a wafer adjacent to the dies. Surface features are used to reduce fracturing of molding compound and to prevent movement of the molding compound with respect to the surface of a die in a plastic encapsulated integrated circuit.