Patents by Inventor Susan A. Mack

Susan A. Mack has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solderable contacts for flip chip integrated circuit devices
    Patent number: 5547740
    Abstract: A flip chip integrated circuit device (110) is provided having a surface, a perimeter, and solder bumps (112) located on the surface. At least one solder bump (112), and preferably a plurality of solder bumps (112), are spaced apart from the perimeter of the device (110). Electrically conductive runners (118) extend from the perimeter of the device (110) to each of those solder bumps (112) that are spaced apart from the perimeter, so as to electrically interconnect the solder bumps (112) to a point, such as a pad (116), at the perimeter. As a result, not all of the solder bumps (112) employed by the device (110) need be accommodated at the perimeter of the device (110), such that the size and number of the solder bumps (112) does not dictate the size of the device (110).
    Type: Grant
    Filed: March 23, 1995
    Date of Patent: August 20, 1996
    Assignee: Delco Electronics Corporation
    Inventors: William D. Higdon, Susan A. Mack, Ralph E. Cornell