Abstract: Aspects herein are directed to an apparel item that promotes thermo-regulation through the use of engineered openings, venting, and/or stand-off structures. In exemplary aspects, 20-45% of the apparel item may comprise the engineered openings. Vents may be positioned on the apparel item in areas that experience high amounts of air flow to help channel air into the apparel item. The stand-off structures may be positioned on an inner-facing surface of the apparel item where they help to create a space between the apparel item and the wearer's body surface in which air can flow and help cool the wearer by promoting evaporative cooling.

Abstract: A load securement device may comprise an extendable pole and a plurality of attachments. The device may be operable to manipulate a tie down of a cargo trailer. As non-limiting examples, the tie down may be a cargo strap, a cargo chain, or an elastic cord used to secure a cargo or to secure a tarp over the cargo. The extendable pole may be lengthened to reach the top of the cargo. The extendable pole may be shortened to take up less space for storage. The plurality of attachments may alter a distal end of the extendable pole to enable the extendable pole to perform multiple tasks necessary for securing the cargo. As non-limiting examples, the plurality of attachments may enable the extendable pole to toss the cargo strap, to pull the cargo strap, or lift a hard corner.

Abstract: A boot jack includes a base, an intermediate portion extending from the base, and a boot grip portion extending from the intermediate portion. The boot jack has an overall tapered shape, which can allow the boot jack to fit into an empty boot for storage.

Abstract: A boot jack includes a base, an intermediate portion extending from the base, and a boot grip portion extending from the intermediate portion. The boot jack has an overall tapered shape, which can allow the boot jack to fit into an empty boot for storage.

Abstract: A clipping apparatus is described herein. The clipping apparatus may include a u-shaped clasp and a tab. The clasp may include an open end and a closed end, a first side and a second side, and a tongue. The tab may be coupled to, and extend from, the closed end of the clasp. The first side may include a wall extending from the closed end to the open end. The second side may include two prongs extending from the closed end to the open end. The tongue may be rotatably connected to the two prongs between the two prongs. The tab may include a first opening and a second opening. The first opening may be disposed in the tab adjacent to the closed end of the clasp. The second opening may be disposed in the tab at a distal end to the tab from the clasp.

Abstract: A clipping apparatus is described herein. The clipping apparatus may include a u-shaped clasp and a tab. The clasp may include an open end and a closed end, a first side and a second side, and a tongue. The tab may be coupled to, and extend from, the closed end of the clasp. The first side may include a wall extending from the closed end to the open end. The second side may include two prongs extending from the closed end to the open end. The tongue may be rotatably connected to the two prongs between the two prongs. The tab may include a first opening and a second opening. The first opening may be disposed in the tab adjacent to the closed end of the clasp. The second opening may be disposed in the tab at a distal end to the tab from the clasp.

Abstract: New temporary bonding methods and articles formed from those methods are provided. In one embodiment, the methods comprise coating a device or other ultrathin layer on a growth substrate with a rigid support layer and then bonding that stack to a carrier substrate. The growth substrate can then be removed and the ultrathin layer mounted on a final support. In another embodiment, the invention provides methods of handling device layers during processing that must occur on both sides of the fragile layer without damaging it. This is accomplished via the sequential use of two carriers, one on each side of the device layer, bonded with different bonding compositions for selective debonding.

Abstract: New compositions and methods of using those compositions as bonding compositions for temporary wafer bonding are provided. The compositions are used to temporarily bond an active wafer to a carrier wafer or substrate in microelectronic fabrication using an in situ polymerization reaction of the components of the bonding composition to yield the bonding layer. The compositions form polymerized bonding layers that are mechanically strong and thermally resistant, but allow the wafers to be separated at the appropriate stage in the fabrication process. The bonding layer also retains its solubility so that residue can be cleaned from the debonded wafers using simple wet methods rather than etching or other harsh treatments.

Abstract: New temporary bonding methods and articles formed from those methods are provided. In one embodiment, the methods comprise coating a device or other ultrathin layer on a growth substrate with a rigid support layer and then bonding that stack to a carrier substrate. The growth substrate can then be removed and the ultrathin layer mounted on a final support. In another embodiment, the invention provides methods of handling device layers during processing that must occur on both sides of the fragile layer without damaging it. This is accomplished via the sequential use of two carriers, one on each side of the device layer, bonded with different bonding compositions for selective debonding.

Abstract: New compositions and methods of using those compositions as bonding compositions for temporary wafer bonding are provided. The compositions are used to temporarily bond an active wafer to a carrier wafer or substrate in microelectronic fabrication using an in situ polymerization reaction of the components of the bonding composition to yield the bonding layer. The compositions form polymerized bonding layers that are mechanically strong and thermally resistant, but allow the wafers to be separated at the appropriate stage in the fabrication process. The bonding layer also retains its solubility so that residue can be cleaned from the debonded wafers using simple wet methods rather than etching or other harsh treatments.

Abstract: An image-recording medium includes a substrate, one or more writable layers adapted to be written by laser radiation characterized by a laser wavelength to form an image therein, and one or more thermally insulating layers comprising a material substantially transparent both at the laser wavelength and at wavelengths in the visible spectrum.

Abstract: A radiation imageable coating includes a first thermochromic layer including a bleachable antenna dye and a second thermochromic layer including a non-bleachable antenna dye.