Patents by Inventor Susan J. Bradley

Susan J. Bradley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System for bonding a heatsink to a semiconductor chip package
    Patent number: 5308429
    Abstract: A method and apparatus for bonding a heatsink to a semiconductor chip package using localized pressure and conducted heat. A thermally conductive adhesive film is positioned between the heatsink and the package. A heated copper slug is positioned on top of the heatsink. Heat conducted from the slug and through the heatsink to the adhesive melts and cures the adhesive under a constant pressure supplied by the dead weight of the slug to create a bond-line having a desired thickness.
    Type: Grant
    Filed: September 29, 1992
    Date of Patent: May 3, 1994
    Assignee: Digital Equipment Corporation
    Inventor: Susan J. Bradley