Abstract: The present invention is directed to photoinitiated cationic epoxy compositions, which show a delayed onset of cure resulting in controllable “open times” for the end user consumer. These compositions are activated by exposure to electromagnetic radiation, such as UV radiation with a wavelength In the range of 254-405 nm, but show a commercially meaningful “open time” and then cure even in shaded zones to achieve a desired final adhesive strength.

Abstract: A method of preparing a bonded assembly of two substrates at least one of which is transparent or translucent to UV or visible light, comprises a) applying, to at least one of the substrates, a photo/anaerobic dual cure composition comprising: i) a (meth)acrylate-capped urethane oligomer, ii) at least one (meth)acrylate diluent monomer, iii) an anaerobic curing system, and iv) a free-radical photoinitiator; b) joining the two substrates c) irradiating the adhesive through said transparent or translucent substrates with light of a wavelength effective to activate the photoinitiator for a time sufficient to at least fixture the adhesive, and then d) allowing the assembly to further cure at ambient conditions without for at least 24 hrs without subjecting the fixtured assembly to substantial peel stresses.

Abstract: The present invention is directed to low intensity UV curable adhesives formulated using a blend of acrylate oligomers and monomers which are capable of bonding glass, provide improved low-yellowing properties and fast cure speed over current glass bonding adhesives, while maintaining good bond strength lo and durability comparable to, or better than, state-of-the-art glass bonding adhesives.

Abstract: Resin compositions useful for filament winding applications comprising an epoxy component including at least one polyepoxide resin curable by heat, an olefinicially unsaturated monomer component including at least one polyolefinically unsaturated monomer curable by actinic radiation, at least one photoinitiator which is not a peroxide, at least one organic peroxide, and a heat activated curing agent for epoxides. The compositions have a viscosity less than about 2000 centipoise (cps) and are capable of retaining this viscosity for at least about 2 hours at a temperature of from about ambient temperature to about 60.degree. C. The resins are capable of being immobilized by actinic radiation exposure and further heat cured without substantial resin drip. One or more organic peroxides are employed, selected from the group of organic peroxides having 10 hour decomposition half lives at temperatures of from about 50.degree. C. to less than about 104.degree. C.