Patents by Inventor Susanne L. Kumpf

Susanne L. Kumpf has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing a fluid ejection device
    Patent number: 7716832
    Abstract: A heating element of a printhead has a conductive layer deposited over a substrate, and a resistive layer deposited over and in electrical contact with the conductive layer.
    Type: Grant
    Filed: December 19, 2006
    Date of Patent: May 18, 2010
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Richard Todd Miller, Susanne L Kumpf
  • Method of fabricating a printhead
    Patent number: 7168157
    Abstract: A heating element of a printhead has a conductive layer deposited over a substrate, and a resistive layer deposited over and in electrical contact with the conductive layer.
    Type: Grant
    Filed: April 29, 2003
    Date of Patent: January 30, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Richard Todd Miller, Susanne L Kumpf
  • Methods and systems for forming slots in a substrate
    Patent number: 6911155
    Abstract: The described embodiments relate to methods and systems for forming slots in a substrate. In one exemplary embodiment, a slot is formed in a substrate that has first and second opposing surfaces. A first trench is dry etched through the first surface of the substrate. A second trench is created through the second surface of the substrate effective to form, in combination with the first trench, a slot. At least a portion of the slot passes entirely through the substrate, and the maximum width of the slot is less than or equal to about 50 of the thickness of the substrate.
    Type: Grant
    Filed: January 31, 2002
    Date of Patent: June 28, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael D. Miller, Michael Hager, Naoto A. Kawamura, Roberto A. Pugliese, Jr., Ronald L. Enck, Susanne L. Kumpf, Shen Buswell, Mehrgan Khavari
  • Heating element of a printhead having resistive layer over conductive layer
    Publication number: 20030206216
    Abstract: A heating element of a printhead has a conductive layer deposited over a substrate, and a resistive layer deposited over and in electrical contact with the conductive layer.
    Type: Application
    Filed: April 29, 2003
    Publication date: November 6, 2003
    Inventors: Richard Todd Miller, Susanne L. Kumpf
  • Methods and systems for forming slots in a substrate
    Publication number: 20030141279
    Abstract: The described embodiments relate to methods and systems for forming slots in a substrate. In one exemplary embodiment, a slot is formed in a substrate that has first and second opposing surfaces. A first trench is dry etched through the first surface of the substrate. A second trench is created through the second surface of the substrate effective to form, in combination with the first trench, a slot. At least a portion of the slot passes entirely through the substrate, and the maximum width of the slot is less than or equal to about 50 of the thickness of the substrate.
    Type: Application
    Filed: January 31, 2002
    Publication date: July 31, 2003
    Inventors: Michael D. Miller, Michael Hager, Naoto A. Kawamura, Roberto A. Pugliese, Ronald L. Enck, Susanne L. Kumpf, Shen Buswell, Mehrgan Khavari
  • Fluid-jet printhead and method of fabricating a fluid-jet printhead
    Patent number: 6558969
    Abstract: A fluid-jet printhead has a substrate on which at least one layer defining a fluid chamber for ejecting fluid is applied. The printhead includes an elevation layer disposed on the substrate and aligned with the fluid chamber. The printhead also includes a resistive layer disposed between the elevation layer and the substrate wherein the resistive layer has a smooth planer surface interfacing with the resistive layer.
    Type: Grant
    Filed: August 21, 2002
    Date of Patent: May 6, 2003
    Assignee: Hewlett-Packard Development Company
    Inventors: Richard Todd Miller, Susanne L. Kumpf
  • Heating element of a printhead having conductive layer between resistive layers
    Patent number: 6513913
    Abstract: A heating element of a printhead has a conductive layer deposited over a substrate, and a resistive layer deposited over and in electrical contact with the conductive layer.
    Type: Grant
    Filed: June 28, 2001
    Date of Patent: February 4, 2003
    Assignee: Hewlett-Packard Company
    Inventors: Donald W Schulte, Richard Todd Miller, Susanne L Kumpf
  • Fluid-jet printhead and mehod of fabricating a fluid-jet printhead
    Publication number: 20030001928
    Abstract: A fluid-jet printhead has a substrate on which at least one layer defining a fluid chamber for ejecting fluid is applied. The printhead includes an elevation layer disposed on the substrate and aligned with the fluid chamber. The printhead also includes a resistive layer disposed between the elevation layer and the substrate wherein the resistive layer has a smooth planer surface interfacing with the resistive layer.
    Type: Application
    Filed: August 21, 2002
    Publication date: January 2, 2003
    Inventors: Richard Todd Miller, Susanne L. Kumpf
  • HEATING ELEMENT OF A PRINTHEAD HAVING CONDUCTIVE LAYER BETWEEN RESISTIVE LAYERS
    Publication number: 20020158946
    Abstract: A heating element of a printhead has a conductive layer deposited over a substrate, and a resistive layer deposited over and in electrical contact with the conductive layer.
    Type: Application
    Filed: June 28, 2001
    Publication date: October 31, 2002
    Inventors: Donald W. Schulte, Richard Todd Miller, Susanne L. Kumpf
  • Heating element of a printhead having resistive layer over conductive layer
    Publication number: 20020158945
    Abstract: 10006488 A heating element of a printhead has a conductive layer deposited over a substrate, and a resistive layer deposited over and in electrical contact with the conductive layer.
    Type: Application
    Filed: April 30, 2001
    Publication date: October 31, 2002
    Inventors: Richard Todd Miller, Susanne L. Kumpf
  • Fluid-jet printhead and method of fabricating a fluid-jet printhead
    Patent number: 6457815
    Abstract: A fluid-jet printhead has a substrate on which at least one layer defining a fluid chamber for ejecting fluid is applied. The printhead includes an elevation layer disposed on the substrate and aligned with the fluid chamber. The printhead also includes a resistive layer disposed between the elevation layer and the substrate wherein the resistive layer has a smooth planer surface interfacing with the resistive layer.
    Type: Grant
    Filed: January 29, 2001
    Date of Patent: October 1, 2002
    Assignee: Hewlett-Packard Company
    Inventors: Richard Todd Miller, Susanne L. Kumpf
  • Fluid-jet printhead and method of fabricating a fluid-jet printhead
    Publication number: 20020101484
    Abstract: A fluid-jet printhead has a substrate on which at least one layer defining a fluid chamber for ejecting fluid is applied. The printhead includes an elevation layer disposed on the substrate and aligned with the fluid chamber. The printhead also includes a resistive layer disposed between the elevation layer and the substrate wherein the resistive layer has a smooth planer surface interfacing with the resistive layer.
    Type: Application
    Filed: January 29, 2001
    Publication date: August 1, 2002
    Inventors: Richard Todd Miller, Susanne L. Kumpf