Patents by Inventor Susumu Iwama

Susumu Iwama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230266511
    Abstract: A diffused light control sheet includes: a louver layer on which light-transmitting zones and light-shielding zones are arranged alternately; a transparent protective layer disposed on a first face of the louver layer; and a light-diffusing layer disposed on a second face of the louver layer, in which the light-diffusing layer has a haze of 93% or more as measured in accordance with JIS K 7136 (2000).
    Type: Application
    Filed: August 31, 2021
    Publication date: August 24, 2023
    Inventors: Susumu IWAMA, Naoya TAKIZAWA
  • Publication number: 20190049776
    Abstract: A light transmission direction control sheet includes a louver layer having a light transmission band and a light-shielding band alternately and repeatedly disposed, a first transparent resin layer disposed on a first surface of the louver layer, and a second transparent resin layer disposed on a second surface of the louver layer. Each of the difference between the refractive index of the light transmission band and the refractive index of the first transparent resin layer, and the difference between the refractive index of the light transmission band and the refractive index of the second transparent resin layer, is less than 0.1.
    Type: Application
    Filed: August 8, 2017
    Publication date: February 14, 2019
    Inventor: Susumu Iwama
  • Patent number: 5859127
    Abstract: Disclosed is a novel thermosetting resin composition suitable for the preparation of an integrally molded two-parts composite body consisting of a first part of a cured silicone rubber and a second part of a cured thermosetting resin without intervention of an adhesive layer at the interface. The thermosetting resin composition comprises:(a) 100 parts by weight of an unsaturated polyester resin;(b) from 20 to 50 parts by weight of an ethylenically unsaturated polymerizable compound such as diallyl phthalate;(c) from 5 to 30 parts by weight of an epoxy resin;(d) from 2 to 20 parts by weight of a melamine resin;(e) from 0.1 to 2 parts by weight of a radical-reactive curing agent which is an organic peroxide; and(f) from 0.1 to 2 parts by weight of an acidic catalyst such as aromatic sulfonic acid derivatives.
    Type: Grant
    Filed: October 6, 1997
    Date of Patent: January 12, 1999
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Sadao Nakano, Susumu Iwama, Mikio Kiyosawa
  • Patent number: 5705275
    Abstract: Disclosed is a novel thermosetting resin composition suitable for the preparation of an integrally molded two-parts composite body consisting of a first part of a cured silicone rubber and a second part of a cured thermosetting resin without intervention of an adhesive layer at the interface. The thermosetting resin composition comprises:(a) 100 parts by weight of an unsaturated polyester resin;(b) from 20 to 50 parts by weight of an ethylenically unsaturated polymerizable compound such as diallyl phthalate;(c) from 5 to 30 parts by weight of an epoxy resin;(d) from 2 to 20 parts by weight of a melamine resin;(e) from 0.1 to 2 parts by weight of a radical-reactive curing agent which is an organic peroxide; and(f) from 0.1 to 2 parts by weight of an acidic catalyst such as aromatic sulfonic acid derivatives.
    Type: Grant
    Filed: November 29, 1996
    Date of Patent: January 6, 1998
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Sadao Nakano, Susumu Iwama, Mikio Kiyosawa