Abstract: In order to allow for aligning a relative position between a transferred object and a stamper with high accuracy without providing an alignment pattern in the transferred object, there are provided: a pattern transfer method, including: when adjusting the relative position between the stamper and the transferred object, a step of detecting at least two or more edge positions of the transferred object and calculating an arbitrary point from the detected edge positions; a step of detecting a position of the stamper from an edge of the stamper or an alignment mark formed in the stamper; and a step of adjusting the relative position between the transferred object and the stamper from the arbitrary point and the position of the stamper; and an imprint device using the same.

Abstract: Provided is a method for producing a microfine structure comprising the steps of: forming a resin film by applying a liquid polymerizable resin composition containing a high molecular weight component, a low molecular weight component and a reactive dilution component to an adhesion promoting layer formed on a substrate; imprinting a mold with an extremely fine convex concave pattern onto the resin film; and transferring the convex concave pattern to the resin film. Herein, components of the adhesion promoting layer, the high molecular weight component, the low molecular weight component and the reactive dilution component respectively have cross-linking reactive functional groups which react with each other.

Abstract: In a mold in which a pattern is formed of a fine concavo-convex shape, two or more of alignment marks for determining a relative positional relation between a substrate and a mold are formed concentrically. Moreover, a damaged mark is identified from the positional information and shape of the respective marks, and an alignment between the mold and the substrate to which a resin film is applied is carried out excluding the damaged mark.

Abstract: In order to allow for aligning a relative position between a transferred object and a stamper with high accuracy without providing an alignment pattern in the transferred object, there are provided: a pattern transfer method, including: when adjusting the relative position between the stamper and the transferred object, a step of detecting at least two or more edge positions of the transferred object and calculating an arbitrary point from the detected edge positions; a step of detecting a position of the stamper from an edge of the stamper or an alignment mark formed in the stamper; and a step of adjusting the relative position between the transferred object and the stamper from the arbitrary point and the position of the stamper; and an imprint device using the same.

Abstract: There is provided an imprint device for transferring a fine pattern to a material to form a patterned material. The device comprises a stamper having the fine pattern thereon, and a pressure distribution mechanism. The stamper is pressed against the material, and the pressure distribution mechanism provides a nonuniform pressure distribution in a patterned region of the patterned material, while the stamper is in contact with the material. There are provided an imprint device and a microstructure transfer method, by which it is possible to sufficiently spread a resin or other material for forming a pattern layer between a stamper and a patterned material with a lower pressure so as not to damage the stamper or the patterned material, and to form a pattern formation layer having the uniform thickness on the patterned material.

Abstract: In order to allow for aligning a relative position between a transferred object and a stamper with high accuracy without providing an alignment pattern in the transferred object, there are provided: a pattern transfer method, including: when adjusting the relative position between the stamper and the transferred object, a step of detecting at least two or more edge positions of the transferred object and calculating an arbitrary point from the detected edge positions; a step of detecting a position of the stamper from an edge of the stamper or an alignment mark formed in the stamper; and a step of adjusting the relative position between the transferred object and the stamper from the arbitrary point and the position of the stamper; and an imprint device using the same.

Abstract: There is provided an imprint device for transferring a fine pattern to a material to form a patterned material. The device comprises a stamper having the fine pattern thereon, and a pressure distribution mechanism. The stamper is pressed against the material, and the pressure distribution mechanism provides a nonuniform pressure distribution in a patterned region of the patterned material, while the stamper is in contact with the material. There are provided an imprint device and a microstructure transfer method, by which it is possible to sufficiently spread a resin or other material for forming a pattern layer between a stamper and a patterned material with a lower pressure so as not to damage the stamper or the patterned material, and to form a pattern formation layer having the uniform thickness on the patterned material.

Abstract: A nanoimprint stamper can simultaneously conform to two types of anomaly in the shape of a transfer substrate, for example warpage and surface protrusions (including foreign objects) that differ greatly in the wavelength of variation. The nanoimprint stamper is capable of performing transfer with a smaller number of defects and in a uniform way. The nanoimprint stamper includes a light-transmitting rigid substrate, a light-transmitting resilient plate, a light-trarsmitting and flexible rigid stamper base, a light-transmitting stamper buffer layer, and a light-transmitting patterned stamp layer. The stamper buffer layer has a lower Young's modulus than the patterned stamp layer.

Abstract: An optical imprinting device capable of simultaneously imprinting fine patterns to both surfaces of an opaque substrate is provided. The imprinting device includes a stamper having a fine pattern on its surface to imprint the fine pattern onto a surface of an object to be imprinted by pressing the stamper against the object composed of a substrate and a photo-curing resin layer formed on the substrate. The imprinting device further includes a light source for applying light to the photo-curing resin layer of the object when imprinting the fine pattern of the stamper onto the photo-curing resin layer of the object. The light source applies light to the stamper at a predetermined incident angle to the surface of the stamper.

Abstract: A resin stamper is provided that is intended for use in an optical transfer-based nanostructure transfer apparatus and which is capable of automatic transport and alignment. The resin stamper includes a support member made of a light transmitting material and having mechanical strength, an intermediate layer also made of a light transmitting material, and a patterned resin layer which is also made of a light transmitting material. The support member is larger in size than the intermediate layer and the patterned resin layer. The intermediate layer is more flexible than the patterned resin layer. Also, the patterned resin layer has a pattern of high and low areas formed in a surface thereof that is the obverse of the pattern of high and low areas in a mold.

Abstract: An optical imprinting device capable of simultaneously imprinting fine patterns to both surfaces of an opaque substrate is provided. The imprinting device includes a stamper having a fine pattern on its surface to imprint the fine pattern onto a surface of an object to be imprinted by pressing the stamper against the object composed of a substrate and a photo-curing resin layer formed on the substrate. The imprinting device further includes a light source for applying light to the photo-curing resin layer of the object when imprinting the fine pattern of the stamper onto the photo-curing resin layer of the object. The light source applies light to the stamper at a predetermined incident angle to the surface of the stamper.

Abstract: A nanoimprint stamper with a novel structure is provided that can simultaneously conform to two types of anomaly in the shape of a transfer substrate, i.e., a warpage and surface protrusions (including foreign objects) that differ greatly in the wavelength of variation, and which is capable of performing transfer with a smaller number of defects and in a uniform way. The nanoimprint stamper comprises a light-transmitting rigid substrate, a light-transmitting resilient plate, a light-transmitting and flexible rigid stamper base, a light-transmitting stamper buffer layer, and a light-transmitting patterned stamp layer, the stamper buffer layer having a lower Young's modulus than the patterned stamp layer.

Abstract: A resin stamper is provided that is intended for use in an optical transfer-based nanostructure transfer apparatus and which is capable of automatic transport and alignment. The resin stamper comprises a support member made of a light transmitting material and having mechanical strength, an intermediate layer also made of a light transmitting material, and a patterned resin layer which is also made of a light transmitting material, the support member being larger in size than the intermediate layer and the patterned resin layer, the intermediate layer being more flexible than the patterned resin layer, and the patterned resin layer having a pattern of high and low areas formed in a surface thereof that is the obverse of the pattern of high and low areas in a mold.

Abstract: There is provided an imprint device for transferring a fine pattern to a material to form a patterned material. The device comprises a stamper having the fine pattern thereon, and a pressure distribution mechanism. The stamper is pressed against the material, and the pressure distribution mechanism provides a nonuniform pressure distribution in a patterned region of the patterned material, while the stamper is in contact with the material. There are provided an imprint device and a microstructure transfer method, by which it is possible to sufficiently spread a resin or other material for forming a pattern layer between a stamper and a patterned material with a lower pressure so as not to damage the stamper or the patterned material, and to form a pattern formation layer having the uniform thickness on the patterned material.

Abstract: In order to allow for aligning a relative position between a transferred object and a stamper with high accuracy without providing an alignment pattern in the transferred object, there are provided: a pattern transfer method, including: when adjusting the relative position between the stamper and the transferred object, a step of detecting at least two or more edge positions of the transferred object and calculating an arbitrary point from the detected edge positions; a step of detecting a position of the stamper from an edge of the stamper or an alignment mark formed in the stamper; and a step of adjusting the relative position between the transferred object and the stamper from the arbitrary point and the position of the stamper; and an imprint device using the same.

Abstract: In a mold in which a pattern is formed of a fine concavo-convex shape, two or more of alignment marks for determining a relative positional relation between a substrate and a mold are formed concentrically. Moreover, a damaged mark is identified from the positional information and shape of the respective marks, and an alignment between the mold and the substrate to which a resin film is applied is carried out excluding the damaged mark.

Abstract: In an imprint device and a microstructure transfer method, a fluid is ejected at the back of at least either a stamper or a transfer target body during pressurization of the stamper and the transfer target body. The fluid is ejected through plural holes formed in a stage disposed at the back of at least either the stamper or the transfer target body. The plural holes are connected to independent pressure regulating mechanisms, which can individually control the amount of fluid ejection, the timing of start of ejection, and so on. When the stamper is peeled from the transfer target body, the plural holes are evacuated to fix the stamper or the transfer target body to the stage by suction so as to peel the stamper.

Abstract: A method for irradiating a substrate such as a semiconductor substrate, coated with a photoresist, with light to measure variations in optical properties such as reflectivity, refractive index, transmittance, polarization, spectral transmittance, for determining an optimum photoresist coating condition, an optimum photoresist baking condition, an optimum developing condition or an optimum exposure energy quantity, and forming a photoresist pattern according to the optimum condition. A system for the exposure method, a controlling method of forming a photoresist film by use of the exposure method, and a system for the controlling method, are useful for stabilization of the formation or treatment of the photoresist film, and ensure less variations in the pattern size.

Abstract: According to the present invention, in making alignment between a semiconductor integrated circuit wafer and a mask or a reticle in light exposure of the wafer with a monochromatic light such as g-, i- or h-line of a mercury lamp, using a reduced stepping exposure system, light from a predetermined pattern on the wafer is taken out to an off-axis position and observed according to Through-the-Lens method; in this case as a characteristic feature of the invention, the observation light taken out from below the reticle is passed through chromatic aberration correcting lenses, thereby permitting the use of a polychromatic or continuous spectrum light.

Abstract: A wafer having chamfered bent portions in the joint regions between the contour of the wafer and the cut-away portion of the wafer such as an orientation flatness. The chipping of the wafer can be prevented, and in coating the wafer with a photoresist, forming an epiaxially grown layer on the wafer, etc., films having desired characteristics can be provided on the surface of the wafer.