Abstract: A fiber-containing resin substrate for collectively sealing a semiconductor devices mounting surface of a substrate having the semiconductor devices mounted thereon or a semiconductor devices forming surface of a wafer having semiconductor devices formed thereon, includes: a resin-impregnated fiber base material obtained by impregnating a fiber base material with a thermosetting resin and semi-curing or curing the thermosetting resin; and an uncured resin layer containing an uncured thermosetting resin and formed on one side of the resin-impregnated fiber base material.

Abstract: In an antenna and a semiconductor device including the antenna, an object is to reduce the distance between electrodes of a capacitor as much as possible, reduce the area of the electrode of the capacitor as much as possible, and prevent the suppression of response sensitivity and a response range of the semiconductor device. The present invention relates to an antenna including an antenna coil provided over a first region of a base and a capacitor which uses a second region of the base as a dielectric body and which has electrodes provided for opposite planes of the second region of the base, wherein the second region of the base is thinner than the first region of the base, and also relates to a semiconductor device including the antenna.

Abstract: A cement mold-making silicone rubber composition is provided comprising (A) 100 parts by weight of a polyorganosiloxane having at least two silicon-bonded monovalent aliphatic unsaturated hydrocarbon groups in a molecule, (B) a polyorganohydrogensiloxane having at least three silicon-bonded hydrogen atoms in a molecule, in such an amount as to provide 0.1-5 silicon-bonded hydrogen atoms per monovalent aliphatic unsaturated hydrocarbon group in component (A), (C) a platinum base compound in such an amount as to provide 1-100 ppm of platinum atoms based on the weight of component (A), (D) 5-60 parts by weight of finely divided silica having a specific surface area of at least 50 m2/g, and (E) 0.1-100 parts by weight of coal ash and/or pozzolan powder.

Abstract: A cement mold-making silicone rubber composition is provided comprising (A) 100 parts by weight of a polyorganosiloxane having at least two silicon-bonded monovalent aliphatic unsaturated hydrocarbon groups in a molecule, (B) a polyorganohydrogensiloxane having at least three silicon-bonded hydrogen atoms in a molecule, in such an amount as to provide 0.1-5 silicon-bonded hydrogen atoms per monovalent aliphatic unsaturated hydrocarbon group in component (A), (C) a platinum base compound in such an amount as to provide 1-100 ppm of platinum atoms based on the weight of component (A), (D) 5-60 parts by weight of finely divided silica having a specific surface area of at least 50 m2/g, and (E) 0.1-100 parts by weight of coal ash and/or pozzolan powder.

Abstract: A fluorosilicone rubber composition is provided comprising (A) a first organopolysiloxane having the formula: R1aR2bR3cSiO(4-a-b-c)/2 wherein R1 is trifluoropropyl, R2 is an aliphatic unsaturated hydrocarbon group, R3 is an aliphatic saturated hydrocarbon or aromatic hydrocarbon group, (B) a silica filler, (C) a second organopolysiloxane having formula (2) wherein R4 is an aliphatic unsaturated hydrocarbon group or the like, and (D) a cure catalyst. The fluorosilicone rubber composition affords satisfactory adhesion at the interface with dimethylsilicone rubber even when the molding pressure is low.

Abstract: A fluorosilicone rubber composition is provided comprising (A) a first organopolysiloxane having the formula: R1aR2bR3cSiO(4-a-b-c)/2 wherein R1 is trifluoropropyl, R2 is an aliphatic unsaturated hydrocarbon group, R3 is an aliphatic saturated hydrocarbon or aromatic hydrocarbon group, (B) a silica filler, (C) a second organopolysiloxane having formula (2) wherein R4 is an aliphatic unsaturated hydrocarbon group or the like, and (D) a cure catalyst. The fluorosilicone rubber composition affords satisfactory adhesion at the interface with dimethylsilicone rubber even when the molding pressure is low.

Abstract: A thixotropic silicone rubber composition comprising (A) an organopolysiloxane having on the average at least two alkenyl groups in a molecule and a degree of polymerization of up to 1,200, (B) a liquid organohydrogenpolysiloxane having at least two hydrogen atoms each attached to a silicon atom, (C) aluminum hydroxide, (D) an addition reaction catalyst, (E) a thixotropic agent, and optionally (F) a tackifier cures at room temperature or elevated temperature into a silicone rubber having high strength and electrical insulating properties sufficient to serve as a high-voltage electrical insulator. The composition is so thixotropic that it may be used in repairing chipped portions of insulators.

Abstract: A mixture of a first aluminum hydroxide surface treated with a silicon-containing compound and having a mean particle size of 5-20 &mgr;m and a second aluminum hydroxide surface treated with a silicon-containing compound and having a mean particle size of 0.1-2.5 &mgr;m is blended in a silicone rubber composition comprising an organopolysiloxane, finely divided silica, and an organic peroxide. The silicone rubber composition cures into silicone rubber having sufficiently improved properties to serve as high-voltage electrical insulators, even when exposed to air polluted conditions or rigorous weather conditions.

Abstract: A silicone rubber composition contains (A) 100 parts by weight of an organopolysiloxane composition of the organic peroxide or addition reaction curing type, (B) 20-400 parts by weight of aluminum hydroxide, and (C) 1-20 parts by weight of an organopolysiloxane of formula (I): R.sup.1.sub.a (OX).sub.b SiO.sub.(4-a-b)/2 wherein R.sup.1 is a monovalent hydrocarbon group, at least 10 mol % of the R.sup.1 groups being phenyl, X is hydrogen or a monovalent hydrocarbon group, a and b are positive numbers satisfying the range: 1.0.ltoreq.a<2.0, 1<a+b.ltoreq.3, and 0.001.ltoreq.b/(a+b).ltoreq.0.8. The composition cures into a silicone rubber having improved high-voltage electrical insulating properties even under humid conditions.

Abstract: A silicone rubber composition is obtained by blending (A) 100 parts by weight of an organopolysiloxane composition of the addition reaction curing type with (B) about 30-400 parts by weight of aluminum hydroxide which has been surface treated with an organosilane or organosilazane substantially free of an aliphatic unsaturated group or a partial hydrolyzate thereof so that the aluminum hydroxide has 0.01-2% by weight of carbon affixed thereto. The composition maintains silicone rubber properties even though it is loaded with large amounts of aluminum hydroxide. It cures into a silicone rubber having improved high-voltage electrical insulating properties and thus suited for use as high-voltage electrical insulators.

Abstract: A silicone rubber composition comprising (A) 100 parts by weight of an organopolysiloxane composition of the organic peroxide or addition curing type, (B) 1-100 parts by weight of finely divided silica, and (C) 30-500 parts by weight of aluminum hydroxide is suitable for use as a high-voltage electrical insulator. The aluminum hydroxide (C) has a water-soluble sodium ion content of up to 0.01% by weight and exhibits pH 6.5-8.0 and an electrical conductivity of up to 50 .mu.s/cm when measured as a 30 wt % water slurry and preferably has been treated to be hydrophobic. The composition cures into a silicone rubber having improved high-voltage electrical insulating properties even under rigorous conditions.

Abstract: A silicone rubber composition is obtained by blending (A) 100 parts by weight of an organopolysiloxane composition of the organic peroxide or addition reaction curing type, with (B) 30-400 parts by weight of aluminum hydroxide which has been surface treated so as to bear 1.0.times.10.sup.-6 to 2.0.times.10.sup.-4 mol/gram of vinyl groups. The composition does not lose rubber strength even though it is loaded with large amounts of aluminum hydroxide. It cures into a silicone rubber having satisfactory physical properties and improved high-voltage electrical insulating properties and thus suited for use as high-voltage electrical insulators.

Abstract: The silicone rubber composition of the present invention comprises (A) an organopolysiloxane obtained by mixing and heating an organopolysiloxane having a silanol group at both ends of the molecular chain and a silane or a siloxane having two hydrolyzable groups in the molecule, (B) a finely divided silica, and (C) a curing agent. The composition, wherein the content of low-molecule siloxanes is remarkably constrained, is quite useful in the application wherein low-molecular siloxanes are obnoxious, for example, in the application of electrical contacts and parts used adjacent thereto, roll materials of copying machines, gaskets for construction, etc.

Abstract: A method of producing a silicone rubber composition, comprising heating a mixture of an organopolysiloxane having a silanol group at both the ends of the molecular chain, a end blocking agent, such as a triorganosilanol, a silane or a siloxane having two dialkylaminosilyl groups in the molecule, and a reinforcing filler thereby carrying out chain lengthening and end blocking of said organopolysiloxane. According to this method, a silicone rubber composition whose low-molecular siloxane content is held down remarkably can be produced without consuming a large amount of energy for the mixing.

Abstract: A siloxane gum is prepared by adding a silane or siloxane having two hydrolyzable groups in a molecule to a silanol-terminated organopolysiloxane in such an amount to give a molar ratio of silanol group/hydrolyzable group of from 0.5 to 3 and effecting condensation polymerization. The resulting organopoly-siloxane has a degree of polymerization of higher than 1,000 and a minimized content of low-molecular weight cyclic siloxanes of less than 5,000 ppm.

Abstract: Organopolysiloxanes having a silanol group at both terminal ends of molecular chain thereof are brought into condensation reaction with each other in the presence of a silane or siloxane having at least two dialkylaminosilyl groups per molecule as a condensation catalyst and a triorganosilanol or other endblocking agent, to lengthen the chain of the organopolysiloxane under reaction, whereby a triorganosilyl-endblocked organopolysiloxane with a high polymerization degree is obtained. The process yields a triorganosilyl-endblocked high-polymerization-degree organopolysiloxane while effectively suppressing or preventing the formation of low-molecular-weight siloxanes.

Abstract: A conductive silicone rubber composition is prepared by mixing an organopolysiloxane having an aminoalkyl radical, an organopolysiloxane having a (meth)acryloxyalkyl or glycidoxyalkyl radical, and conductive carbon black to form silicone rubber composition (A) in which the carbon black is fixed, and then mixing it with a silicone rubber composition (B) comprising a dimethylpolysiloxane. The composition has stable resistivity in the semiconductive region independent of molding conditions.