Patents by Inventor Susumu Shintani

Susumu Shintani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making semiconductor device with flip chip mounting
    Patent number: 6887738
    Abstract: A semiconductor device is arranged such that a semiconductor chip having electrodes is flip chip mounted on printed substrate pads on a printed wiring substrate by a bump formed on each electrode. The semiconductor chip and the printed wiring substrate are fixed with a thermo-setting resin. A penetration hole is formed within an area where the printed substrate pad contacts each gold bump, and the gold bump has a joint section also on a side face of the penetration hole of the printed substrate pad. With this structure, the semiconductor device has a secure electrical connection between the bump and the metal pattern.
    Type: Grant
    Filed: November 14, 2002
    Date of Patent: May 3, 2005
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Susumu Shintani
  • Semiconductor device and manufacturing method thereof
    Publication number: 20030067084
    Abstract: A semiconductor device is arranged such that a semiconductor chip having electrodes is flip chip mounted on printed substrate pads on a printed wiring substrate by a bump formed on each electrode. The semiconductor chip and the printed wiring substrate are fixed with a thermo-setting resin. A penetration hole is formed within an area where the printed substrate pad contacts each gold bump, and the gold bump has a joint section also on a side face of the penetration hole of the printed substrate pad. With this structure, the semiconductor device has a secure electrical connection between the bump and the metal pattern.
    Type: Application
    Filed: November 14, 2002
    Publication date: April 10, 2003
    Applicant: Sharp Kabushiki Kaisha
    Inventor: Susumu Shintani
  • Semiconductor device and manufacturing method thereof
    Publication number: 20020016022
    Abstract: A semiconductor device is arranged such that a semiconductor chip having electrodes is flip chip mounted on printed substrate pads on a printed wiring substrate by a bump formed on each electrode. The semiconductor chip and the printed wiring substrate are fixed with a thermo-setting resin. A penetration hole is formed within an area where the printed substrate pad contacts each gold bump, and the gold bump has a joint section also on a side face of the penetration hole of the printed substrate pad. With this structure, the semiconductor device has a secure electrical connection between the bump and the metal pattern.
    Type: Application
    Filed: June 22, 2001
    Publication date: February 7, 2002
    Inventor: Susumu Shintani