Abstract: A vacuum processing apparatus with excellent processing uniformity and capable of effectively performing routine and non-routine maintenance even when an object to be processed has an increased diameter is provided. In the vacuum processing apparatus having a vacuum transfer chamber, this apparatus comprises a lower vessel having a cylindrical shape, a sample stage unit including a sample stage and a ring-shaped sample stage base having support beams disposed axisymmetric with respect to a central axis of the sample stage, an upper vessel having a cylindrical shape, and a moving mechanism which is fixed to the sample stage base and is capable to move the sample stage unit movable in a vertical direction and in a horizontal direction.

Abstract: A plasma processing apparatus has a vacuum container having a processing chamber in which a wafer is processed by plasma and at least one member constituting the vacuum container movable and detachable in a horizontal direction with respect to a base plate. The plasma processing apparatus includes a lifter arranged at a side of the vacuum container across the vacuum container on the base plate, coupled to an end portion on the opposite side of a vacuum transfer chamber on which the wafer is transferred in a decompressed interior, and having a vertical shaft to move the detachable member vertically. The lifter includes: a coupling portion coupled to the vertical shaft and the detachable member and moved along the vertical shaft; and a turning shaft being a joint portion arranged at the coupling portion and having a vertical rotational shaft, the detachable member being horizontally turned around the turning shaft.

Abstract: A plasma processing apparatus has a vacuum container having a processing chamber in which a wafer is processed by plasma and at least one member constituting the vacuum container movable and detachable in a horizontal direction with respect to a base plate. The plasma processing apparatus includes a lifter arranged at a side of the vacuum container across the vacuum container on the base plate, coupled to an end portion on the opposite side of a vacuum transfer chamber on which the wafer is transferred in a decompressed interior, and having a vertical shaft to move the detachable member vertically. The lifter includes: a coupling portion coupled to the vertical shaft and the detachable member and moved along the vertical shaft; and a turning shaft being a joint portion arranged at the coupling portion and having a vertical rotational shaft, the detachable member being horizontally turned around the turning shaft.

Abstract: A vacuum processing apparatus with excellent processing uniformity and capable of effectively performing routine and non-routine maintenance even when an object to be processed has an increased diameter is provided. In the vacuum processing apparatus having a vacuum transfer chamber, this apparatus comprises a lower vessel having a cylindrical shape, a sample stage unit including a sample stage and a ring-shaped sample stage base having support beams disposed axisymmetric with respect to a central axis of the sample stage, an upper vessel having a cylindrical shape, and a moving mechanism which is fixed to the sample stage base and is capable to move the sample stage unit movable in a vertical direction and in a horizontal direction.

Abstract: A vacuum processing apparatus is disclosed for processing workpieces. The apparatus includes a load lock adapted to store the workpiece inside and to be switched between atmosphere and vacuum. Vacuum transport chambers are connected to the load lock and to the corresponding process chambers in a state where the load lock and each of the process chambers are isolated. The workpiece can be transferred between each of the process chambers and the load lock via the corresponding vacuum transport chamber. The apparatus also includes load lock valves for switching between interrupt and opening between the load lock and the corresponding vacuum transport chambers, and process chamber valves for switching between interrupt and opening between the process chambers and the corresponding vacuum transport chambers. Timing for opening and closing the valves is controlled in synchronization with the transfer of the workpieces.

Abstract: A vacuum processing apparatus includes a row of containers of vacuum transfer chambers connected to each other behind a lock chamber, a wafer being transferred through depressurized inside of the row of the containers of the vacuum transfer containers, an intermediate chamber disposed between the containers of the vacuum transfer chambers, a plurality of processing units including processing containers respectively connected to left or right side walls of the containers of the vacuum transfer chambers and the wafer is processed therein, and a bypass chamber which constitutes a bypass path connecting the processing units, where only either the wafer which is being transferred from the lock chamber toward one of the processing units or the wafer which was processed in one of the processing units and is being transferred toward the lock chamber is transferred through the containers of the vacuum transfer chambers.

Abstract: A vacuum processing system of a semiconductor processing substrate and a vacuum processing method using the same comprises an atmospheric transfer chamber having a plurality of cassette stands for transferring a wafer, a lock chamber for storing the wafer transferred from the atmospheric transfer chamber, a first vacuum transfer chamber to which the wafer from the lock chamber is transferred, a transfer intermediate chamber connected to the first vacuum transfer chamber, a second vacuum transfer chamber connected to the transfer intermediate chamber, at least one vacuum processing chamber connected to the first vacuum transfer chamber, and two or more vacuum processing chambers connected to a rear side of the second vacuum transfer chamber, wherein the number of vacuum processing chambers connected to the first vacuum transfer chamber is smaller than the number of vacuum processing chambers connected to the second vacuum transfer chamber, or the number of use of vacuum processing chambers connected to the fir

Abstract: A vacuum processing apparatus which includes an atmospheric transfer chamber having a plurality of cassette stands for transferring a wafer, a lock chamber for storing the wafer, a first vacuum transfer chamber to which the wafer from the lock chamber is transferred, a transfer intermediate chamber connected to the first vacuum transfer chamber, and a second vacuum transfer chamber connected to the transfer intermediate chamber. At least one vacuum processing chamber is connected to the first vacuum transfer chamber, and two or more vacuum processing chambers are connected to a rear side of the second vacuum transfer chamber. A plurality of gate valves are disposed between the first vacuum transfer chamber and each of the lock chamber, the transfer intermediate chamber, and the vacuum processing chamber coupled to the first vacuum transfer chamber. A control unit is also provided for controlling operation of the gate valves.

Abstract: A vacuum processing apparatus including an atmospheric transfer chamber including on a front side a plurality of cassette stages on which cassettes having stored samples as processing objects are to be mounted, a first transfer chamber which is disposed via a lock chamber on a back side of the atmospheric transfer chamber and to which a sample decompressed to first pressure is transferred, a second transfer chamber which is disposed on a back side of the first transfer chamber and to which the sample is transferred via a relay chamber from the first transfer chamber, a first processing vessel which is coupled to the first transfer chamber and in which the sample is transferred under the first pressure, and a second processing vessel which is coupled to the second transfer chamber and in which the sample is transferred under the second pressure.

Abstract: The present invention provides an efficient transferring control method in a vacuum processing apparatus of a linear tool in which plural vacuum robots are arranged in transferring mechanical units to which process chambers are connected and processing-target members are passed and received among the plural vacuum robots. In addition, the present invention provides a vacuum processing apparatus in which there are provided plural controlling methods, and a unit which determines whether rates of the transferring robots are to be controlled or rates of the process chambers are to be controlled on the basis of processing time of each processing-target member and switches the controlling method in accordance with a site whose rate is controlled.

Abstract: The vacuum processing apparatus is comprised of two vacuum transfer vessels in which a wafer is transferred through; two vacuum process vessels connected to these vacuum transfer vessels respectively; an intermediate chamber vessel capable of storing thereinto the wafer connected between the vacuum transfer vessels; a lock chamber connected to one of the vacuum transfer vessels; and a plurality of valves disposed among the vacuum transfer vessels, the vacuum process vessels, the intermediate chamber vessel, and the lock chamber respectively, for airtightly opening/closing communications among these vessels and the chamber; in which any one of the valves disposed on both sides of the intermediate chamber vessel is closed before the valves disposed between processing chambers of the vacuum process vessels and vacuum transfer chambers of the vacuum transfer vessels is opened.

Abstract: A vacuum processing apparatus that includes a vacuum vessel; an opening disposed in a wall of the vacuum vessel, through which a sample to be processed is taken in and out; a valve body disposed outside the wall for airtightly sealing the opening; and a drive unit driving the valve body to carry out a sealing or opening operation. The drive unit includes a first member coupled to an actuator that moves along a substantially linear first direction as a result of operation of the actuator, and a second member coupled to the first member that moves along a substantially linear second direction that intersects with the first direction. The valve body, coupled to the second member, seals the opening as a result of movement of the second member.

Abstract: Provided is a method for controlling efficient transferring operations in a vacuum processing apparatus with a linear tool. In the apparatus, plural transferring robots are arranged in transferring mechanism units in which plural process chambers are connected with each other, and to-be-processed wafers are received and passed between plural transferring robots. As the transferring robots is far from the load lock, the number of transferring operations to the process chambers is set larger, the number of times of continuous transferring operations to the process chambers is set as small as possible, and an odd number of times of continuous transferring operations to buffer rooms is set, by a destination determination unit and operation control rules. Further, transferring operations are performed based on the destination determination unit and the operation control rules.

Abstract: In a vacuum processing apparatus having a plurality of vacuum processing chambers at least one of which are coupled to each of a plurality of vacuum transfer chambers which are behind an atmospheric transfer chamber and have vacuum transfer robots in their interior to transfer a wafer, taking out a plurality of wafers in a cassette and transferring successively to the plurality of the vacuum processing chambers, and thereafter returning to the cassette, the wafers are controlled to be transferred to all of the vacuum processing chambers coupled to the backmost vacuum transfer chamber and thereafter a next wafer is transferred to a vacuum processing chamber which becomes possible for the next wafer to be transferred in before they are possible to be transferred out from the vacuum processing chambers coupled to the backmost vacuum transfer chamber and arranged backmost.

Abstract: A vacuum processing apparatus includes a transfer unit disposed at a center thereof, plural processing chambers, each processing chamber having a processing table for supporting an object to be processed and carrying out processing using a gas, and a mass flow controller unit interposed between two of the processing chambers for supplying gas to the chambers.