Patents by Inventor Sut-I Lo

Sut-I Lo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package structures including a capacitor and methods of forming the same
    Patent number: 9576821
    Abstract: A package includes a die, an encapsulant, and a capacitor. The package has a package first side and a package second side. The die has a die first side corresponding to the package first side, and has a die second side corresponding to the package second side. The die first side is opposite the die second side. The encapsulant surrounds the die. The capacitor includes a first plate and a second plate in the encapsulant, and opposing surfaces of the first plate and the second plate extend in a direction from the package first side to the package second side. The external conductive connectors are attached to at least one of the package first side and the package second side.
    Type: Grant
    Filed: January 13, 2014
    Date of Patent: February 21, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sut-I Lo, Ching-Wen Hsiao, Hsu-Hsien Chen, Chen-Shien Chen
  • Package Structures Including a Capacitor and Methods of Forming the Same
    Publication number: 20140127866
    Abstract: A package includes a die, an encapsulant, and a capacitor. The package has a package first side and a package second side. The die has a die first side corresponding to the package first side, and has a die second side corresponding to the package second side. The die first side is opposite the die second side. The encapsulant surrounds the die. The capacitor includes a first plate and a second plate in the encapsulant, and opposing surfaces of the first plate and the second plate extend in a direction from the package first side to the package second side. The external conductive connectors are attached to at least one of the package first side and the package second side.
    Type: Application
    Filed: January 13, 2014
    Publication date: May 8, 2014
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sut-I Lo, Ching-Wen Hsiao, Hsu-Hsien Chen, Chen-Shien Chen
  • Package structures including a capacitor and methods of forming the same
    Patent number: 8653626
    Abstract: A package includes a die, an encapsulant, and a capacitor. The package has a package first side and a package second side. The die has a die first side corresponding to the package first side, and has a die second side corresponding to the package second side. The die first side is opposite the die second side. The encapsulant surrounds the die. The capacitor includes a first plate and a second plate in the encapsulant, and opposing surfaces of the first plate and the second plate extend in a direction from the package first side to the package second side. The external conductive connectors are attached to at least one of the package first side and the package second side.
    Type: Grant
    Filed: July 18, 2012
    Date of Patent: February 18, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sut-I Lo, Ching-Wen Hsiao, Hsu-Hsien Chen, Chen-Shien Chen
  • PACKAGE STRUCTURES INCLUDING A CAPACITOR AND METHODS OF FORMING THE SAME
    Publication number: 20140021583
    Abstract: A package includes a die, an encapsulant, and a capacitor. The package has a package first side and a package second side. The die has a die first side corresponding to the package first side, and has a die second side corresponding to the package second side. The die first side is opposite the die second side. The encapsulant surrounds the die. The capacitor includes a first plate and a second plate in the encapsulant, and opposing surfaces of the first plate and the second plate extend in a direction from the package first side to the package second side. The external conductive connectors are attached to at least one of the package first side and the package second side.
    Type: Application
    Filed: July 18, 2012
    Publication date: January 23, 2014
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Sut-I Lo, Ching-Wen Hsiao, Hsu-Hsien Chen, Chen-Shien Chen