Patents by Inventor Sutapa Mukherjee
Sutapa Mukherjee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230330788Abstract: A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises from 3.5 to 4.5 wt.% of silver, 2.5 to 4 wt.% of bismuth, 0.3 to 0.8 wt.% of copper, 0.03 to 1 wt.% nickel, 0.005 to 1 wt.% germanium, and a balance of tin, together with any unavoidable impurities.Type: ApplicationFiled: June 5, 2023Publication date: October 19, 2023Inventors: Pritha Choudhury, Morgana De Avila Ribas, Sutapa Mukherjee, Anil Kumar, Siuli Sarkar, Ranjit Pandher, Ravi Bhatkal, Bawa Singh
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Patent number: 11389865Abstract: Methods for die attachment of multichip and single components including flip chips may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.Type: GrantFiled: June 12, 2015Date of Patent: July 19, 2022Assignee: Alpha Assembly Solutions Inc.Inventors: Shamik Ghoshal, V. Sathish Kumar, Pavan Vishwanath, Ranjit S. Pandher, Remya Chandran, Sutapa Mukherjee, Siuli Sarkar, Bawa Singh, Ravindra Mohan Bhatkal
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Publication number: 20220169905Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.Type: ApplicationFiled: October 4, 2021Publication date: June 2, 2022Applicant: Alpha Assembly Solutions Inc.Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana de Avila Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
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Patent number: 11162007Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.Type: GrantFiled: March 1, 2019Date of Patent: November 2, 2021Assignee: Alpha Assembly Solutions Inc.Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana de Avila Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
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Patent number: 11090768Abstract: A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises up to 10 wt % Ag, up to 10 wt % Bi, up to 3 wt % Cu, other optional additives, balance tin, and unavoidable impurities.Type: GrantFiled: April 28, 2015Date of Patent: August 17, 2021Assignee: ALPHA ASSEMBLY SOLUTIONS INC.Inventors: Pritha Choudhury, Morgana De Avila Ribas, Sutapa Mukherjee, Anil Kumar, Siuli Sarkar, Ranjit Pandher, Ravi Bhatkal, Bawa Singh
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Publication number: 20210205935Abstract: A sintering powder, wherein a least a portion of the particles making up the sintering powder comprise: a core comprising a first material; and a shell at least partially coating the core, the shell comprising a second material having a lower oxidation potential than the first material.Type: ApplicationFiled: January 14, 2021Publication date: July 8, 2021Applicant: ALPHA ASSEMBLY SOLUTIONS INC.Inventors: Shamik Ghoshal, Remya Chandran, Sutapa Mukherjee, Siuli Sarkar, Ranjit Pandher, Bawa Singh
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Patent number: 10894302Abstract: A sintering powder, wherein a least a portion of the particles making up the sintering powder comprise: a core comprising a first material; and a shell at least partially coating the core, the shell comprising a second material having a lower oxidation potential than the first material.Type: GrantFiled: June 22, 2015Date of Patent: January 19, 2021Assignee: Alpha Assembly Solutions Inc.Inventors: Shamik Ghoshal, Remya Chandran, Sutapa Mukherjee, Siuli Sarkar, Ranjit Pandher, Bawa Singh
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Patent number: 10682732Abstract: A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalized graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminum oxide, zinc oxide, aluminum nitride, boron nitride, silver, nano fibers, carbon fibers, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt. % of the filler based on the total weight of the composition.Type: GrantFiled: March 31, 2016Date of Patent: June 16, 2020Assignee: ALPHA ASSEMBLY SOLUTIONS INC.Inventors: Ramakrishna Hosur Venkatagiriyappa, Morgana De Avila Ribas, Barun Das, Harish Hanchina Siddappa, Sutapa Mukherjee, Siuli Sarkar, Bawa Singh, Rahul Raut, Ranjit Pandher
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Publication number: 20190194517Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.Type: ApplicationFiled: March 1, 2019Publication date: June 27, 2019Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana de Avila Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
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Patent number: 10322471Abstract: A lead-free, antimony-free solder alloy_suitable for use in electronic soldering applications. The solder alloy comprises (a) from 1 to 4 wt. % silver; (b) from 0.5 to 6 wt. % bismuth; (c) from 3.55 to 15 wt. % indium, (d) 3 wt. % or less of copper; (e) one or more optional elements and the balance tin, together with any unavoidable impurities.Type: GrantFiled: July 15, 2015Date of Patent: June 18, 2019Assignee: Alpha Assembly Solutions Inc.Inventors: Pritha Choudhury, Morgana De Avila Ribas, Sutapa Mukherjee, Siuli Sarkar, Ranjit Pandher, Ravindra Bhatkal, Bawa Singh
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Publication number: 20190143461Abstract: A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalized graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminum oxide, zinc oxide, aluminum nitride, boron nitride, silver, nano fibers, carbon fibers, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt. % of the filler based on the total weight of the composition.Type: ApplicationFiled: March 31, 2016Publication date: May 16, 2019Inventors: Ramakrishna Hosur Venkatagiriyappa, Morgana De Avila Ribas, Barun Das, Harish Hanchina Siddappa, Sutapa Mukherjee, Siuli Sarkar, Bawa Singh, Rahul Raut, Ranjit Pandher
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Patent number: 10259980Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.Type: GrantFiled: October 29, 2013Date of Patent: April 16, 2019Assignee: Alpha Assembly Solutions Inc.Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
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Patent number: 10130995Abstract: A method for manufacturing metal powder comprising: providing a basic metal salt solution; contacting the basic metal salt solution with a reducing agent to precipitate metal powder therefrom; and recovering precipitated metal powder from the solvent.Type: GrantFiled: April 10, 2015Date of Patent: November 20, 2018Assignee: Alpha Assembly Solutions Inc.Inventors: Nirmalya Kumar Chaki, Poulami Sengupta Roy, Siuli Sarkar, Sutapa Mukherjee
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Publication number: 20180056455Abstract: A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalized graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminum oxide, zinc oxide, aluminum nitride, boron nitride, silver, nano fibers, carbon fibers, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt. % of the filler based on the total weight of the composition.Type: ApplicationFiled: March 31, 2016Publication date: March 1, 2018Inventors: Ramakrishna Hosur Venkatagiriyappa, Morgana De Avila Ribas, Barun Das, Harish Hanchina Siddappa, Sutapa Mukherjee, Siuli Sarkar, Bawa Singh, Rahul Raut, Ranjit Pandher
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Patent number: 9786629Abstract: Dual-side reinforcement (DSR) materials and methods for semiconductor fabrication. The DSR materials exhibit the properties of conventional underfill materials with enhanced stability at room temperature.Type: GrantFiled: July 31, 2014Date of Patent: October 10, 2017Inventors: Ramakrishna Hosur Venkatagiriyappa, Sutapa Mukherjee, Harish Hanchina Siddappa, Morgana De Avila Ribas, Siuli Sarkar, Bawa Singh, Rahul Raut
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Publication number: 20170197281Abstract: A lead-free, antimony-free solder alloy_suitable for use in electronic soldering applications. The solder alloy comprises (a) from 1 to 4 wt. % silver; (b) from 0.5 to 6 wt. % bismuth; (c) from 3.55 to 15 wt. % indium, (d) 3 wt. % or less of copper; (e) one or more optional elements and the balance tin, together with any unavoidable impurities.Type: ApplicationFiled: July 15, 2015Publication date: July 13, 2017Inventors: Pritha Choudhury, Morgana De Avila Ribas, Sutapa Mukherjee, Siuli Sarkar, Ranjit Pandher, Ravindra Bhatkal, Bawa Singh
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Publication number: 20170144221Abstract: Methods for die attachment of multichip and single components including flip chips may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.Type: ApplicationFiled: June 12, 2015Publication date: May 25, 2017Inventors: Shamik GHOSHAL, V. Sathish KUMAR, Pavan VISHWANATH, Ranjit S. PANDHER, Remya CHANDRAN, Sutapa MUKHERJEE, Siuli SARKAR, Bawa SINGH, Ravindra Mohan BHATKAL
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Publication number: 20170135227Abstract: A method of forming a solder joint, the method comprising: (i) providing a solder flux; (ii) providing solder particles; (iii) providing two or more work pieces to be joined; and (iv) heating the solder flux and the solder particles in the vicinity of the two or more work pieces to be joined to form: (i) a solder joint between the two or more work pieces to be joined, and (ii) a solder flux residue. The solder flux residue substantially covers the exposed surfaces of the solder joint.Type: ApplicationFiled: June 19, 2015Publication date: May 11, 2017Inventors: Hosur Venkatagiriyappa Ramakrishna, Morgana De Avila Ribas, Ranjit Pandher, Siuli Sarkar, Sutapa Mukherjee, Bawa Singh
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Publication number: 20170113306Abstract: A sintering powder, wherein a least a portion of the particles making up the sintering powder comprise: a core comprising a first material; and a shell at least partially coating the core, the shell comprising a second material having a lower oxidation potential than the first material.Type: ApplicationFiled: June 22, 2015Publication date: April 27, 2017Inventors: Shamik Ghoshal, Remya Chandran, Sutapa Mukherjee, Siuli Sarkar, Ranjit Pandher, Bawa Singh
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Publication number: 20170028477Abstract: A method for manufacturing metal powder comprising: providing a basic metal salt solution; contacting the basic metal salt solution with a reducing agent to precipitate metal powder therefrom; and recovering precipitated metal powder from the solvent.Type: ApplicationFiled: April 10, 2015Publication date: February 2, 2017Inventors: Rohan P. Setna, Nirmalya Kumar Chaki, Poulami Sengupta Roy, Siuli Sarkar, Sutapa Mukherjee