Patents by Inventor Suthakavatin Aungkul

Suthakavatin Aungkul has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of chip positioning for multi-chip packaging
    Patent number: 9196608
    Abstract: Embodiments of the present invention include a method for multi-chip packaging. For example, the method includes positioning a first integrated circuit (IC) on a substrate package based on a first set of reference markers in physical contact with the substrate package and confirming an alignment of the first IC based on a second set of reference markers in physical contact with the substrate package. A second IC is stacked onto first IC based on the first set of reference markers. An alignment of the second IC is confirmed based on the second set of reference markers, where the second set of reference markers is disposed at a different location on the substrate package than the first set of reference markers.
    Type: Grant
    Filed: November 4, 2014
    Date of Patent: November 24, 2015
    Assignee: Cypress Semiconductor Corporation
    Inventors: Sally Foong, Seshasayee Gaddamraja, Teoh Lai Beng, Lai Nguk Chin, Suthakavatin Aungkul
  • CHIP POSITIONING IN MULTI-CHIP PACKAGE
    Publication number: 20150056726
    Abstract: Embodiments of the present invention include a method for multi-chip packaging. For example, the method includes positioning a first integrated circuit (IC) on a substrate package based on a first set of reference markers in physical contact with the substrate package and confirming an alignment of the first IC based on a second set of reference markers in physical contact with the substrate package. A second IC is stacked onto first IC based on the first set of reference markers. An alignment of the second IC is confirmed based on the second set of reference markers, where the second set of reference markers is disposed at a different location on the substrate package than the first set of reference markers.
    Type: Application
    Filed: November 4, 2014
    Publication date: February 26, 2015
    Applicant: Spansion LLC
    Inventors: Sally FOONG, Sheshasayee GADDAMRAJA, Teoh Lai BENG, Lai Nguk CHIN, Suthakavatin AUNGKUL
  • Chip positioning in multi-chip package
    Patent number: 8901756
    Abstract: Embodiments of the present invention include a substrate package, a method for multi-chip packaging, and a multi-chip package. For example, the substrate package includes a first set of reference markers and a second set of reference markers. The first set of reference markers is disposed on the substrate package, where the first set of reference markers is configured to provide a first alignment for positioning a first integrated circuit (IC) and a second alignment for positioning a second IC on the substrate package. Further, the second set of reference markers is disposed at a different location on the substrate package than the first set of reference markers, where the second set of reference markers is configured to provide confirmation of the first alignment and the second alignment.
    Type: Grant
    Filed: December 21, 2012
    Date of Patent: December 2, 2014
    Assignee: Spansion LLC
    Inventors: Sally Foong, Seshasayee Gaddamraja, Teoh Lai Beng, Lai Nguk Chin, Suthakavatin Aungkul
  • Chip Positioning in Multi-Chip Package
    Publication number: 20140175613
    Abstract: Embodiments of the present invention include a substrate package, a method for multi chip packaging, and a multi-chip package. For example, the substrate package includes a first set of reference markers and a second set of reference markers. The first set of reference markers is disposed on the substrate package, where the first set of reference markers is configured to provide a first alignment for positioning a first integrated circuit (IC) and a second alignment for positioning a second IC on the substrate package. Further, the second set of reference markers is disposed at a different location on the substrate package than the first set of reference markers, where the second set of reference markers is configured to provide confirmation of the first alignment and the second alignment.
    Type: Application
    Filed: December 21, 2012
    Publication date: June 26, 2014
    Applicant: Spansion LLC
    Inventors: Sally FOONG, Seshasayee Gaddamraja, Teoh Lai Beng, Lai Nguk Chin, Suthakavatin Aungkul