Patents by Inventor Suzana Prstic
Suzana Prstic has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11652061Abstract: Embodiments may relate to a microelectronic package that includes a die and a backside metallization (BSM) layer positioned on the face of the die. The BSM layer may include a feature that indicates that the BSM layer was formed on the face of the die by a masked deposition technique. Other embodiments may be described or claimed.Type: GrantFiled: June 17, 2019Date of Patent: May 16, 2023Assignee: Intel CorporationInventors: Shenavia S. Howell, John J. Beatty, Raymond A. Krick, Suzana Prstic
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Patent number: 11004768Abstract: A multi-chip package includes multiple IC die interconnected to a package substrate. An integrated heat spreader (IHS) is located over one or more primary IC die, but is absent from over one or more secondary IC die. Thermal cross-talk between IC dies and/or thermal performance of individual IC dies may be improved by constraining the dimensions of the IHS to be over less than all IC die of the package. A first thermal interface material (TIM) may be between the IHS and the primary IC die, but absent from over the secondary IC die. A second TIM may be between a heat sink and the IHS and also between the heat sink and the secondary IC die. The heat sink may be segmented, or have a non-planarity to accommodate differences in z-height across the IC die and/or as a result of constraining the dimensions of the IHS to be over less than all IC die.Type: GrantFiled: August 1, 2019Date of Patent: May 11, 2021Assignee: Intel CorporationInventors: Muhammad S. Islam, Enisa Harris, Suzana Prstic, Sergio Chan Arguedas, Sachin Deshmukh, Aravindha Antoniswamy, Elah Bozorg-Grayeli
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Publication number: 20210035886Abstract: A multi-chip package includes multiple IC die interconnected to a package substrate. An integrated heat spreader (IHS) is located over one or more primary IC die, but is absent from over one or more secondary IC die. Thermal cross-talk between IC dies and/or thermal performance of individual IC dies may be improved by constraining the dimensions of the IHS to be over less than all IC die of the package. A first thermal interface material (TIM) may be between the IHS and the primary IC die, but absent from over the secondary IC die. A second TIM may be between a heat sink and the IHS and also between the heat sink and the secondary IC die. The heat sink may be segmented, or have a non-planarity to accommodate differences in z-height across the IC die and/or as a result of constraining the dimensions of the IHS to be over less than all IC die.Type: ApplicationFiled: August 1, 2019Publication date: February 4, 2021Applicant: Intel CorporationInventors: Muhammad S. Islam, Enisa Harris, Suzana Prstic, Sergio Chan Arguedas, Sachin Deshmukh, Aravindha Antoniswamy, Elah Bozorg-Grayeli
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Publication number: 20200395307Abstract: Embodiments may relate to a microelectronic package that includes a die and a backside metallization (BSM) layer positioned on the face of the die. The BSM layer may include a feature that indicates that the BSM layer was formed on the face of the die by a masked deposition technique. Other embodiments may be described or claimed.Type: ApplicationFiled: June 17, 2019Publication date: December 17, 2020Applicant: Intel CorporationInventors: Shenavia S. Howell, John J. Beatty, Raymond A. Krick, Suzana Prstic
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Patent number: 10290592Abstract: A semiconductor package includes a semiconductor die arranged on a substrate. The semiconductor package includes a stiffener structure arranged on the substrate. The stiffener structure is spaced at a distance from the semiconductor die. The stiffener structure includes a molding compound material.Type: GrantFiled: June 30, 2017Date of Patent: May 14, 2019Assignee: INTEL CORPORATIONInventors: John J Beatty, Suzana Prstic, Vipul V Mehta
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Publication number: 20190006293Abstract: A semiconductor package includes a semiconductor die arranged on a substrate. The semiconductor package includes a stiffener structure arranged on the substrate. The stiffener structure is spaced at a distance from the semiconductor die. The stiffener structure includes a molding compound material.Type: ApplicationFiled: June 30, 2017Publication date: January 3, 2019Inventors: John J Beatty, Suzana Prstic, Vipul V Mehta
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Patent number: 9799610Abstract: Creating surface variations on a stiffener in a stack reduces inter-stiffener sticking and stiffener stack tilt in pick and place media. The surface variations provide one or more airgaps that reduce inter-stiffener surface contact, provide space for contaminants and/or provide an averaged surface height due to surface roughness.Type: GrantFiled: December 18, 2015Date of Patent: October 24, 2017Assignee: INTEL CORPORATIONInventors: Mingjie Xu, Suzana Prstic, Kedar Dhane
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Publication number: 20170179043Abstract: Creating surface variations on a stiffener in a stack reduces inter-stiffener sticking and stiffener stack tilt in pick and place media. The surface variations provide one or more airgaps that reduce inter-stiffener surface contact, provide space for contaminants and/or provide an averaged surface height due to surface roughness.Type: ApplicationFiled: December 18, 2015Publication date: June 22, 2017Applicant: INTEL CORPORATIONInventors: Mingjie Xu, Suzana Prstic, Kedar Dhane
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Patent number: 8410802Abstract: Systems and methods including testing of electronic components are described. One system relates to a system including a thermal control unit adapted to control the temperature of at least a portion of an electronic component during testing. The system includes at least one conduit extending through a portion of the thermal control unit, the conduit sized to permit the flow of a thermal interface material therethrough, the thermal interface material comprising a liquid. The at least one conduit is positioned so that the thermal interface material can be delivered through the conduit and onto the electronic component. The system also includes a device adapted to control the flow of the thermal interface material through the conduit, wherein the flow can be controlled to deliver the thermal interface material to the electronic component and to remove the thermal interface material from the electronic component. Other embodiments are described and claimed.Type: GrantFiled: December 24, 2009Date of Patent: April 2, 2013Assignee: Intel CorporationInventors: Ashish Gupta, James R. Hastings, Nader N. Abazarnia, Suzana Prstic, Jerome L. Garcia
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Patent number: 7982478Abstract: In some embodiments, a liquid TIM dispense and removal method and assembly is presented. In this regard, a method is introduced including loading an absorbent material of a thermal control unit with a liquid thermal interface material (TIM), pressing the absorbent material against an integrated circuit device causing the liquid TIM to be released, testing the integrated circuit device, and removing the absorbent material from against the integrated circuit device causing the liquid TIM to be reabsorbed. Other embodiments are also disclosed and claimed.Type: GrantFiled: December 29, 2008Date of Patent: July 19, 2011Assignee: Intel CorporationInventors: Nader Abazarnia, Ashish X Gupta, Suzana Prstic
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Publication number: 20110155348Abstract: Systems and methods including testing of electronic components are described. One system relates to a system including a thermal control unit adapted to control the temperature of at least a portion of an electronic component during testing. The system includes at least one conduit extending through a portion of the thermal control unit, the conduit sized to permit the flow of a thermal interface material therethrough, the thermal interface material comprising a liquid. The at least one conduit is positioned so that the thermal interface material can be delivered through the conduit and onto the electronic component. The system also includes a device adapted to control the flow of the thermal interface material through the conduit, wherein the flow can be controlled to deliver the thermal interface material to the electronic component and to remove the thermal interface material from the electronic component. Other embodiments are described and claimed.Type: ApplicationFiled: December 24, 2009Publication date: June 30, 2011Inventors: Ashish GUPTA, James R. Hastings, Nader N. Abazarnia, Suzana Prstic, Jerome L. Garcia
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Publication number: 20100164510Abstract: In some embodiments, a liquid TIM dispense and removal method and assembly is presented. In this regard, a method is introduced including loading an absorbent material of a thermal control unit with a liquid thermal interface material (TIM), pressing the absorbent material against an integrated circuit device causing the liquid TIM to be released, testing the integrated circuit device, and removing the absorbent material from against the integrated circuit device causing the liquid TIM to be reabsorbed. Other embodiments are also disclosed and claimed.Type: ApplicationFiled: December 29, 2008Publication date: July 1, 2010Inventors: Nader Abazarnia, Ashish X. Gupta, Suzana Prstic
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Patent number: 7332423Abstract: One example electronic assembly includes a substrate that has a plurality of contacts which become bonded to a plurality of contacts on a die. The electronic assembly further includes a male member that extends from at least one of the substrate and the die and a female member that extends from the other of the substrate and the die. The male member is inserted into the female member to align the die relative to the substrate. The male member and the female member may have any configuration as long as one or more portions of the male member extend partially, or wholly, into the female member. An example method includes aligning a die relative to a substrate by inserting a male member that extends from one of the die and the substrate into a female member that extends from the other of the die and the substrate.Type: GrantFiled: June 29, 2005Date of Patent: February 19, 2008Assignee: Intel CorporationInventors: Robert Starkston, Sridhar Narasimhan, Chia-Pin Chiu, Suzana Prstic, Patrick N Stover, Hong Xie
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Publication number: 20070001318Abstract: One example electronic assembly includes a substrate that has a plurality of contacts which become bonded to a plurality of contacts on a die. The electronic assembly further includes a male member that extends from at least one of the substrate and the die and a female member that extends from the other of the substrate and the die. The male member is inserted into the female member to align the die relative to the substrate. The male member and the female member may have any configuration as long as one or more portions of the male member extend partially, or wholly, into the female member. An example method includes aligning a die relative to a substrate by inserting a male member that extends from one of the die and the substrate into a female member that extends from the other of the die and the substrate.Type: ApplicationFiled: June 29, 2005Publication date: January 4, 2007Inventors: Robert Starkston, Sridhar Narasimhan, Chia-Pin Chiu, Suzana Prstic, Patrick Stover, Hong Xie
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Publication number: 20050111188Abstract: Embodiments of the present invention include an apparatus, method, and system for an electronic assembly with a thermal management device including a porous medium.Type: ApplicationFiled: November 26, 2003Publication date: May 26, 2005Inventors: Anandaroop Bhattacharya, Ravi Prasher, Jerome Garcia, Suzana Prstic
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Publication number: 20030125637Abstract: Devices and methods for detecting vulnerable plaque within a blood vessel are disclosed. A catheter in accordance with the present invention includes an elongate shaft having a proximal end, a distal end, and an outer surface. At least one temperature sensor is disposed proximate to the distal end of the elongate shaft. In one preferred embodiment, the at least one temperature sensor is adapted to contact inner surface of the blood vessel. In another preferred embodiment, at least one temperature sensor is disposed within a channel defined by a body member that is disposed about the elongate shaft.Type: ApplicationFiled: December 16, 2002Publication date: July 3, 2003Applicant: SciMed Life Systems, Inc., a Minnesota corporationInventors: Jaydeep Y. Kokate, Eric M. DoBrava, Marwane S. Berrada, Scott Kimmel, Suzana Prstic, Michael F. Hoey, Avram Bar-Cohen, Paul A. Iaizzo
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Patent number: 6579243Abstract: Methods and devices for detecting vulnerable plaque within a blood vessel are disclosed. An elongate medical device in accordance with the present invention includes an elongate shaft having a proximal end and a distal end. A substrate is fixed to the elongate shaft proximate the distal end thereof, and a plurality of sensors are disposed on the substrate. Each sensor is preferably coupled to a switching device. The switching devices are preferably disposed on the substrate.Type: GrantFiled: March 1, 2001Date of Patent: June 17, 2003Assignee: SciMed Life Systems, Inc.Inventors: Jaydeep Y. Kokate, Eric M. DoBrava, Suzana Prstic, Scott Kimmell, Marwane S. Berrada, Avram Bar-Cohen, Michael Hoey
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Patent number: 6514214Abstract: Devices and methods for detecting vulnerable plaque within a blood vessel are disclosed. A catheter in accordance with the present invention includes an elongate shaft having a proximal end, a distal end, and an outer surface. At least one temperature sensor is disposed proximate to the distal end of the elongate shaft. In one preferred embodiment, the at least one temperature sensor is adapted to contact an inner surface of the blood vessel. In another preferred embodiment, at least one temperature sensor is disposed within a channel defined by a body member that is disposed about the elongate shaft.Type: GrantFiled: February 13, 2001Date of Patent: February 4, 2003Assignee: SciMed Life Systems, Inc.Inventors: Jaydeep Y. Kokate, Eric M. DoBrava, Marwane S. Berrada, Scott Kimmel, Suzana Prstic, Michael F. Hoey, Avram Bar-Cohen, Paul A. Iaizzo
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Publication number: 20020111560Abstract: Devices and methods for detecting vulnerable plaque within a blood vessel are disclosed. A catheter in accordance with the present invention includes an elongate shaft having a proximal end, a distal end, and an outer surface. At least one temperature sensor is disposed proximate to the distal end of the elongate shaft. In one preferred embodiment, the at least one temperature sensor is adapted to contact inner surface of the blood vessel. In another preferred embodiment, at least one temperature sensor is disposed within a channel defined by a body member that is disposed about the elongate shaft.Type: ApplicationFiled: February 13, 2001Publication date: August 15, 2002Applicant: SciMed Life Systems, Inc.Inventors: Jaydeep Y. Kokate, Eric M. DoBrava, Marwane S. Berrada, Scott Kimmel, Suzana Prstic, Michael F. Hoey, Avram Bar-Cohen, Paul A. Iaizzo
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Publication number: 20010047138Abstract: Methods and devices for detecting vulnerable plaque within a blood vessel are disclosed. An elongate medical device in accordance with the present invention includes an elongate shaft having a proximal end and a distal end. A substrate is fixed to the elongate shaft proximate the distal end thereof, and a plurality of sensors are disposed on the substrate. Each sensor is preferably coupled to a switching device. The switching devices are preferably disposed on the substrate.Type: ApplicationFiled: March 1, 2001Publication date: November 29, 2001Inventors: Jaydeep Y. Kokate, Eric M. DoBrava, Suzana Prstic, Scott Kimmell, Marwane S. Berrada, Avram Bar-Cohen, Michael Hoey