Abstract: A device for transferring semiconductor wafers from a first wafer carrier to a second wafer carrier with each wafer carrier having a pair of grooved sides for receiving and holding a number of vertically spaced wafers in horizontal planes and with each wafer carrier having front and rear openings. The device comprises a base having a flat upper surface. A wall member is secured to and extends upwardly from the surface midway between the sides thereof and near one end of the base. The wall member is spaced above the surface to present a slot for receiving a web forming a part of the wafer carrier as the wafer carrier moves over the surface. The wall member has a vertical end face which enters a wafer carrier as the wafer carrier is moved over the surface, whereby the wall member forces the wafers out of the first wafer carrier and into the second wafer carrier while the wafers remain in horizontal planes and vertically spaced with respect to each other.